Patents by Inventor Helio Takai

Helio Takai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High-data throughput reconfigurable computing platform
    Patent number: 11860815
    Abstract: A reconfigurable computing platform includes a reconfigurable computing device, electro-optical transceiver, and first voltage converter disposed on a multilayer board. The electro-optical transceiver converts an optical signal at least one of to and from an electrical signal, and the electrical signal is operatively coupled to the reconfigurable computing device. The electro-optical transceiver is disposed in proximity to the reconfigurable computing device, and the first voltage converter is operatively coupled to a common voltage distributed around a periphery of the multilayer board. The first voltage converter converts the common voltage to a first operating voltage, and the first voltage converter is disposed in proximity to the reconfigurable computing device. The first operating voltage is provided to the reconfigurable computing device as a first power source.
    Type: Grant
    Filed: October 4, 2019
    Date of Patent: January 2, 2024
    Assignee: Brookhaven Science Associates, LLC
    Inventors: Shaochun Tang, Michael Begel, Hucheng Chen, Helio Takai, Francesco Lanni
  • High-Data Throughput Reconfigurable Computing Platform
    Publication number: 20210397580
    Abstract: A reconfigurable computing platform includes a reconfigurable computing device, electro-optical transceiver, and first voltage converter disposed on a multilayer board. The electro-optical transceiver converts an optical signal at least one of to and from an electrical signal, and the electrical signal is operatively coupled to the reconfigurable computing device. The electro-optical transceiver is disposed in proximity to the reconfigurable computing device, and the first voltage converter is operatively coupled to a common voltage distributed around a periphery of the multilayer board. The first voltage converter converts the common voltage to a first operating voltage, and the first voltage converter is disposed in proximity to the reconfigurable computing device. The first operating voltage is provided to the reconfigurable computing device as a first power source.
    Type: Application
    Filed: October 4, 2019
    Publication date: December 23, 2021
    Applicant: Brookhaven Science Associates, LLC
    Inventors: Shaochun Tang, Michael Begel, Hucheng Chen, Helio Takai, Francesco Lanni