Patents by Inventor Helmut Schillinger
Helmut Schillinger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11904410Abstract: A method for laser preparation of a coated substrate to be laser cut is provided. The method includes substantially removing a target portion of a polymer coating from a coated substrate by directing an ablative laser beam to the target portion, wherein the target portion of the polymer coating has a width of between about 10 ?m and about 6.0 mm.Type: GrantFiled: October 5, 2016Date of Patent: February 20, 2024Assignee: Corning IncorporatedInventors: Alejandro Antonio Becker, Tobias Christian Roeder, Helmut Schillinger, Ralf J Terbrueggen
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Patent number: 11345625Abstract: A method for the laser-based machining of a sheet-like substrate, in order to separate the substrate into multiple portions, in which the laser beam of a laser for machining the substrate is directed onto the latter, is characterized in that, with an optical arrangement positioned in the path of rays of the laser, an extended laser beam focal line, seen along the direction of the beam, is formed on the beam output side of the optical arrangement from the laser beam directed onto the latter, the substrate being positioned in relation to the laser beam focal line such that an induced absorption is produced in the material of the substrate in the interior of the substrate along an extended portion, seen in the direction of the beam, of the laser beam focal line, such that a material modification takes place in the material of the substrate along this extended portion.Type: GrantFiled: July 31, 2019Date of Patent: May 31, 2022Assignee: Corning Laser Technologies GmbHInventors: Richard Grundmueller, Helmut Schillinger
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Patent number: 11028003Abstract: A method for laser-based machining of a flat substrate, to separate the substrate into a plurality of sections, in which the laser beam of a laser is directed at the substrate using an optical arrangement, which is positioned in the beam path of the laser. The optical arrangement forms a laser beam focal line that is extended as viewed along the beam direction and the substrate is positioned relative to the laser beam focal line such that an induced absorption is produced in the material of the substrate along a section of the laser beam focal line that is extended as viewed in the beam direction.Type: GrantFiled: January 14, 2014Date of Patent: June 8, 2021Assignee: CORNING LASER TECHNOLOGIES GMBHInventors: Richard Grundmueller, Helmut Schillinger
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Patent number: 10597321Abstract: Processes of chamfering and/or beveling an edge of a glass substrate of arbitrary shape using lasers are described herein. Two general methods to produce chamfers on glass substrates are the first method involves cutting the edge with the desired chamfer shape utilizing an ultra-short pulse laser to create perforations within the glass; followed by an ion exchange.Type: GrantFiled: January 27, 2015Date of Patent: March 24, 2020Assignee: Corning IncorporatedInventors: Sasha Marjanovic, David Andrew Pastel, Garrett Andrew Piech, Jose Mario Quintal, Helmut Schillinger, Sergio Tsuda, Robert Stephen Wagner, Andrea Nichole Yeary
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Publication number: 20190352215Abstract: A method for the laser-based machining of a sheet-like substrate, in order to separate the substrate into multiple portions, in which the laser beam of a laser for machining the substrate is directed onto the latter, is characterized in that, with an optical arrangement positioned in the path of rays of the laser, an extended laser beam focal line, seen along the direction of the beam, is formed on the beam output side of the optical arrangement from the laser beam directed onto the latter, the substrate being positioned in relation to the laser beam focal line such that an induced absorption is produced in the material of the substrate in the interior of the substrate along an extended portion, seen in the direction of the beam, of the laser beam focal line, such that a material modification takes place in the material of the substrate along this extended portion.Type: ApplicationFiled: July 31, 2019Publication date: November 21, 2019Inventors: Richard Grundmueller, Helmut Schillinger
