Abstract: The present subject matter relates to a method including receiving a set of signals from transmitters of a communication system, the communication system having a system configuration. A first and second set of machine learned parameters may be provided in accordance with the system configuration. The received signals may be weighted using the first set of machine learned parameters. The weighted signals may be combined to generate a composite signal. The composite signal may be weighted with the second set of machine learned parameters in order to estimate an interference signal that is caused by the set of signals at a receiver of the communication system.

Abstract: The present subject matter relates to an apparatus for a communication system. The apparatus is configured for: for each beam direction of a set of beam directions of an antenna array of the communication system, determining a level of a passive intermodulation, PIM, signal at a receiver of the communication system, the PIM signal being caused by a set of signals transmitted by the antenna array in the beam direction, identifying beam directions of the set of beam directions whose PIM level is higher than a predefined threshold, adapting a beamforming of signals in at least part of the identified beam directions to mitigate the PIM level at the receiver.

Abstract: The present subject matter relates to an apparatus for a communication system. The communication system comprises transmitters being configured to operate in multiple transmission frequency bands. The apparatus comprises means being configured for: capturing a set of over-the-air signals at distinct frequency bands of the multiple transmission frequency bands; aligning in time the set of signals using delays between the set of signals and a received signal at a selected receiver of the communication system; combining the set of aligned signals to generate a composite signal; and estimating an interference signal that is caused by the set of signals at the selected receiver by weighting the composite signal using a set of one or more calibrated parameters for the estimation.

Abstract: The present subject matter relates to a method comprising: receiving a set of signals from transmitters of a communication system, the communication system having a system configuration. A first and second set of machine learned parameters may be provided in accordance with the system configuration. The received signals may be weighted using the first set of machine learned parameters. The weighted signals may be combined to generate a composite signal. The composite signal may be weighted with the second set of machine learned parameters in order to estimate an interference signal that is caused by the set of signals at a receiver of the communication system.

Abstract: A method including capturing a signaling on a transmission path conveying a signal to be transmitted and on a reception path conveying a signal being received, setting model parameters related to a distortion effect on the basis of the captured signaling, the distortion effect being caused by the signal to be transmitted on the signal being received due to passive intermodulation between the transmission path and the reception path, generating a reference signal being related to a predetermined frequency spectrum part used by the signal being received by applying the model parameters on a captured signaling on the transmission path, and correcting the signal being received by using the generated reference signal.

Abstract: It is disclosed a method comprising accommodating, in frequency domain, a first bandwidth of a first carrier signal with respect to a second bandwidth of a second carrier signal such that the first bandwidth adjoins to or overlaps the second bandwidth, the first bandwidth being greater than the second bandwidth.

Abstract: A method including capturing a signaling on a transmission path conveying a signal to be transmitted and on a reception path conveying a signal being received, setting model parameters related to a distortion effect on the basis of the captured signaling, the distortion effect being caused by the signal to be transmitted on the signal being received due to passive intermodulation between the transmission path and the reception path, generating a reference signal being related to a predetermined frequency spectrum part used by the signal being received by applying the model parameters on a captured signaling on the transmission path, and correcting the signal being received by using the generated reference signal.

Abstract: It is disclosed a method comprising accommodating, in frequency domain, a first bandwidth of a first carrier signal with respect to a second bandwidth of a second carrier signal such that the first bandwidth adjoins to or overlaps the second bandwidth, the first bandwidth being greater than the second bandwidth.

Abstract: It is disclosed a method including accommodating, in frequency domain, a first bandwidth of a first carrier signal with respect to a second bandwidth of a second carrier signal such that the first bandwidth adjoins to or overlaps the second bandwidth, the first bandwidth being greater than the second bandwidth. In a further aspect, prior to the transmission, the interference of the modulated second carrier signal is subtracted from each of the plurality of subcarrier signals of the first carrier signal.

Abstract: It is disclosed a method including accommodating, in frequency domain, a first bandwidth of a first carrier signal with respect to a second bandwidth of a second carrier signal such that the first bandwidth adjoins to or overlaps the second bandwidth, the first bandwidth being greater than the second bandwidth. In a further aspect, prior to the transmission, the interference of the modulated second carrier signal is subtracted from each of the plurality of subcarrier signals of the first carrier signal.

