Patents by Inventor Helmut Knipf

Helmut Knipf has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5489667
    Abstract: Poly(ether ester amides) consisting of 60% to 80% by weight of a polyamide block obtainable from the following monomers:20 to 40% by weight of caprolactam or aminocaproic acid30 to 50% by weight of 11-aminoundecanoic acid20 to 40% by weight of the adduct of hexamethylenediamine anddecanedicarboxylic acidthe total amount of these polyamide-forming monomers adding up to 100% by weight, and of 20 to 40% by weight of a polyether diol/dicarboxylic acid block obtainable from equimolar amounts of polyethylene glycol with an M.sub.n molecular weight of 400 to 2,000 and one or several saturated aliphatic dicarboxylic acids with 6 to 36 carbon atoms, methods for their synthesis, spunbonded nonwovens from these poly(ether ester amides) and the use of the poly(ether ester amides) for the heat sealing of textiles.
    Type: Grant
    Filed: November 29, 1993
    Date of Patent: February 6, 1996
    Assignee: Atochem Deutschland GmbH
    Inventors: Helmut Knipf, Karl-Heinz Hapelt, Eduard De Jong
  • Patent number: 4774139
    Abstract: Thermoplastic hot-melt adhesive granulate for melt-coating, the granulate particles of which have a coating of a film of paraffin with a melting point of 45.degree. C. to 85.degree. C. in an amount of up to 5% by weight, based on the polymer. The antioxidant is present in the film coating. The invention also relates to a method for the manufacture of this hot-melt adhesive granulate and to its used as a hot-melt coating for heat sealing.
    Type: Grant
    Filed: October 22, 1987
    Date of Patent: September 27, 1988
    Assignee: Deutsche Atochem Werke GmbH
    Inventors: Karl-Heinz Hapelt, Helmut Knipf
  • Patent number: 4483975
    Abstract: Copolyetheresteramides containing, incorporated by condensation,20 to 40% by weight of caprolactam and/or .epsilon.-aminocaproic acid,10 to 30% by weight of an equimolecular mixture of adipic acid and primary aliphatic and/or cycloaliphatic C.sub.6 to C.sub.25 diamines,10 to 30% by weight of an equimolecular mixture of azelaic or sebacic acid and primary aliphatic and/or cycloaliphatic C.sub.6 to C.sub.25 diamines and20 to 40% by weight of an equimolecular mixture of decanedicarboxylic and/or brassylic acid and primary aliphatic and/or cycloaliphatic C.sub.6 to C.sub.25 diamines,always related to the total quantity of the polyamide-forming components, and in which, for 65 to 90% by weight of the total quantity of the polyamide-forming components, there are 10 to 35% by weight of the equimolecular quantities of saturated aliphatic linear dicarboxylic acids, having 6 to 13 C-atoms, and poly(alkylene oxide diols) as polyetherester-forming component, and a process for their preparation.
    Type: Grant
    Filed: December 21, 1983
    Date of Patent: November 20, 1984
    Assignee: Plate Bonn Gesellschaft mit beschrankter Haftung
    Inventors: Eduard de Jong, Karl-Heinz Hapelt, Helmut Knipf