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Patent number: 10442719Abstract: Processes of chamfering and/or beveling an edge of a glass or other substrate of arbitrary shape using lasers are described herein. Three general methods to produce chamfers on glass substrates are disclosed. The first method involves cutting the edge with the desired chamfer shape utilizing an ultra-short pulse laser. Treatment with the ultra-short laser may be optionally followed by a CO2 laser for fully automated separation. The second method is based on thermal stress peeling of a sharp edge corner, and it has been demonstrated to work with different combination of an ultrashort pulse and/or CO2 lasers. A third method relies on stresses induced by ion exchange to effect separation of material along a fault line produced by an ultra-short laser to form a chamfered edge of desired shape.Type: GrantFiled: October 31, 2014Date of Patent: October 15, 2019Assignee: Corning IncorporatedInventors: Sasha Marjanovic, Albert Roth Nieber, Garrett Andrew Piech, Helmut Schillinger, Sergio Tsuda, Robert Stephen Wagner
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Patent number: 10421683Abstract: A method for the laser-based machining of a sheet-like substrate, in order to separate the substrate into multiple portions, in which the laser beam of a laser for machining the substrate is directed onto the latter, is characterized in that, with an optical arrangement positioned in the path of rays of the laser, an extended laser beam focal line, seen along the direction of the beam, is formed on the beam output side of the optical arrangement from the laser beam directed onto the latter, the substrate being positioned in relation to the laser beam focal line such that an induced absorption is produced in the material of the substrate in the interior of the substrate along an extended portion, seen in the direction of the beam, of the laser beam focal line, such that a material modification takes place in the material of the substrate along this extended portion.Type: GrantFiled: January 14, 2014Date of Patent: September 24, 2019Assignee: CORNING LASER TECHNOLOGIES GMBHInventors: Helmut Schillinger, Richard Grundmüller
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Patent number: 10377658Abstract: A workpiece may be laser processed by a method that may include forming a contour line in the workpiece, and directing an infrared laser beam onto the workpiece along or near the contour line to separate the workpiece along the contour line. The contour line may include defects in the workpiece. The infrared laser beam may have a beam profile such that a greater distribution of cumulated energy from the infrared laser beam is located in areas adjacent to the contour line than directly on the contour line.Type: GrantFiled: July 24, 2017Date of Patent: August 13, 2019Assignee: Corning IncorporatedInventors: Daniel Schnitzler, Helmut Schillinger
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Publication number: 20180179100Abstract: The present invention relates to a laser cutting technology for cutting and separating thin substrates of transparent materials, for example to cutting of display glass compositions mainly used for production of Thin Film Transistors (TFT) devices. The described laser process can be used to make straight cuts, for example at a speed of >1 m/sec, to cut sharp radii outer corners (<1 mm), and to create arbitrary curved shapes including forming interior holes and slots. A method of laser processing an alkaline earth boro-aluminosilicate glass composite workpiece includes focusing a pulsed laser beam into a focal line. The focal line is directed into the glass composite workpiece, generating induced absorption within the material. The workpiece and the laser beam are translated relative to each other to form a plurality of defect lines along a contour, with adjacent defect lines have a spacing of 0.1-20 microns.Type: ApplicationFiled: November 14, 2017Publication date: June 28, 2018Inventors: Sasha Marjanovic, Albert Roth Nieber, Garrett Andrew Piech, Helmut Schillinger, Sergio Tsuda, Robert Stephen Wagner
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Publication number: 20180044219Abstract: Processes of chamfering and/or beveling an edge of a glass or other substrate of arbitrary shape using lasers are described herein. Three general methods to produce chamfers on glass substrates are disclosed. The first method involves cutting the edge with the desired chamfer shape utilizing an ultra-short pulse laser. Treatment with the ultra-short laser may be optionally followed by a CO2 laser for fully automated separation. The second method is based on thermal stress peeling of a sharp edge corner, and it has been demonstrated to work with different combination of an ultrashort pulse and/or CO2 lasers. A third method relies on stresses induced by ion exchange to effect separation of material along a fault line produced by an ultra-short laser to form a chamfered edge of desired shape.Type: ApplicationFiled: July 26, 2017Publication date: February 15, 2018Inventors: Sasha Marjanovic, Albert Roth Nieber, Garrett Andrew Piech, Helmut Schillinger, Sergio Tsuda, Robert Stephen Wagner
