Abstract: A semiconductor device which is resistant against alternating thermal stres in which a disc of semiconductor material, which is provided with at least one pn-junction and with solderable contacting coatings on its opposite major surfaces, has these coatings permanently connected, in a direct planar manner, with current conducting connections by means of a soft solder. The soft solders employed are tin solders containing 3 to 8% antimony, 0.1 to 2% nickel, remainder tin, or 3 to 8% antimony, 0.1 to 3% copper, 0.1 to 2% cadmium, remainder tin, or 1 to 6% silver, 0.1 to 2% cadmium, remainder tin; cadmium solders containing 10 to 25% zinc, 1 to 5% silver, remainder cadmium, or 10 to 25% zinc, 5% silver, 3% copper, remainder cadmium; zinc solders containing 10 to 25% cadmium, 0.1 to 3% copper, remainder zinc; and lead solders containing 10 to 20% cadmium, 0.3 to 5% antimony, remainder lead, or 1 to 5% silver, 0.5 to 2% tin, 0.1 to 2% nickel, 0.1 to 3% copper, remainder lead.