Patents by Inventor Helmut Dorfler

Helmut Dorfler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Circuit carrier, in particular printed circuit board
    Patent number: 6605778
    Abstract: A circuit carrier (2) (printed circuit board 2) has two metallic outer layers (13, 14) and at least one metallic intermediate layer (11, 12). Insulating layers (8, 9) are arranged between the outer layers (13, 14) and the intermediate layer (11, 12). A component (3, 5) to be cooled and a cooling element (6, 7) are arranged on the outer layers (13, 14). The cooling element (6, 7) is thermally coupled to the component (3, 5) to be cooled via a heat conducting path. The heat conducting path runs partly in the intermediate layer (11, 12). Heat is transferred transversely in said path.
    Type: Grant
    Filed: October 2, 2001
    Date of Patent: August 12, 2003
    Assignee: Siemens Aktiengesellschaft
    Inventors: Helmut Dörfler, Heiko Mueller, Sebastian Raith
  • Circuit carrier, in particular printed circuit board
    Publication number: 20020047193
    Abstract: A circuit carrier (2) (printed circuit board 2) has two metallic outer layers (13, 14) and at least one metallic intermediate layer (11, 12). Insulating layers (8, 9) are arranged between the outer layers (13, 14) and the intermediate layer (11, 12). A component (3, 5) to be cooled and a cooling element (6, 7) are arranged on the outer layers (13, 14). The cooling element (6, 7) is thermally coupled to the component (3, 5) to be cooled via a heat conducting path. The heat conducting path runs partly in the intermediate layer (11, 12). Heat is transferred transversely in said path.
    Type: Application
    Filed: October 2, 2001
    Publication date: April 25, 2002
    Inventors: Helmut Dorfler, Heiko Mueller, Sebastian Raith