Abstract: According to a first aspect the present invention relates to a fault current limiter formed by a conductor tape (11, 41, 51, 61, 71) coated with a high temperature superconductor and having at least one mounting element (12, 42, 52, 62, 72) which is essentially holding the conductor tape solely on one or more edge regions in such a way that the principal surfaces of the tape cannot get in touch with the mounting element. According to a second aspect the present invention relates to a fault current limiter formed by a conductor tape coated with a high temperature superconductor and comprising at least one mounting element (23, 24) which is contacting the conductor tape on one or on both major surfaces in an electrically conducting manner such that the conductor tape (21) in its normal conducting state is electrically shunted by the mounting element (23) in the contact region.

Abstract: According to a first aspect, the present invention relates to a device for depositing a high temperature superconductor onto a substrate in vacuum comprising a refilling device for containing a stock of high temperature superconductor material, an evaporation device, that evaporates the high temperature superconductor material within an evaporation zone by means of an energy transferring medium, and a conveyor that transports the high temperature superconductor material continuously from the refilling device to the evaporation zone in such a way that the high temperature superconductor material delivered into the evaporation zone is evaporated essentially without residues.

Abstract: According to a first aspect the present invention relates to a fault current limiter formed by a conductor tape (11, 41, 51, 61,71) coated with a high temperature superconductor and having at least one mounting element (12, 42, 52, 62, 72) which is essentially holding the conductor tape solely on one or more edge regions in such a way that the principal surfaces of the tape cannot get in touch with the mounting element. According to a second aspect the present invention relates to a fault current limiter formed by a conductor tape coated with a high temperature superconductor and comprising at least one mounting element (23, 24) which is contacting the conductor tape on one or on both major surfaces in an electrically conducting manner such that the conductor tape (21) in its normal conducting state is electrically shunted by the mounting element (23) in the contact region.

Abstract: According to a first aspect, the present invention relates to a device for depositing a high temperature superconductor onto a substrate in vacuum comprising a refilling device for containing a stock of high temperature superconductor material, an evaporation device, that evaporates the high temperature superconductor material within an evaporation zone by means of an energy transferring medium, and a conveyor that transports the high temperature superconductor material continuously from the refilling device to the evaporation zone in such a way that the high temperature superconductor material delivered into the evaporation zone is evaporated essentially without residues.

Abstract: The invention relates to a switching element for modifying the electric resistance with at least one high temperature superconductor (1) and means (3) for irradiating electromagnetic high frequency onto the at least one high temperature superconductor (1). The invention further relates to a method for switching a high temperature superconductor (1) comprising the steps of providing a high temperature superconductor (1) in the superconducting state and irradiating an electromagnetic high frequency until the high temperature superconductor (1) changes over into a normally conducting state.

Abstract: The present invention relates to a method for the manufacture of a high temperature-superconducting layer on a substrate (1a, 1b) comprising the steps of depositing an RBa2Cu3O7-layer (2) with a low growth rate, wherein R represents yttrium, an element of the group of rare-earth elements (atomic number 57 to 71) or mixtures of two or more of these elements, and the deposition of an XBa2Cu3O7-layer (3) onto the RBa2Cu3O7-layer (2) with high growth rate, wherein X represents yttrium, an element of the group of rare-earth elements (atomic number 57-71) or mixtures of two or more of these elements. Preferably, the low growth rate is <1 nm/s and the high growth rate is >1 nm/s, preferably >2 nm/s and the RBa2Cu3O7-layer (2) is preferably deposited onto an at least biaxially textured substrate (1a) or a substrate with an at least biaxially textured buffer layer (1b).

Abstract: A laminate includes an amorphous or polycrystalline substrate; a textured buffer layer arranged on the substrate and having a columnar structure wherein a low index crystal axis is inclined with respect to the substrate normal and a surface of columnar crystallites is inclined with respect to the low index crystal axis; at least one cover layer arranged on the buffer layer and having a closed surface; and an oriented thin layer.

Abstract: The invention relates to a switching element for modifying the electric resistance with at least one high temperature superconductor (1) and means (3) for irradiating electromagnetic high frequency onto the at least one high temperature superconductor (1). The invention further relates to a method for switching a high temperature superconductor (1) comprising the steps of providing a high temperature superconductor (1) in the superconducting state and irradiating an electromagnetic high frequency until the high temperature superconductor (1) changes over into a normally conducting state.

Abstract: The invention relates to an apparatus for the production of thin oxide coatings, having a vacuum chamber wherein an oxygen chamber with an opening and a rotary substrate holder overlapping the latter are disposed. For the rotary arrangement of the substrate holder a rotary mounting is provided, which engages a circumferential portion of the substrate holder.

Abstract: In a method for producing laminate, a buffer layer is applied to a substrate, with the buffer layer material being evaporated from the buffer layer material dispensing devices at an angle &agr;1≠0 at the normal to the substrate surface onto the latter, before an oriented thin layer is evaporated. According to the invention, provision is made such that (a) following evaporation of the buffer layer and prior to the evaporation of the oriented thin layer, at least one cover layer is evaporated under deposition conditions that vary from those under which the buffer layer was applied, especially at a different pressure, different temperature, different rate, and/or different angle &agr;2≠&agr;1, especially &agr;2<&agr;1, preferably &agr;2≈0° to the substrate surface normal, and/or is evaporated on the buffer layer in such fashion that the buffer layer has a biaxial texture and/or facets.

Abstract: The invention relates to a laminate with, one after the other, amorphous or polycrystalline substrate, a textured buffer layer, and an oriented thin layer. In addition, at least one cover layer is contained between the buffer layer and the thin layer. In a method for producing laminate, a buffer layer is applied to a substrate, with the buffer layer material being evaporated from the buffer layer material dispensing devices at an angle &agr;1≠0 at the normal to the substrate surface onto the latter, before an oriented thin layer is evaporated.