Abstract: A packaged electronic device includes a flexible circuit structure and a die. The flexible circuit structure includes a first structural layer and electrical conductors. The die is bonded to the flexible circuit structure by a flexible attachment layer. The die includes interconnects in electrical contact with die circuitry and extending through the die, through the flexible attachment layer, and into electrical contact with respective electrical conductors at first ends. A flexible second structural layer is disposed on the die and exposed portions of the electrical conductors, wherein the die and the electrical conductors are encapsulated by the first structural layer and the second structural layer. The first structural layer and/or the second structural layer include a plurality of openings defining respective exposed areas on the electrical conductors at second ends.

Abstract: A packaged electronic device includes a flexible circuit structure and a die. The flexible circuit structure includes a first structural layer and electrical conductors. The die is bonded to the flexible circuit structure by a flexible attachment layer. The die includes interconnects in electrical contact with die circuitry and extending through the die, through the flexible attachment layer, and into electrical contact with respective electrical conductors at first ends. A flexible second structural layer is disposed on the die and exposed portions of the electrical conductors, wherein the die and the electrical conductors are encapsulated by the first structural layer and the second structural layer. The first structural layer and/or the second structural layer include a plurality of openings defining respective exposed areas on the electrical conductors at second ends.

Abstract: A packaged electronic device includes a flexible circuit structure and a die. The flexible circuit structure includes a first structural layer and electrical conductors. The die is bonded to the flexible circuit structure by a flexible attachment layer. The die includes interconnects in electrical contact with die circuitry and extending through the die, through the flexible attachment layer, and into electrical contact with respective electrical conductors at first ends. A flexible second structural layer is disposed on the die and exposed portions of the electrical conductors, wherein the die and the electrical conductors are encapsulated by the first structural layer and the second structural layer. The first structural layer and/or the second structural layer include a plurality of openings defining respective exposed areas on the electrical conductors at second ends.

Abstract: A packaged electronic device includes a flexible circuit structure and a die. The flexible circuit structure includes a first structural layer and electrical conductors. The die is bonded to the flexible circuit structure by a flexible attachment layer. The die includes interconnects in electrical contact with die circuitry and extending through the die, through the flexible attachment layer, and into electrical contact with respective electrical conductors at first ends. A flexible second structural layer is disposed on the die and exposed portions of the electrical conductors, wherein the die and the electrical conductors are encapsulated by the first structural layer and the second structural layer. The first structural layer and/or the second structural layer include a plurality of openings defining respective exposed areas on the electrical conductors at second ends.

Abstract: A packaged electronic device includes a die, a flexible circuit structure, and a barrier film disposed on the die. The die includes die circuitry and electrical contacts. The flexible circuit structure is bonded directly to the die, and includes electrical conductors encapsulated by structural layers. Each electrical conductor contacts a respective electrical contact. The electronic device is encapsulated by the barrier film and one or more of the structural layers.

Abstract: A packaged electronic device includes a die, a flexible circuit structure, and a barrier film disposed on the die. The die includes die circuitry and electrical contacts. The flexible circuit structure is bonded directly to the die, and includes electrical conductors encapsulated by structural layers. Each electrical conductor contacts a respective electrical contact. The electronic device is encapsulated by the barrier film and one or more of the structural layers.

Abstract: A packaged electronic device includes a die, a flexible circuit structure, and a barrier film disposed on the die. The die includes die circuitry and electrical contacts. The flexible circuit structure is bonded directly to the die, and includes electrical conductors encapsulated by structural layers. Each electrical conductor contacts a respective electrical contact. The electronic device is encapsulated by the barrier film and one or more of the structural layers.

Abstract: A packaged electronic device includes a die, a flexible circuit structure, and a barrier film disposed on the die. The die includes die circuitry and electrical contacts. The flexible circuit structure is bonded directly to the die, and includes electrical conductors encapsulated by structural layers. Each electrical conductor contacts a respective electrical contact. The electronic device is encapsulated by the barrier film and one or more of the structural layers.

Abstract: Polymeric compositions having a high dielectric constant are made from a thermotropic liquid crystalline and a ceramic having a dielectric constant which is greater than about 50 at a frequency of 1.0 GHz. The compositions have a dielectric constant of at least about 4, and preferably at least about 6. Preferred compositions also have a low loss tangent.

Abstract: A dual-pane thermal window unit comprises two non-intersecting or, preferably, substantially parallel, spaced window panes, mounted in a window frame, a first of the panes having affixed thereto a first wall of an electro-optical liquid crystal cell providing a selected light transmittance, and a second of said panes delimiting, with a second wall of said cell, a space providing a thermal break. Each of the first and second walls comprises an electrically conductive film composed of plastic and having sufficient supporting strength to maintain the structural integrity of the cell. The window is light weight, economical to manufacture and efficient and reliable in operation.

