Patents by Inventor Helmut Fasbender

Helmut Fasbender has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for producing copper-clad base materials
    Patent number: 5393591
    Abstract: In a process known per se for producing base materials copper-clad on at least one side, in which a winding core carrying a copper foil is wound with a reinforcing fiber, the laid fibers are impregnated with a solvent-free resin and the resin is cured fully to reach the C-stage, it is proposed to use, as the resin, a solvent-free epoxy-isocyanurate resin having a viscosity at processing temperature of less than 1000 mPa.s and an NCO content of more than 20%.
    Type: Grant
    Filed: May 19, 1993
    Date of Patent: February 28, 1995
    Assignee: Huls Troisdorf Aktiengesellschaft
    Inventors: Helmut Fasbender, Burkhard Voss
  • Adhesion imparting layer of acrylonitrile-butadiene copolymer on a base material for printed circuits
    Patent number: 4212912
    Abstract: Adhesion imparting layer applied to an insulating material serving as a base material in the production of printed circuit boards. The adhesion imparting layer consists essentially of an elastomer of acrylonitrile-butadiene copolymer cross-linked with an organic peroxide.
    Type: Grant
    Filed: March 15, 1977
    Date of Patent: July 15, 1980
    Assignees: Licentia Patent-Verwaltungs-G.m.b.H., AEG Isolier- und Kunststoff GmbH
    Inventors: Johann Wartusch, Helmut Fasbender
  • Process for manufacturing base material for printed circuits
    Patent number: 3948701
    Abstract: In a process for making a printed circuit, a method of forming a base for the circuit, including coating a cover foil with a decomposable film, then bonding the film to a carrier, and then removing the cover foil from the film.A protected base useful for making printed circuits, comprising a synthetic-resin-based carrier, a decomposable adhesive film bonded to the carrier, and a removable cover foil bonded to the film, the adhesive film containing catalyst effective for the electroless deposition of metal conductors.
    Type: Grant
    Filed: October 2, 1974
    Date of Patent: April 6, 1976
    Assignee: AEG-Isolier-und Kunststoff GmbH
    Inventors: Helmut Fasbender, Horst Hirschfeld