Abstract: A method for the automated production of circuit carriers, comprising providing a substrate for accommodating electronic components, applying an electrically conductive, metal-containing base structure on the substrate. Electronic components are also provided on the substrate and are connected to each other by the structure. Electrically conductive, metal-containing conductive adhesive structures are applied onto the substrate, and the electronic components are connected to the base structure in an electrically conductive way by the structures. The conductive adhesive structures are optically differentiated from the base structure by a colored electrically conductive, metal-containing conductive adhesive applied onto the substrate in order to produce the conductive adhesive structure. A contrast, which is necessary for the automated optical monitoring of the conductive adhesive structures and the base structure, is established between the conductive adhesive structures and the base structure.

Abstract: Electronic packages are produced as follows. Vias in a support body are closed with a highly viscous screen printing material following application of a first metallizing layer forming a base metallization on the support body and in the lead-throughs for the vias. A low viscosity passivating layer, which has been applied on the entire surface of the top and bottom sides of the support body, is selectively removed from certain areas of the top side. A second metailizing layer forming the final metallization of a low-melting point material is applied to the first metallization layer in the areas from which the passivating layer was removed. Electronic components of the circuit arrangement are applied on the top side of the support body and contacted by a soldering process.

Abstract: The aim of the invention is to simplify and improve the production method for circuit arrangements that are mounted on a support element (5), said element having thermal through-platings (7) which are at least partially scaled by a screen printing process. To this end, the screen printing process is carried out after the application of a first metallization layer (6) to the support element (5) which forms the base metallization layer, whereby the residue of the screen printing material (8) remaining on the underside (13) of the support element (5) is stripped once the screen printing material (8) has been cured, using at least a mechanical cleaning process and/or a chemical cleaning process.

Abstract: 2.1 For electronic assemblies with at least one component mounted on a support body, the thermal connection thereof to a cooling body arranged on the underside of the support body is to be simplified and improved.

Abstract: The production method for electronic packages with a circuit arrangement applied to a support body and with vias in the support body shall be simplified and improved.

Abstract: A method for functional testing of a transmission and reception path includes transmitting a first signal at a first transmission power level to a radio station and determining a first reception strength, with a base station. A first difference value is subsequently calculated. The radio station transmits a second signal at a second transmission power level to the base station, determines a second reception strength, and calculates a second difference value. Any difference between the difference values is then compared with a threshold value, and a function of a transmission and reception path is derived from the comparison. A base station of a radio communications system is also provided.

Abstract: A method and circuit for preamplifying reception signals for a radio station. A first preamplifier is connected between an antenna unit and to the radio station. A second preamplifier is provided in the radio station, the second preamplifier being bridged by a bridge line. A switch can selectively switch the radio signals through either the second preamplier or the bridge line, under control of a controller.

Abstract: An electronic component is mounted on a substrate such as a circuit board by means of a soldering process such as reflow soldering. The circuit board has a thermal via hole therethrough to provide a heat dissipation path from the top surface to the bottom surface of the circuit board, for dissipating heat from the electronic component. To prevent molten solder from penetrating through the via hole during the soldering process, the via hole is sealed prior to the soldering process. The via hole is sealed from the bottom surface of the substrate by carrying out a screen printing process including at least two printing passes to print a sealing material into the open hole of the thermal via.

Abstract: A frequency synthesizing device comprises two reference frequency generators RG1 and RG2, an offset stage OS and a phase-locked loop PLL. In the phase-locked loop, which operates as a tracking filter, the output frequency fs.sub.A is generated by the addition of the frequencies f.sub.RG1 and f.sub.OS. The output frequency fs.sub.A has a very high spectral purity, since all interfering spurious signals are blocked by the tracking filter. By a proper selection of the reference frequencies f.sub.RG1, f.sub.RG2 and f.sub.OR, it is ensured that all interfering spurious signals lie outside the bandwidth B.sub.TF of the tracking filter and are accordingly blocked. As a result, it is not necessary to filter the signals S.sub.RG1, S.sub.RG2 and S.sub.OS.