Abstract: Methods for making multiple walled nested coaxial nanostructures and devices incorporating the coaxial nanostructures are disclosed. The coaxial nanostructures include an inner nanostructure, a first outer nanotube disposed around the inner nanostructure, and a first annular channel between the inner nanostructure and the first outer nanotube. The coaxial nanostructures have extremely high aspect ratios, ranging from about 5 to about 1,200, or about 300 to about 1200.

Abstract: Multiple walled nested coaxial nanostructures, methods for making multiple walled nested coaxial nanostructures, and devices incorporating the coaxial nanostructures are disclosed. The coaxial nanostructures include an inner nanostructure, a first outer nanotube disposed around the inner nanostructure, and a first annular channel between the inner nanostructure and the first outer nanotube. The coaxial nanostructures have extremely high aspect ratios, ranging from about 5 to about 1,200, or about 300 to about 1200.

Abstract: A variety of article and systems including wound care systems, methods for making the wound care systems, bactericidal, and methods for treating wounds using these systems are disclosed. The wound care systems may include a first material comprising one or more fibers or porous media. The one or more fibers or porous media may be coated with a second material that is capable of inhibiting the growth of bacteria and killing the bacteria to render the wound care system sterile, increasing the absorbency of the first material, or both upon exposure to light. The first material may be cotton, or any suitable fibrous material, the second material may be TiO2, and the light may be UV or visible light. A variety of methods including ALD may be used to coat the first material.

Abstract: A device construct for lighting and display applications is fabricated from a substrate, a deposited phosphor layer over the substrate, and a layer of thermal and electrically-conductive luminescent material over the deposited layer. The layer of thermal and electrically-conductive luminescent material is a thin film that conforms to the morphology of the phosphor layer. The device is fabricated by providing a substrate, depositing a thin layer of phosphor powder on the substrate by any technique, and coating the phosphor layer with a layer of thermal and electrically-conductive luminescent material by atomic layer deposition.

Abstract: Electroosmotic (EO) devices are provided which are not subject to mechanical wear and tear and with no moving parts, and having improved flow rates and electrical properties. Atomic layer deposition can be used to prepare three electrical terminal active zeta potential modulated EO devices from porous membranes. First, second, and further thin layers of materials can be formed with the pores. Thus, embedded electrodes can be formed along the length of the pores. The zeta potential in the pores can be modified by use of a voltage potential applied the embedded electrode, thereby achieving active control of surface zeta potential within the pores and active control of flow through the pores.

Abstract: Multiple walled nested coaxial nanostructures, methods for making multiple walled nested coaxial nanostructures, and devices incorporating the coaxial nanostructures are disclosed. The coaxial nanostructures include an inner nanostructure, a first outer nanotube disposed around the inner nanostructure, and a first annular channel between the inner nanostructure and the first outer nanotube. The coaxial nanostructures have extremely high aspect ratios, ranging from about 5 to about 1,200, or about 300 to about 1200.

Abstract: Devices including photovoltaic cells and methods of manufacture are disclosed. A photovoltaic cell includes a first electrode layer, at least one photoactive layer disposed on first electrode layer, a second electrode layer disposed on the photoactive layer, at least one first carrier collector structure with a first work function electrically coupled to the first electrode layer and extending partially in to the photoactive layer, and at least one second carrier collector structure with a second work function electrically coupled to the second electrode layer and extending partially into the photoactive layer. In the cell, the first carrier collector structure extends towards the second electrode layer without physically contacting the second carrier collector structure, and the second carrier collector structure extends towards the first electrode layer without physically contacting the first carrier collector structure.

Abstract: A variety of article and systems including wound care systems, methods for making the wound care systems, bactericidal, and methods for treating wounds using these systems are disclosed. The wound care systems may include a first material comprising one or more fibers or porous media. The one or more fibers or porous media may be coated with a second material that is capable of inhibiting the growth of bacteria and killing the bacteria to render the wound care system sterile, increasing the absorbency of the first material, or both upon exposure to light. The first material may be cotton, or any suitable fibrous material, the second material may be TiO2, and the light may be UV or visible light. A variety of methods including ALD may be used to coat the first material.

Abstract: A method is provided for nondestructive measurement of minority carrier diffusion (Lp) length and accordingly minority carrier lifetime (Óp) in a semiconductor device. The method includes the steps of: reverse biasing a semiconductor device under test, scanning a focused beam of radiant energy along a length of the semiconductor device, detecting current induced in the DUT by the beam as it passes point-by-point along a length of the DUT, detecting current induced in the semiconductor device by the beam as it passes point-by-point along the scanned length of the semiconductor device to generate a signal waveform (Isignal), and determining from the Isignal waveform minority carrier diffusion length (Lp) and/or minority carrier lifetime (Óp) in the semiconductor device.

Abstract: A method is provided for determining dopant impurity concentration ND in certain semiconductor devices, such as high voltage lateral double diffused metal oxide semiconductor (HV LDMOS) transistors. Such a device is scanned along its length by a beam of radiant energy (e.g., a laser beam focused through a microscope onto the device) while the device is reverse biased by a voltage V. A resulting beam induced current signal measures a depletion width W, for a given bias voltage V, the widths W increasing with increasing bias voltages V. From a series of respective voltages V and widths W a profile of corresponding dopant concentrations ND is determined using a suitable mathematical algorithm.

Abstract: A silicon-on-insulator material is formed by a method which includes the steps of forming a p-type silicon epitaxial layer, doped with boron and a higher concentration of germanium, on the surface of a semiconductor silicon substrate, forming an additional silicon epitaxial layer on the p-type silicon epitaxial layer, forming an oxide layer on the additional silicon epitaxial layer, forming an oxide layer on another semiconductor silicon substrate, forming a laminate by bringing into contact, at room temperature, the oxide layers thereby bonding together the substrates, etching the silicon substrate provided with the silicon epitaxial layers, with an isotropic etch to remove most of this silicon substrate, exposing the laminate to an anisotropic etch for this silicon substrate until the remainder of this silicon substrate is removed but only a part of the p-type epitaxial layer is removed and then exposing the resultant structure to an additional isotropic etch for the p-type epitaxial layer for a time suffic

Abstract: An improved technique for forming silicon-on insulator films for use in integrated circuits. The technique provides an improved encapsulation layer to enable in a reproducible way the zone melt recrystallization of such films. The encapsulation layer consists of a first layer of a doped SiO.sub.2 (silicate glass) on which a further layer of Si.sub.3 N.sub.4 is deposited. The doped SiO.sub.2 forms a fusible glassy material which is rendered semi-liquid and flows at the temperatures used in recrystallization. The softening of the encapsulation material accommodates volume expansion and eliminates the biaxial stresses in the layered structure. The Si.sub.3 N.sub.4 layer adds mechanical strength to the SiO.sub.2 layer and improves the wetting angle.

Abstract: A monocrystalline layer of silicon is formed on an insulating substrate according to the present invention by use of a semi-insulating layer between the insulator and silicon film. This semi-insulating layer is composed of a mixture of silicon crystallites embedded in a silicon dioxide glass, for example. Such a technique results in a structure which is substantially free of cracking resulting from differences in thermal expansion coefficients between the insulating substrate and the monocrystalline silicon layer.