Abstract: The invention provides a method for forming deposits of superconducting ceramics by sequentially electrodepositing layers of metals, of a type and in proportion suitable for forming a superconducting ceramic, to form a precursor metal deposit, followed by oxidizing the precursor deposit to form a superconducting ceramic deposit. Optionally, the electroplating steps are conducted in such a manner that a patterned precursor deposit results, to obtain a patterned superconducting deposit after oxidation.

Abstract: A dual-pane thermal window unit comprises two non-intersecting or, preferably, substantially parallel, spaced window panes, mounted in a window frame, a first of the panes having affixed thereto a first wall of an electro-optical liquid crystal cell providing a selected light transmittance, and a second of said panes delimiting, with a second wall of said cell, a space providing a thermal break. Each of the first and second walls comprises an electrically conductive film composed of plastic and having sufficient supporting strength to maintain the structural integrity of the cell. The window is light weight, economical to manufacture and efficient and reliable in operation.

Abstract: Superconducting ceramic layers are made by first electrochemically depositing metal layers containing embedded particulate matter, followed by oxidation of the precursor layer to form the desired superconducting ceramic. The embedded particulate matter may (a) furnish required constituent metals for the superconductor, (b) be a superconductor itself, which may be the same as or different from the superconductor to be formed, or (c) provide adjuvant substances for improving the properties (e.g., electrical or mechanical) of the superconducting layer being formed.

Abstract: A dual-pane thermal window unit comprises two non-intersecting or, preferably, substantially parallel, spaced window panes, mounted in a window frame, a first of the panes having affixed thereto a first wall of an electro-optical liquid crystal cell providing a selected light transmittance, and a second of said panes delimiting, with a second wall of said cell, a space providing a thermal break. Each of the first and second walls comprises an electrically conductive film composed of plastic and having sufficient supporting strength to maintain the structural integrity of the cell. The window is light weight, economical to manufacture and efficient and reliable in operation.

Abstract: A window unit has at least one pane a face, of which is coated with a transparent conductive polymer layer that is reflective and absorptive in an infrared region of the electromagnetic spectrum, transparent in the visible region of the spectrum, and has a transparency ratio greater than 2. The window unit minimizes radiative heat transfer and maximizes the transmission of visible light therethrough.

Abstract: A dual-pane thermal window unit comprises two non-intersecting or, preferably substantially parallel, spaced window panes, mounted in a window frame, a first of the panes having affixed thereto a first wall of an electro-optical liquid crystal cell providing a selected light transmittance, and a second of said panes delimiting, with a second wall of said cell, a space providing a thermal break. Each of the first and second walls comprises an electrically conductive film composed of plastic and having sufficient supporting strength to maintain the structural integrity of the cell. The window is light weight, economical to manufacture and efficient and reliable in operation.

Abstract: A dual-pane thermal window unit comprises two nonintersecting or, preferably, substantially parallel, spaced window panes, mounted in a window frame, a first of the panes having affixed thereto a first wall of an electro-optical liquid crystal cell providing a selected light transmittance, and a second of said panes delimiting, with a second wall of said cell, a space providing a thermal break. Each of the first and second walls comprises an electrically conductive film composed of plastic and having sufficient supporting strength to maintain the structural integrity of the cell. The window is light weight, economical to manufacture and efficient and reliable in operation.

Abstract: A dual-pane thermal window unit comprises two non-intersecting or, preferably, substantially parallel, spaced window panes, mounted in a window frame, a first of the panes having affixed thereto a first wall of an electro-optical liquid crystal cell providing a selected light transmittance, and a second of said panes delimiting, with a second wall of said cell, a space providing a thermal break. Each of the first and second walls comprises an electrically conductive film composed of plastic and having sufficient supporting strength to maintain the structural integrity of the cell. The window is light weight, economical to manufacture and efficient and reliable in operation.

Abstract: A method is provided for minimizing radiative heat transfer and maximizing the transmission of visible light through a window having at least one pane. The method comprises the step of applying a transparent conductive polymer layer to a face of the pane, the polymer layer being reflective and absorptive in an infrared region of the electromagnetic spectrum and being transparent in the visible region of the spectrum, and having a transparancy ratio greater than 2.

Abstract: The invention relates to an improvement in a method of forming deposits of superconducting ceramics. Generally, such ceramics are formed by electrodepositing a mixture of metals of the type and in proportions sufficient to be oxidized into ceramic; oxidizing the electrodeposited mixture under conditions sufficient to result in a superconducting ceramic deposit; and orienting the crystallites in said superconducting ceramic deposit. Crystallite orientation may take place before, after or during the oxidation step.