Patents by Inventor Helinda NOMINANDA
Helinda NOMINANDA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11940682Abstract: Embodiments described and discussed herein generally relate to flexible or foldable display devices, and more specifically to flexible cover lens assemblies. In one or more embodiments, a flexible cover lens assembly contains a glass layer, an adhesion promotion layer on the glass layer, an anti-reflectance layer disposed on the adhesion promotion layer, a dry hardcoat layer having a nano-indentation hardness in a range from about 1 GPa to about 5 GPa and disposed on the anti-reflectance layer, and an anti-fingerprint coating layer disposed on the dry hardcoat layer.Type: GrantFiled: June 16, 2020Date of Patent: March 26, 2024Assignee: APPLIED MATERIALS, INC.Inventors: Manivannan Thothadri, Harvey You, Helinda Nominanda, Neil Morrison, Daniel Paul Forster, Arvinder Chadha
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Patent number: 11940683Abstract: Embodiments described and discussed herein generally relate to flexible or foldable display devices, and more specifically to flexible cover lens assemblies. In one or more embodiments, a flexible cover lens assembly contains a substrate, an anti-fingerprint coating layer, and an adhesion promotion layer disposed between the substrate and the anti-fingerprint coating layer.Type: GrantFiled: June 16, 2020Date of Patent: March 26, 2024Assignee: APPLIED MATERIALS, INC.Inventors: Manivannan Thothadri, Harvey You, Helinda Nominanda, Neil Morrison, Daniel Paul Forster, Arvinder Chadha
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Patent number: 11934056Abstract: Embodiments described and discussed herein generally relate to flexible or foldable display devices, and more specifically to flexible cover lens assemblies. In one or more embodiments, a flexible cover lens assembly contains a glass layer, an adhesion promotion layer disposed on the glass layer, a dry hardcoat layer having a nano-indentation hardness in a range from about 1 GPa to about 5 GPa and disposed on the adhesion promotion layer and an anti-fingerprint coating layer disposed on the dry hardcoat layer.Type: GrantFiled: June 16, 2020Date of Patent: March 19, 2024Assignee: APPLIED MATERIALS, INC.Inventors: Manivannan Thothadri, Harvey You, Helinda Nominanda, Neil Morrison, Daniel Paul Forster, Arvinder Chadha
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Publication number: 20240019606Abstract: Implementations of the present disclosure relate to methods, and related apparatus and devices, of forming flexible cover lens structures for flexible or foldable display devices. In one or more implementations, one or more adhesion promotion layers are deposited above at least one wet hardcoat layer of a substrate structure. A dry hardcoat layer is deposited above the one or more adhesion promotion layers using a dry deposition process that includes plasma enhanced chemical vapor deposition (PECVD). An anti-smudge layer is deposited above the dry hardcoat layer. Each of the one or more adhesion promotion layers, the dry hardcoat layer, and the anti-smudge layer is deposited at a process temperature that is less than 80 degrees Celsius.Type: ApplicationFiled: July 13, 2022Publication date: January 18, 2024Inventors: Helinda NOMINANDA, Tae Kyung WON, Han NGUYEN, Seong Ho YOO, Soo Young CHOI
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Patent number: 11789300Abstract: Embodiments described and discussed herein generally relate to flexible or foldable display devices, and more specifically to flexible cover lens assemblies. In one or more embodiments, a flexible cover lens assembly contains a glass layer, an impact absorption layer disposed on the glass layer, a moisture barrier layer disposed on the impact absorption layer, a substrate disposed on the moisture barrier layer, a wet hardcoat layer having a nano-indentation hardness in a range from about 0.4 GPa to about 1.5 GPa and disposed on the substrate, an adhesion promotion layer disposed on the wet hardcoat layer, an anti-reflectance layer disposed on the adhesion promotion layer, a dry hardcoat layer having a nano-indentation hardness in a range from about 1 GPa to about 5 GPa and disposed on the anti-reflectance layer, and an anti-fingerprint coating layer disposed on the dry hardcoat layer.Type: GrantFiled: June 16, 2020Date of Patent: October 17, 2023Assignee: APPLIED MATERIALS, INC.Inventors: Manivannan Thothadri, Harvey You, Helinda Nominanda, Neil Morrison, Daniel Paul Forster, Arvinder Chadha
