Patents by Inventor Helin Lin

Helin Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11436176
    Abstract: A semiconductor integrated circuit includes a central processing unit, a hardware function block that outputs a plurality of hardware signals to be transmitted to an external device independently of the central processing unit, a virtual general purpose input/output (GPIO) finite state machine that transforms the plurality of hardware signals to a virtual GPIO payload, and an I3C communication block that transmits the virtual GPIO payload to the external device through a serial data line and a serial clock line.
    Type: Grant
    Filed: January 6, 2020
    Date of Patent: September 6, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kyungsoo Lee, Jaewon Lee, Junho Huh, Helin Lin
  • Publication number: 20200242066
    Abstract: A semiconductor integrated circuit includes a central processing unit, a hardware function block that outputs a plurality of hardware signals to be transmitted to an external device independently of the central processing unit, a virtual general purpose input/output (GPIO) finite state machine that transforms the plurality of hardware signals to a virtual GPIO payload, and an I3C communication block that transmits the virtual GPIO payload to the external device through a serial data line and a serial clock line.
    Type: Application
    Filed: January 6, 2020
    Publication date: July 30, 2020
    Inventors: KYUNGSOO LEE, JAEWON LEE, JUNHO HUH, HELIN LIN
  • Patent number: D740926
    Type: Grant
    Filed: December 30, 2014
    Date of Patent: October 13, 2015
    Inventor: Helin Lin
  • Patent number: D769530
    Type: Grant
    Filed: June 4, 2015
    Date of Patent: October 18, 2016
    Inventor: Helin Lin