Patents by Inventor Helin Huang

Helin Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11043151
    Abstract: The invention provides a chemical-mechanical polishing composition comprising (a) an abrasive selected from the group consisting of alumina, ceria, titania, zirconia, and combinations thereof, wherein the abrasive is surface-coated with a copolymer comprising a combination of sulfonic acid monomeric units and carboxylic acid monomeric units a combination of sulfonic acid monomeric units and phosphonic acid monomeric units, (b) an oxidizing agent, and (c) water, wherein the polishing composition has a pH of about 2 to about 5. The invention further provides a method of chemically-mechanically polishing a substrate with the inventive chemical-mechanical polishing composition. Typically, the substrate comprises tungsten or cobalt and silicon oxide.
    Type: Grant
    Filed: October 3, 2017
    Date of Patent: June 22, 2021
    Assignee: CMC Materials, Inc.
    Inventors: Ji Cui, Helin Huang, Kevin P. Dockery, Pankaj K. Singh, Hung-Tsung Huang, Chih-Hsien Chien
  • Publication number: 20210017421
    Abstract: The invention relates to a chemical-mechanical polishing composition comprising (a) a first abrasive comprising cationically modified colloidal silica particles, (b) a second abrasive having a Mohs hardness of about 5.5 or more, (c) a cationic polymer, (d) an iron containing activator, (e) an oxidizing agent, and (f) water. The invention also relates to a method of chemically mechanically polishing a substrate, especially a substrate comprising tungsten and barrier layers (e.g., nitrides), with the polishing composition.
    Type: Application
    Filed: July 16, 2019
    Publication date: January 21, 2021
    Inventors: William J. WARD, Matthew E. CARNES, Ji CUI, Helin HUANG
  • Publication number: 20200332150
    Abstract: The invention provides a chemical-mechanical polishing composition comprising (a) an abrasive comprising silica particles and alumina particles, wherein the alumina particles are surface-coated with an anionic polymer, and (b) water. The invention also provides a method of chemically mechanically polishing a substrate, especially a substrate comprising tungsten, silicon oxide, and nitride, with the polishing composition.
    Type: Application
    Filed: April 15, 2020
    Publication date: October 22, 2020
    Inventors: Chih-Hsien CHIEN, Lung-Tai LU, Hung-Tsung HUANG, Helin HUANG
  • Patent number: 10522341
    Abstract: Described is a post-CMP cleaning solution and methods useful to remove residue from a CMP substrate or to prevent formation of residue on a surface of a CMP substrate.
    Type: Grant
    Filed: November 29, 2017
    Date of Patent: December 31, 2019
    Assignee: Cabot Microelectronics Corporation
    Inventors: Helin Huang, Ji Cui
  • Publication number: 20190100677
    Abstract: The invention provides a chemical-mechanical polishing composition comprising (a) an abrasive selected from the group consisting of alumina, ceria, titania, zirconia, and combinations thereof, wherein the abrasive is surface-coated with a copolymer comprising a combination of sulfonic acid monomeric units and carboxylic acid monomeric units a combination of sulfonic acid monomeric units and phosphonic acid monomeric units, (b) an oxidizing agent, and (c) water, wherein the polishing composition has a pH of about 2 to about 5. The invention further provides a method of chemically-mechanically polishing a substrate with the inventive chemical-mechanical polishing composition. Typically, the substrate comprises tungsten or cobalt and silicon oxide.
    Type: Application
    Filed: October 3, 2017
    Publication date: April 4, 2019
    Inventors: Ji CUI, Helin HUANG, Kevin P. DOCKERY, Pankaj K. SINGH, Hung-Tsung HUANG, Chih-Hsien CHIEN
  • Patent number: 10066126
    Abstract: Described are compositions (e.g., slurries) useful in methods for chemical-mechanical processing (e.g. polishing or planarizing) a surface of a substrate that contains tungsten, the slurries containing abrasive particles, metal cation catalyst, phosphorus-containing zwitterionic compound, and optional ingredients such as oxidizer; also described are methods and substrates used or processed on combination with the compositions.
    Type: Grant
    Filed: January 6, 2016
    Date of Patent: September 4, 2018
    Assignee: Cabot Microelectronics Corporation
    Inventors: Kevin P. Dockery, Helin Huang, Matthew Carnes, Glenn Whitener
  • Publication number: 20180166273
    Abstract: Described is a post-CMP cleaning solution and methods useful to remove residue from a CMP substrate or to prevent formation of residue on a surface of a CMP substrate.
    Type: Application
    Filed: November 29, 2017
    Publication date: June 14, 2018
    Inventors: Helin HUANG, Ji CUI
  • Patent number: 9771496
    Abstract: Described are chemical-mechanical polishing compositions (e.g., slurries) and methods of using the slurries for chemical-mechanical polishing (or planarizing) a surface of a substrate that contains tungsten, the compositions containing cationic surfactant and cyclodextrin.
    Type: Grant
    Filed: October 28, 2015
    Date of Patent: September 26, 2017
    Assignee: Cabot Microelectronics Corporation
    Inventors: Kevin Dockery, Helin Huang, Lin Fu, Tina Li
  • Publication number: 20170190936
    Abstract: Described are compositions (e.g., slurries) useful in methods for chemical-mechanical processing (e.g. polishing or planarizing) a surface of a substrate that contains tungsten, the slurries containing abrasive particles, metal cation catalyst, phosphorus-containing zwitterionic compound, and optional ingredients such as oxidizer; also described are methods and substrates used or processed on combination with the compositions.
    Type: Application
    Filed: January 6, 2016
    Publication date: July 6, 2017
    Inventors: Kevin P. Dockery, Helin Huang, Matthew Carnes, Glenn Whitener
  • Publication number: 20170121560
    Abstract: Described are chemical-mechanical polishing compositions (e.g., slurries) and methods of using the slurries for chemical-mechanical polishing (or planarizing) a surface of a substrate that contains tungsten, the compositions containing cationic surfactant and cyclodextrin.
    Type: Application
    Filed: October 28, 2015
    Publication date: May 4, 2017
    Inventors: Kevin DOCKERY, Helin HUANG, Lin FU, Tina LI
  • Publication number: 20170121561
    Abstract: Described are chemical mechanical polishing compositions and methods of using the compositions for planarizing a surface of a substrate that contains tungsten, the compositions containing silica abrasive particles and cationic surfactant.
    Type: Application
    Filed: October 28, 2015
    Publication date: May 4, 2017
    Inventors: Kevin DOCKERY, Helin HUANG, Lin FU
  • Patent number: 9631122
    Abstract: Described are chemical mechanical polishing compositions and methods of using the compositions for planarizing a surface of a substrate that contains tungsten, the compositions containing silica abrasive particles and cationic surfactant.
    Type: Grant
    Filed: October 28, 2015
    Date of Patent: April 25, 2017
    Assignee: Cabot Microelectronics Corporation
    Inventors: Kevin Dockery, Helin Huang, Lin Fu
  • Publication number: 20150118760
    Abstract: A fluorescence-based sensor can comprise a nanofiber mass of nanofibers having tubular morphology and a fluorescence detector, where fluorescence of the nanofibers decreases upon contact with a nitro-containing compound. The nanofibers can comprise carbazole-cornered, arylene-ethynylene tetracyclic macromolecules of formula I: where R1-R4 are alkyl-containing groups. The tubular morphology allows for highly selective detection of trinitrotoluene over other nitro-based compounds and oxidizing organic compounds.
    Type: Application
    Filed: August 8, 2012
    Publication date: April 30, 2015
    Inventors: Ling Zang, Yanke Che, Helin Huang