Abstract: A method for fabricating a radio-frequency (RF) module is disclosed, the method including forming or providing a first assembly that includes a packaging substrate and an RF component mounted thereon, the first assembly further including one or more shielding-wirebonds formed relative to the RF component, forming an overmold over the packaging substrate to substantially encapsulate the RF component and the one or more shielding-wirebonds, the overmold formed by compression molding, and forming a conductive layer on an upper surface of the overmold such that the conductive layer is in electrical contact with some or all of the shielding-wirebonds.

Abstract: A method for fabricating a radio-frequency (RF) module is disclosed, the method including forming or providing a first assembly that includes a packaging substrate and an RF component mounted thereon, the first assembly further including one or more shielding-wirebonds formed relative to the RF component, forming an overmold over the packaging substrate to substantially encapsulate the RF component and the one or more shielding-wirebonds, the overmold formed by compression molding, and forming a conductive layer on an upper surface of the overmold such that the conductive layer is in electrical contact with some or all of the shielding-wirebonds.

Abstract: A method for fabricating a radio-frequency (RF) module is disclosed, the method including forming or providing a first assembly that includes a packaging substrate and an RF component mounted thereon, the first assembly further including one or more shielding-wirebonds formed relative to the RF component, and forming an overmold over the packaging substrate to substantially encapsulate the RF component and the one or more shielding-wirebonds, the overmold formed by compression molding that includes reducing a volume of melted resin in a direction having a component perpendicular to a plane defined by the packaging substrate.

Abstract: A method for fabricating a radio-frequency (RF) module is disclosed, the method including forming or providing a first assembly that includes a packaging substrate and an RF component mounted thereon, the first assembly further including one or more shielding-wirebonds formed relative to the RF component, and forming an overmold over the packaging substrate to substantially encapsulate the RF component and the one or more shielding-wirebonds, the overmold formed by compression molding that includes reducing a volume of melted resin in a direction having a component perpendicular to a plane defined by the packaging substrate.

Abstract: A method for fabricating a radio-frequency (RF) module is disclosed, the method including forming or providing a first assembly that includes a packaging substrate and an RF component mounted thereon, the first assembly further including one or more shielding-wirebonds formed relative to the RF component, and forming an overmold over the packaging substrate to substantially encapsulate the RF component and the one or more shielding-wirebonds, the overmold formed by compression molding that includes reducing a volume of melted resin in a direction having a component perpendicular to a plane defined by the packaging substrate.

Abstract: A method for fabricating a radio-frequency (RF) module is disclosed, the method including forming or providing a first assembly that includes a packaging substrate and an RF component mounted thereon, the first assembly further including one or more shielding-wirebonds formed relative to the RF component, and forming an overmold over the packaging substrate to substantially encapsulate the RF component and the one or more shielding-wirebonds, the overmold formed by compression molding that includes reducing a volume of melted resin in a direction having a component perpendicular to a plane defined by the packaging substrate.

Abstract: Disclosed are systems and methods related to cleaning during manufacture of radio-frequency (RF) modules. Such modules can be manufactured in an array on a panel. At one or more stages, it can be desirable to perform cleaning operations for such panels. In some embodiments, a cleaning system can include a first belt transport apparatus configured to support a first surface of the panel and move the panel during a cleaning process. The cleaning system can further include a second belt transport apparatus configured to engage a second surface of the panel to keep the panel on the first belt transport apparatus during the cleaning process. At least the second belt transport apparatus can include a mesh, with the mesh having a coating configured to reduce the likelihood of damage to the second surface of the panel and to provide desired electrostatic discharge protection for the panel.

Abstract: Disclosed are systems and methods related to removal of materials by techniques such as ablation during manufacture of radio-frequency (RF) modules. Such modules can be manufactured in an array on a panel, and an overmold structure can be formed on the panel. In some situations, it can be desirable to remove a portion of an upper surface of the overmold to, for example, better expose upper portions of shielding wirebonds. In some embodiments, an ablation system can include a blasting apparatus configured to provide a stream of ablating particles to a blasting region. A first transport section that moves a panel through the blasting region can be separate from a second transport section that feeds or removes the panel to or from the first transport section. Such a configuration can substantially isolate the second transport section from the stream of ablating particles.