Abstract: A method for automatically positioning a workpiece having at least one marking, specifically a wafer for integrated circuits which is to be processed in a charged-particle beam apparatus, relative to a scanning field or mask. In the method, a scanning beam scans the workpiece along the line and a marking signal is generated when the marking is reached by the beam. This marking signal controls a device which generates a control signal in response to the marking signal which is proportional to the deviation of the marking position from a reference position and which drives a device for correcting the position of the workpiece relative to the scanning field or mask.