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Publication number: 20180029919Abstract: A workpiece may be laser processed by a method that may include forming a contour line in the workpiece, and directing an infrared laser beam onto the workpiece along or near the contour line to separate the workpiece along the contour line. The contour line may include defects in the workpiece. The infrared laser beam may have a beam profile such that a greater distribution of cumulated energy from the infrared laser beam is located in areas adjacent to the contour line than directly on the contour line.Type: ApplicationFiled: July 24, 2017Publication date: February 1, 2018Inventors: Daniel Schnitzler, Helmut Schillinger
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Patent number: 9856970Abstract: A belt drive for a motor vehicle having at least two toothed pulleys (1) which are spaced apart from one another and having a toothed belt which wraps around them, wherein a positively locking connection is formed between a toothing system of the wraparound means and a toothing system (2) of the toothed pulleys (1), which positively locking connection is of low-friction configuration by an anti-friction agent which acts between the toothing systems is provided. In order for it to be possible to configure a toothed belt inexpensively and without an anti-friction agent, the anti-friction agent is formed in the form of a lubricant-varnish layer (5) which is applied at least to a toothing system (2) of a toothed pulley (1).Type: GrantFiled: May 29, 2013Date of Patent: January 2, 2018Assignee: Schaeffler Technologies AG & Co. KGInventors: Rainer Pflug, Juergen Windrich, Helmut Schillinger
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Patent number: 9850160Abstract: The present invention relates to a laser cutting technology for cutting and separating thin substrates of transparent materials, for example to cutting of display glass compositions mainly used for production of Thin Film Transistors (TFT) devices. The described laser process can be used to make straight cuts, for example at a speed of >1 m/sec, to cut sharp radii outer corners (<1 mm), and to create arbitrary curved shapes including forming interior holes and slots. A method of laser processing an alkaline earth boro-aluminosilicate glass composite workpiece includes focusing a pulsed laser beam into a focal line. The focal line is directed into the glass composite workpiece, generating induced absorption within the material. The workpiece and the laser beam are translated relative to each other to form a plurality of defect lines along a contour, with adjacent defect lines have a spacing of 0.1-20 microns.Type: GrantFiled: October 31, 2014Date of Patent: December 26, 2017Assignee: Corning IncorporatedInventors: Sasha Marjanovic, Albert Roth Nieber, Garrett Andrew Piech, Helmut Schillinger, Sergio Tsuda, Robert Stephen Wagner
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Publication number: 20170283299Abstract: Embodiments of the present method of laser cutting a laser wavelength transparent glass article comprises feeding at least one glass article to a pulsed laser assembly having at least one pulsed laser, wherein the pulsed laser defines a laser beam focal line with a length of 0.1-100 mm, the glass article being comprised of two end sections, and at least one lateral surface disposed lengthwise between the end sections. The method further comprises laser cutting at least one perforation line onto the lateral surface of the glass article while there is relative motion between the glass article and the pulsed laser and separating the glass article along the at least one perforation line to yield a laser cut glass article.Type: ApplicationFiled: June 21, 2017Publication date: October 5, 2017Inventors: Dana Craig Bookbinder, Lewis Kirk Klingensmith, Stephan Lvovich Logunov, Albert Roth Nieber, Helmut Schillinger, Pushkar Tandon, Sergio Tsuda
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Patent number: 9701564Abstract: Embodiments of the present method of laser cutting a laser wavelength transparent glass article comprises feeding at least one glass article to a pulsed laser assembly having at least one pulsed laser, wherein the pulsed laser defines a laser beam focal line with a length of 0.1-100 mm, the glass article being comprised of two end sections, and at least one lateral surface disposed lengthwise between the end sections. The method further comprises laser cutting at least one perforation line onto the lateral surface of the glass article while there is relative motion between the glass article and the pulsed laser and separating the glass article along the at least one perforation line to yield a laser cut glass article.Type: GrantFiled: July 8, 2015Date of Patent: July 11, 2017Assignee: Corning IncorporatedInventors: Dana Craig Bookbinder, Lewis Kirk Klingensmith, Stephan Lvovich Logunov, Albert Roth Nieber, Helmut Schillinger, Pushkar Tandon, Sergio Tsuda
