Abstract: The invention relates to a novel pharmaceutical preparation which can be administered nasally and is based on an aqueous solution, emulsion or the like which comprises at least one mucosally absorbable and/or locally acting active pharmaceutical ingredient, at least one preservative formed by benzalkonium chloride alone or together with other preservative substances, at least one buffer which keeps the pH at 4 to 6, and in addition at least one osmotic agent and/or at least one wetting agent and which is characterized in that the preparation has a substantially improved ciliary tolerability owing to the fact that in the preparation a buffer based on malic acid is present instead of a buffer which has been employed to date in the pharmaceutical preparation and is based on citrate(s), phosphate(s) and/or acetate(s)—partly or completely replacing it (them)—while retaining the composition, concentration and amount ratios, intended in each case for the pharmaceutical preparation, of active ingredient(s), preservat

Abstract: At least one semiconductor element is located on an electrically conducting conductor strip. Around the conductor strip and the at least one semiconductor element, a housing made of a molding material is arranged such that there are still frame sections of the conductor strip outside the housing. An enlarged frame section of the conductor strip is widened so as to extend into contact with, e.g. directly adjacent to or even protruding into the housing, in order to prevent the formation of a molding flash ridge on this housing surface. The enlarged frame section is finally removed. The avoidance of a molding flash ridge allows the component to be suction-held by a suction needle at this housing surface.

Abstract: A molded electronic component has numerous connection pins protruding on a single plane from a side surface area of an essentially cuboid housing, and a circumferential ridge of molded housing material protrudes from the other side area surfaces on the plane of the connection pins. The thickness of this ridge essentially corresponds to the thickness of the connection pins. On the side surface area located opposite the side surface area from which the connection pins protrude, in the plane of the connection pins, the ridge passes or transitions into a groove such that there is no ridge protruding outwardly beyond the side surface in this area. Thus, the component can be better placed by a tool such as a suction needle onto a printed circuit board without interference from such a ridge. The invention is particularly suitable for the production of molded electronic components whose separation plane runs through that housing surface which serves as a docking surface for a suction needle.

Abstract: A stable, nasally, orally or sublingually applicable pharmaceutical preparation for administering to patients has an aqueous solution of desmopressin as the active agent. Said solution contains an osmoticum and a buffer which maintains the pH-value in the range of 4 to 6, preferably about 5. The buffer is malic acid, preferably in the form of a racemate. Thereby an improved stability of the desmopressin content in the preparation is obtained.

Abstract: In the case of molded electronic components a mold material ridge remains in the housing on the separation plane of the mold tool. This is particularly disadvantageous if the ridge leads through a side surface area located opposite to the connection pins, serving as a docking surface for a suction needle.

Abstract: In the case of molded electronic components a mold material ridge remains in the separation plane of the mold tool. This is particularly disadvantageous if the ridge leads through a surface area of the housing, serving as a docking surface for a suction needle.

Abstract: A semiconductor assembly with a metal frame configuration is described, having a semiconductor component (HL) on a carrier section (T) of a ground strip section (M). The ground strip segment has an extension section (V) with which it is extended beyond said carrier section and is both folded over in relation to said carrier section and of sufficient length that it covers said semiconductor component in order to shield it electromagnetically.In this assembly, the ground strip section has a multiple function. It is used not only for carrying and contacting of electrical components, but also acts at the same time as electromagnetic shielding for a semiconductor component, for example for the radiation detector of a remote control reception module.

Abstract: Welded joints of austenitic steels are tested by ultrasonic sound caused to be incident on the joint at an oblique angle thereto. Information regarding the size and nature of reflectors in the joint can be derived from the amplitude of the echoes generated at the reflectors in response to the sound beam. To ensure a definite relationship between the amplitude of the echoes and the nature and size of the reflector, the frequency of the sound use for testing is below and upper frequency limit at which the wavelength of sound in the base material equals the largest peak-to-valley distance of the base metal weld interface in any of the consecutive areas of the interface on which the sound beam is incident at any time.

Abstract: A tube spacer grid for a heat-exchanger tube bundle is formed by an annular grid frame having a groove formed in its inner surface in which the interspaced grid bars have their ends positioned and held in interspaced relationship by short sections of tubes passed through holes axially formed in the grid frame so that the tubes are positioned between the ends of the grid bars in the grooves. The tube sections may be cut from the same tubes used to form the tube bundle.