Patents by Inventor Helmut Freller

Helmut Freller has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5445859
    Abstract: A multipolar electrode lead, of the type used to deliver electrical energy in vivo to tissue as part of a system for medical electrotherapy, contains at least first and second conductors, with at least the first conductor being provided with an insulating coating which electrically separates the conductors from each other. The risk of the insulating coating being worn off and a short-circuit developing are reduced by forming the insulating coating of a material having a high electrical resistance and a resistance to abrasion.
    Type: Grant
    Filed: August 12, 1993
    Date of Patent: August 29, 1995
    Assignee: Siemens Aktiengesellschaft
    Inventors: Ulf Lindegren, Helmut Freller, Peter Lorenz
  • Patent number: 5100701
    Abstract: Especially in gripper, insertion and bending tools of automatic insertion machines for electric components, the problem arises, that the production flow is adversely influenced because of solder accumulations at the tools. In machine design it is already known to apply hard material layers on a nitride base to improve tool surfaces; normally, better solder resistance is expected of them. According to the invention at least one second layer is provided as the cover layer with solid-lubricant properties, besides the nitride base layer. The base layer has here preferably a gradual change from high density in the boundary region to the base material of the tool to a porous rough structure at the boundary surface to the cover layer, where the change of the density can be continuous. The metal-nitride layer is advantageously a titanium nitride.With such coatings, the service life of the tools can be increased by more than one order of magnitude.
    Type: Grant
    Filed: February 2, 1990
    Date of Patent: March 31, 1992
    Assignee: Siemens Aktiengesellschaft
    Inventors: Helmut Freller, Hans P. Lorenz, Friedrich Horauf, Peter Schack
  • Patent number: 5061684
    Abstract: In the process according to the invention, material is vaporized off a cathode and deposited on a substrate in a cathodic arc vaporization process, the arc base being moved on the cathode surface in a random or controlled manner. In the arc vaporization process, preferably at least two cathodes of different alloys or mixtures of the metallic components of the high temperature superconductor (HTSC) are activated for vaporization by an arc and the materials vaporized out of the different alloys are jointly deposited on the substrate, the arc vaporization process occurring reactivity under oxygen atmosphere of preset O.sub.2 partial pressure. A heat treatment for adjusting the structure and oxygen stoichiometry suitable for superconduction can be carried out after or during the vaporizing process.
    Type: Grant
    Filed: September 25, 1989
    Date of Patent: October 29, 1991
    Assignee: Siemens Aktiengesellschaft
    Inventors: Helmut Freller, Peter Schack
  • Patent number: 4842710
    Abstract: In particular for coating tools and product components, which are subject to extremely high wear, metal nitride films are used. It has been found that if the metals have markedly different melting points, in accordance with the invention, the concentrations of the metals can be varied as a function of the film thickness. For manufacturing such mixed nitride films by vaporization of metal alloy cathodes by means of an arc while simultaneously introducing nitrogen as reaction gas, a variable voltage is applied to the substrate during vaporization of the metal alloy and varied as a function of the film thickness on the substrate.
    Type: Grant
    Filed: March 9, 1988
    Date of Patent: June 27, 1989
    Assignee: Siemens Aktiengesellschaft
    Inventors: Helmut Freller, Peter Schack
  • Patent number: 4612100
    Abstract: In a method for manufacturing an implantable electrode, particularly a stimulating electrode, vitreous carbon is sputtered from a vitreous carbon target on at least a part of the surface of the electrode. The sputtering is performed in an argon atmosphere at a pressure of 4 to 8.times.10.sup.-2 mbar and at a voltage of 1.6 to 2.4 kV. The electrode may consist essentially of platinum-iridium, vitreous carbon or platinum.
    Type: Grant
    Filed: December 13, 1984
    Date of Patent: September 16, 1986
    Assignee: Siemens Aktiengesellschaft
    Inventors: Martin Edeling, Helmut Freller, Konrad Mund, Peter Schack
  • Patent number: 4603704
    Abstract: In order to expand the availability of effective and usable electrodes for medical applications, an electrode is proposed which is comprised of an electrically conductive carrier material and of a porous layer in its active region which is composed of a carbide, nitride or carbonitride of one of the metals titanium, vanadium, zirconium, niobium, molybdenum, hafnium, tantalum or tungsten.
    Type: Grant
    Filed: January 11, 1984
    Date of Patent: August 5, 1986
    Assignee: Siemens Aktiengesellschaft
    Inventors: Konrad Mund, Helmut Freller, Friedrich Hoerauf
  • Patent number: 4532174
    Abstract: A simplified, easily producible, strongly adherent, solderable and corrosion resistant layer system for opto-electronic displays is produced by vapor deposition techniques. In accordance with the invention, the layer system is formed of two layers; a transparent first layer formed of a nonsolderable oxide semiconductor, such as In.sub.2 O.sub.3 SnO.sub.2, and a second layer formed of a solderable, oxidation-resistant material, which is formed at least partially of a copper alloy containing an alloying additive consisting of a metal which is less noble than copper, illustratively CuMg.