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Patent number: 9653193Abstract: A coating method for producing an electrically insulating coating on a bearing component, wherein, in a first step, a substance mixture comprising at least a) a silane and/or siloxane compound, b) a metal alcoholate, and c) PEEK and/or PTFE in the form of a dispersion is applied to the bearing component and, in a second step, is solidified on the component surface by means of a laser beam.Type: GrantFiled: April 17, 2012Date of Patent: May 16, 2017Assignee: Schaeffler Technologies AG & Co. KGInventors: Juergen Windrich, Tim Matthias Hosenfeldt, Helmut Schillinger
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Publication number: 20170100801Abstract: A method for laser preparation of a coated substrate to be laser cut is provided. The method includes substantially removing a target portion of a polymer coating from a coated substrate by directing an ablative laser beam to the target portion, wherein the target portion of the polymer coating has a width of between about 10 ?m and about 6.0 mm.Type: ApplicationFiled: October 5, 2016Publication date: April 13, 2017Inventors: Alejandro Antonio Becker, Tobias Christian Roeder, Helmut Schillinger, Ralf J. Terbrueggen
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Publication number: 20170001900Abstract: Processes of chamfering and/or beveling an edge of a glass substrate of arbitrary shape using lasers are described herein. Two general methods to produce chamfers on glass substrates are the first method involves cutting the edge with the desired chamfer shape utilizing an ultra-short pulse laser to create perforations within the glass; followed by an ion exchange.Type: ApplicationFiled: January 27, 2015Publication date: January 5, 2017Inventors: Sasha Marjanovic, David Andrew Pastel, Garrett Andrew Piech, Jose Mario Quintal, Helmut Schillinger, Sergio Tsuda, Robert Stephen Wagner, Andrea Nicole Yeary
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Publication number: 20160009586Abstract: Embodiments of the present method of laser cutting a laser wavelength transparent glass article comprises feeding at least one glass article to a pulsed laser assembly having at least one pulsed laser, wherein the pulsed laser defines a laser beam focal line with a length of 0.1-100 mm, the glass article being comprised of two end sections, and at least one lateral surface disposed lengthwise between the end sections. The method further comprises laser cutting at least one perforation line onto the lateral surface of the glass article while there is relative motion between the glass article and the pulsed laser and separating the glass article along the at least one perforation line to yield a laser cut glass article.Type: ApplicationFiled: July 8, 2015Publication date: January 14, 2016Inventors: Dana Craig Bookbinder, Lewis Kirk Klingensmith, Stephan Lvovich Logunov, Albert Roth Nieber, Helmut Schillinger, Pushkar Tandon, Sergio Tsuda
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Publication number: 20150360991Abstract: The application relates to a method for laser-based machining of a flat substrate (1), in particular of a wafer or glass element, to separate the substrate into a plurality of sections, in which the laser beam (2a, 2b) of a laser (3) for machining the substrate (1) is directed at the latter, characterised in that by means of an optical arrangement (6), which is positioned in the beam path of the laser (3), a laser beam focal line (2b) that is extended as viewed along the beam direction is formed on the beam output side of the optical arrangement (6) from the laser beam (2a) shone onto the optical arrangement (6), wherein the substrate (1) is positioned relative to the laser beam focal line (2b) in such a manner that an induced absorption is produced in the material of the substrate in the interior of the substrate (1) along a section (2c) of the laser beam focal line (2b) that is extended as viewed in the beam direction, by means of which absorption an induced crack formation takes place in the material of thType: ApplicationFiled: January 14, 2014Publication date: December 17, 2015Inventors: Richard Grundmueller, Helmut Schillinger