Patents by Inventor Helmut Bumberger

Helmut Bumberger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230194569
    Abstract: A wafer probe test system has a conductive needle configured to contact a conductive feature on a surface of a wafer, and a fluid probe having a multichannel tube, the fluid probe configured to engage the surface of the wafer to form a fluidic seal between a sensor face on the surface of the wafer and the conductive feature of the wafer, the multichannel tube having a first channel and a second channel configured to create a flow of fluid across the sensor face on the surface of the wafer.
    Type: Application
    Filed: April 30, 2022
    Publication date: June 22, 2023
    Inventors: Sebastian Meier, Helmut Bumberger, Heinrich Wachinger