Abstract: A method for fabricating an integrated semiconductor circuit having at least two different wiring forms realized in a same metallization plane includes drawing each of the different wiring forms on respectively different layer types. In this manner, the at least two different wiring forms can be individually and jointly analyzed.

Abstract: A method of generating an executable file includes subdividing a target name into portions at one or more predetermined points. The method also includes saving at least one portion as a list variable. The method may also include determining if the target name can be further subdivided at one or more delimiters.

Abstract: A tiedown structure including a semiconductor substrate having a chip formed thereon, a kerf region, and a conductive connector forming a connection between the chip and the kerf region. Alternatively, the conductive connector connects an edge seal surrounding the chip and a chip portion. A method for forming a semiconductor structure includes forming a device on a chip, defining a kerf proximate the chip, and forming a conductive connector that connects the device and the kerf. An end of the conductive connector is removed by sawing, etching, or focused ion beam milling. A method for forming a semiconductor structure includes forming a chip on a semiconductor substrate, the chip including a device; forming an edge seal along a perimeter of the chip; and forming a conductive connector that connects the edge seal and the device. A conductive connector portion is removed by etching or focused ion beam milling.

Abstract: A method for fabricating an integrated semiconductor circuit having at least two different wiring forms realized in a same metallization plane includes drawing each of the different wiring forms on respectively different layer types. In this manner, the at least two different wiring forms can be individually and jointly analyzed.