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Publication number: 20200408957Abstract: Embodiments described and discussed herein generally relate to flexible or foldable display devices, and more specifically to flexible cover lens assemblies. In one or more embodiments, a flexible cover lens assembly contains a glass layer, an adhesion promotion layer disposed on the glass layer, a dry hardcoat layer having a nano-indentation hardness in a range from about 1 GPa to about 5 GPa and disposed on the adhesion promotion layer and an anti-fingerprint coating layer disposed on the dry hardcoat layer.Type: ApplicationFiled: June 16, 2020Publication date: December 31, 2020Inventors: Manivannan THOTHADRI, Harvey YOU, Helinda NOMINANDA, Neil MORRISON, Daniel Paul FORSTER, Arvinder CHADHA
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Publication number: 20200410208Abstract: Embodiments described and discussed herein generally relate to flexible or foldable display devices, and more specifically to flexible cover lens assemblies. In one or more embodiments, a flexible cover lens assembly contains a substrate, an anti-fingerprint coating layer, and an adhesion promotion layer disposed between the substrate and the anti-fingerprint coating layer.Type: ApplicationFiled: June 16, 2020Publication date: December 31, 2020Inventors: Manivannan THOTHADRI, Harvey YOU, Helinda NOMINANDA, Neil MORRISON, Daniel Paul FORSTER, Arvinder CHADHA
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Publication number: 20200408956Abstract: Embodiments described and discussed herein generally relate to flexible or foldable display devices, and more specifically to flexible cover lens assemblies. In one or more embodiments, a flexible cover lens assembly contains a glass layer, an adhesion promotion layer on the glass layer, an anti-reflectance layer disposed on the adhesion promotion layer, a dry hardcoat layer having a nano-indentation hardness in a range from about 1 GPa to about 5 GPa and disposed on the anti-reflectance layer, and an anti-fingerprint coating layer disposed on the dry hardcoat layer.Type: ApplicationFiled: June 16, 2020Publication date: December 31, 2020Inventors: Manivannan THOTHADRI, Harvey YOU, Helinda NOMINANDA, Neil MORRISON, Daniel Paul FORSTER, Arvinder CHADHA
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Publication number: 20200408961Abstract: Embodiments described and discussed herein generally relate to flexible or foldable display devices, and more specifically to flexible cover lens assemblies. In one or more embodiments, a flexible cover lens assembly contains a glass layer, an impact absorption layer disposed on the glass layer, a moisture barrier layer disposed on the impact absorption layer, a substrate disposed on the moisture barrier layer, a wet hardcoat layer having a nano-indentation hardness in a range from about 0.4 GPa to about 1.5 GPa and disposed on the substrate, an adhesion promotion layer disposed on the wet hardcoat layer, an anti-reflectance layer disposed on the adhesion promotion layer, a dry hardcoat layer having a nano-indentation hardness in a range from about 1 GPa to about 5 GPa and disposed on the anti-reflectance layer, and an anti-fingerprint coating layer disposed on the dry hardcoat layer.Type: ApplicationFiled: June 16, 2020Publication date: December 31, 2020Inventors: Manivannan THOTHADRI, Harvey YOU, Helinda NOMINANDA, Neil MORRISON, Daniel Paul FORSTER, Arvinder CHADHA
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Publication number: 20190109300Abstract: Methods of forming a thin film encapsulation (TFE) structure over an organic light emitting diode (OLED) device are provided herein. In one embodiment, the method includes depositing a fluorinated plasma-polymerized hexmethyldisiloxane (PP-HMDSO:F) buffer layer over a patterned substrate. The (PP-HMDSO:F) buffer layer is formed using precursor gases comprising HMDSO, NF3, N2O, and N2. The method provides for superior planarization and reduced particulate contamination than processes where the precursor gas comprises SiF4.Type: ApplicationFiled: October 10, 2017Publication date: April 11, 2019Inventors: Helinda NOMINANDA, Jrjyan Jerry CHEN
