Abstract: A measuring method and device for characterizing a semiconductor component (1) having a pn junction and a measuring surface, which has a contacting subarea, covered by a metallization. The method including: A. Planar application of electromagnetic excitation radiation onto the measuring area of the semiconductor component (1) for separating charge carrier pairs in the semiconductor component (1), and B. spatially resolved measurement of electromagnetic radiation originating from the semiconductor component (1) using a detection unit. In one step A, a predetermined excitation subarea of the measuring surface has a predetermined intensity of the excitation radiation and at least one sink subarea of the measuring surface has an intensity of the excitation radiation which is less than the intensity applied to the excitation subarea. The excitation and sink subareas are disposed on opposite sides of said contacting subarea and adjoin it and/or entirely or partially overlap it.

Abstract: A measuring method for characterizing a semiconductor component (1) having at least one pn junction and a measuring surface, which is the front and/or rear of the semiconductor component and which has at least one contacting subarea, which is covered by a metallization or is intended for coverage by a metallization, The method includes the following steps: A. Planar application of electromagnetic excitation radiation onto the measuring area of the semiconductor component (1) for separating charge carrier pairs in the semiconductor component (1), and B. spatially resolved measurement of electromagnetic radiation originating from the semiconductor component (1) using at least one detection unit.

Abstract: The device etches semiconductors with a large surface area in a trough-shaped receptacle containing a liquid electrolyte. A sample head is mounted inside the etching trough, and is provided with a device for holding at least one semiconductor wafer. The device is tilted to promote turbulent electrolyte flow in a space between a bottom surface of the semiconductor wafer and top surface of the trough-shaped receptacle.

Abstract: The device etches semiconductors with a large surface area in a trough-shaped receptacle containing a liquid electrolyte. A sample head is mounted inside the etching trough, and is provided with a device for holding at least one semiconductor wafer. The device is tilted to promote turbulent electrolyte flow in a space between a bottom surface of the semiconductor wafer and top surface of the trough-shaped receptacle.

Abstract: A method for continuously manufacturing silicon tapes which are predominantly coated on one side of the carrier, for solar cells. In an exemplary embodiment, a carrier body consisting of a graphite network is conducted vertically upwards through a guide channel situated in the floor of a silicon melt bath and travels through a crystallization region where the molten silicon crystallizes on the carrier body. The surfaces of the guide channel at each side of the carrier path in the vicinity of the crystallization region are wetted by the molten silicon and have different dimensions in a direction at right angles to the carrier path. As a result of the differential in surface tension forces at the two sides of the path, a meniscus is formed which is asymmetrical relative to the channel opening thereby causing asymmetrical coating of the carrier body.