Patents by Inventor Helmut Seeburger

Helmut Seeburger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and device for resharpening saws especially used for making semiconductor wafers
    Patent number: 5144938
    Abstract: A device and method for resharpening the cutting edge of saws used in particular in the centerhole sawing of semiconductor bars. It contains a sharpening system which consists of at least one elongate sharpening stone facing the cutting edge with its end face, is movable laterally relative to the saw blade and has at the end face two working surfaces which are located opposite one another and, during sharpening, can be brought into contact laterally with the cutting-edge surface facing them. The device affords trouble-free operation and permits sharpening actions during the sawing operations.
    Type: Grant
    Filed: November 20, 1990
    Date of Patent: September 8, 1992
    Assignee: Elektronik-Grundstoffe mbH
    Inventors: Helmut Seeburger, Peter Lehfeld, Wolf-Rudiger Kurtze
  • Method of monitoring the path of an annular blade through a semiconductor material
    Patent number: 5036274
    Abstract: A plurality of eddy-current sensors are provided with covers made of silicon on the side thereof facing the saw blade, the sensors being disposed in a fixed position relative to the saw blade and at a distance from the side face saw blade which is greater than the intended wafer thickness.
    Type: Grant
    Filed: February 16, 1990
    Date of Patent: July 30, 1991
    Inventor: Helmut Seeburger