Patents by Inventor Helga Hainl

Helga Hainl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor component with contacts situated at the underside, and fabrication method
    Publication number: 20030015774
    Abstract: A semiconductor component has a housing with a first main area and a second main area opposite to the first main area, which surrounds at least one semiconductor chip. The semiconductor chip has a first metallization layer on a first main side. A second main side of the semiconductor chip borders the second main area of the semiconductor component. The first metallization layer of the semiconductor chip is connected via electrical conductors to contacts that are likewise surrounded by the housing and border the second main area. The semiconductor chip furthermore has, on the second main side, a second metallization layer for carrying signals.
    Type: Application
    Filed: August 2, 2002
    Publication date: January 23, 2003
    Inventors: Albert Auburger, Hainz Oswald, Helga Hainl, Dietmar Lang, Rudolf Lehner, Stefan Paulus, Martin Petz, Michael Weber