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Publication number: 20170250370Abstract: Embodiments of the disclosure provide interface integration and adhesion improvement methods used on a transparent substrate for OLED or thin film transistor applications. In one embodiment, a method of enhancing interface adhesion and integration in a film structure disposed on a substrate includes performing a plasma treatment process on an inorganic layer disposed on a substrate in a processing chamber to form a treated layer on the substrate, wherein the substrate includes an OLED structure, controlling a substrate temperature less than about 100 degrees Celsius, and forming an organic layer on the treated layer. Furthermore, an encapsulating structure for OLED applications includes an inorganic layer formed on an OLED structure on a substrate, an electron beam treated layer formed on the inorganic layer, and an organic layer formed on the electron beam treated layer.Type: ApplicationFiled: February 26, 2016Publication date: August 31, 2017Inventors: Jrjyan Jerry CHEN, Soo Young CHOI, Helinda NOMINANDA, Wen-Hao WU
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Patent number: 8883269Abstract: A method of processing a substrate in a processing chamber is provided. The method generally includes applying a microwave power to an antenna coupled to a microwave source disposed within the processing chamber, wherein the microwave source is disposed relatively above a gas feeding source configured to provide a gas distribution coverage covering substantially an entire surface of the substrate, and exposing the substrate to a microwave plasma generated from a processing gas provided by the gas feeding source to deposit a silicon-containing layer on the substrate at a temperature lower than about 200 degrees Celsius, the microwave plasma using a microwave power having a power density of about 500 milliWatts/cm2 to about 5,000 milliWatts/cm2 at a frequency of about 1 GHz to about 10 GHz.Type: GrantFiled: December 20, 2011Date of Patent: November 11, 2014Assignee: Applied Materials, Inc.Inventors: Tae Kyung Won, Helinda Nominanda, Seon-Mee Cho, Soo Young Choi, Beom Soo Park, John M. White, Suhail Anwar, Jozef Kudela
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Publication number: 20120279943Abstract: A method and apparatus for processing a substrate is provided. In one embodiment, the apparatus is in the form of a processing chamber that includes a chamber body having a processing volume defined therein. A substrate support, a gas delivery tube assembly and a plasma line source are disposed in the processing volume. The gas delivery tube assembly includes an inner tube is disposed in an outer tube. The inner tube has a passage for flowing a cooling fluid therein. The outer tube has a plurality of gas distribution apertures for providing processing gas into the processing volume.Type: ApplicationFiled: May 3, 2012Publication date: November 8, 2012Applicant: Applied Materials, Inc.Inventors: Helinda Nominanda, Tae Kyung Won, Seon-Mee Cho, Beom Soo Park, Soo Young Choi
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Publication number: 20120171391Abstract: Embodiments of the present invention generally provide deposition processes for a silicon-containing dielectric layer using an improved microwave-assisted CVD chamber. In one embodiment, a method of processing a substrate in a processing chamber is provided. The method generally includes applying a microwave power to an antenna coupled to a microwave source disposed within the processing chamber, wherein the microwave source is disposed relatively above a gas feeding source configured to provide a gas distribution coverage covering substantially an entire surface of the substrate, and exposing the substrate to a microwave plasma generated from a processing gas provided by the gas feeding source to deposit a silicon-containing layer on the substrate at a temperature lower than about 200 degrees Celsius, the microwave plasma using a microwave power of about 500 milliWatts/cm2 to about 5,000 milliWatts/cm2 at a frequency of about 1 GHz to about 10 GHz.Type: ApplicationFiled: December 20, 2011Publication date: July 5, 2012Applicant: APPLIED MATERIALS, INC.Inventors: Tae Kyung WON, Helinda NOMINANDA, Seon-Mee CHO, Soo Young CHOI, Beom Soo PARK, John M. WHITE, Suhail ANWAR, Jozef KUDELA