Abstract: A process and device for polishing semiconductor wafers has at least one side of at least one semiconductor wafer pressed against a polishing plate, over which a polishing cloth is stretched. The semiconductor wafer and the polishing plate are moved relative to each other to polish the wafer. During the polishing, the semiconductor wafer passes over at least two regions on the polishing plate, which regions have defined radial widths and are at different temperatures. Temperature-control means are provided in the polishing plate, with the aid of which the number, the radial widths and the temperatures of the regions are fixed before the semiconductor wafers are polished.

Abstract: Silicon wafers can be provided with a hydrophilic surface and/or freed of hering cement residues originating from the polishing operation with the aid of solutions adjusted to a pH of 8 to 14 with the aid of alkali-metal or alkaline-earth-metal compounds and containing hydrogen peroxide. These processes can even be carried out at room temperature and are remarkable for their low chemical consumption and easy manageability.

Abstract: The shutter mechanism includes an aperture-unblocking member mounted for movement between an unactivated aperture-blocking position and an activated aperture-unblocking position. A cocked drive mechanism is coupled to the aperture-unblocking member and is operative when released for moving the member from the unactivated to the activated position. An inertial braking mechanism is driven by the drive mechanism when the latter moves the aperture-unblocking member to the activated position, and is operative during such movement for applying to the drive mechanism an inertial braking force slowing the movement of the aperture-unblocking member to the activated position. The drive mechanism includes a drive cam, and the inertial braking mechanism includes a driven cam. The surface of the drive cam bears upon the surface of the driven cam and transmits to the driven cam the drive force by means of which the drive mechanism drives the inertial braking mechanism.

Abstract: Process for making haze-free surfaces of semiconductor bodies which comprs a first step of polishing the surface by means of a polishing agent containing at least one member of the group consisting of quartz, silica, silicates and fluosilicates, and a second step of polishing the surface by means of a polishing agent containing in addition to the above defined agents from 0.1 to 10% by weight calculated on the polishing agent of a nitrogen-free surfactant selected from the group consisting of anionic and non-ionic surfactants, and a mixture thereof.

Abstract: A stackable plastics pallet for packaging semiconductor discs on a gas-ti foil covering, said pallet having a plurality of circular depressions each for accommodating a semiconductor disc, and means for securing the discs between the pallets, the securing means being in the form of sloping part-sector shaped surfaces surrounding said depressions, with two opposite sets of sloping surfaces clamping the semiconductor discs at their outermost rims and immobilizing them thereby.

Abstract: Process of the removal of point defects and point defect agglomerates from emiconductor discs, which comprises the steps of providing one side of the discs with a mechanical stress field and then subjecting the discs to a heat treatment.