    Type: Grant
    Filed: June 30, 1983
    Date of Patent: July 30, 1985
    Assignee: Siemens Aktiengesellschaft
    Inventors: Helmut Freller, Heinrich Hassler, Peter Schack, Ludwig Schultz
  • Patent number: 4508432
    Abstract: An electrochromic display cell is described which has a front electrode of an electrochromic material, especially tungsten trioxide or iridium oxide, layered on a support surface and a rear electrode of vitreous carbon layered on a support surface. The rest potential and large capacity of the rear electrode permit a fast image cycle time at the front electrode and obviate the need to reverse potential polarity during cycling.
    Type: Grant
    Filed: September 21, 1982
    Date of Patent: April 2, 1985
    Assignee: Siemens Aktiengesellschaft
    Inventors: Helmut Freller, Konrad Mund
  • Patent number: 4508430
    Abstract: An electrochromic display cell is described which has a front electrode of tungsten trioxide layered on a support surface and a rear electrode of titanium nitride layered on a support surface. The rest potential and large capacity of the rear electrode permit a fast image cycle time at the front electrode and obviate the need to reverse potential polarity during cycling.
    Type: Grant
    Filed: September 21, 1982
    Date of Patent: April 2, 1985
    Assignee: Siemens Aktiengesellschaft
    Inventors: Helmut Freller, Friedrich Horauf, Hans-Peter Lorenz, Konrad Mund
  • Patent number: 4400254
    Abstract: Indium-tin alloy targets are high-frequency cathode sputtered using water vapor with a pressure of between 10.sup.-3 mbar and 5.times.10.sup.-3 mbar as the reaction gas. The temperature-sensitive substrates used are water-cooled during the deposition. This is a continuation of application Ser. No. 168,244 filed July 10, 1980, now abandoned.
    Type: Grant
    Filed: January 18, 1982
    Date of Patent: August 23, 1983
    Assignee: Siemens Aktiengesellschaft
    Inventors: Helmut Freller, Peter Schack
  • Patent number: 4385976
    Abstract: In order to bring about durable solder joints on transparent thin film electrodes which themselves are not solderable, the conductive layer is treated as follows. First, the conductive layer is applied in a vacuum and, more specifically, in the fully oxidized state, and then a solderable layer is generated on the conductive layer in the same vacuum. The electrode consists preferably of an indiumtin oxide and the solder layer consists of copper. The proposed coating technique is particularly simple since the solder layer requires neither an adhesion aid nor a corrosion protection layer. If it consists of copper, it can withstand without difficulty, if it is thick enough, even small thermal stresses such as occur for instance in the fabrication of liquid crystal displays with cementing frame.The layer system is particularly well suited for the electrode leads of electro-optical displays such as liquid crystal displays.
    Type: Grant
    Filed: August 23, 1982
    Date of Patent: May 31, 1983
    Assignee: Siemens AG
    Inventors: Hans Schuster-Wolden, Helmut Freller, Hans Kruger, Wolfgang Welsch, Andre Peetermans, Hans J. Rolke, Peter Schack
  • Patent number: 4198449
    Abstract: Disclosed herein is the preparation of thin films of tungsten, molybdenum, rhenium or osmium on a high-temperature resistant substrate by thermal evaporation in a high vacuum, wherein the oxides of these high-temperature-resistant metals are evaporated simultaneously with a reduction metal in a manner such that the oxide molecules and the metal atoms or molecules impinge together on the surface of the substrate heated to a predetermined temperature and react with each other there chemically, so that the high-temperature-resistant metal oxides are reduced and the reduction metals are oxidized. In this process, the high-temperature-resistant metal is deposited on the surface of the substrate, and the oxides of the reduction metals evaporate, either completely or partially, and are pumped off.
    Type: Grant
    Filed: April 20, 1978
    Date of Patent: April 15, 1980
    Assignee: Siemens Aktiengesellschaft
    Inventors: Helmut Freller, Gunther Titze
  • Patent number: 3963839
    Abstract: Preparation of thin layers of tungsten or molybdenum on a highly temperature-resistant layer substrate by thermal evaporation in a high vacuum, where WO.sub.3 or MoO.sub.3, respectively, is evaporated and the layer substrate is heated so that the oxides are decomposed and a pure tungsten or molybdenum layer is deposited on the layer substrate.
    Type: Grant
    Filed: August 29, 1974
    Date of Patent: June 15, 1976
    Assignee: Siemens Aktiengesellschaft
    Inventor: Helmut Freller