Patents by Inventor Helmut Zottl

Helmut Zottl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Metallization having high power compatibility and high electrical conductivity
    Patent number: 9728705
    Abstract: A metallization, for carrying current in an electrical component, includes a bottom layer overlying a substrate surface and includes titanium (Ti) or a titanium compound as main constituent. An upper layer overlies the bottom layer and includes copper (Cu) as main constituent. The bottom layer and the upper layer form a base layer. A top layer is in direct contact with the upper layer and includes aluminum (Al) as main constituent. The base layer further includes a middle layer, consisting of silver, that is arranged between the bottom layer and the upper layer.
    Type: Grant
    Filed: September 28, 2015
    Date of Patent: August 8, 2017
    Assignee: QUALCOMM Incorporated
    Inventors: Charles Binninger, Ulrich Knauer, Helmut Zottl, Werner Ruile, Tomasz Jewula, Rudolf Nuessl
  • Method for producing a dielectric layer on a component
    Patent number: 9394163
    Abstract: A method for producing a dielectric layer on the surface of a component is described. In particular embodiments, a dielectric layer having a planar surface can be generated over a substrate topography having raised structures. In a trimming process, a component property, which depends on the thickness or the third topography of the dielectric layer, is adjusted.
    Type: Grant
    Filed: April 13, 2011
    Date of Patent: July 19, 2016
    Assignee: EPCOS AG
    Inventors: Charles Binninger, Christoph Eggs, Bruno Fuerbacher, Ulrich Knauer, Manfred Maisch, Helmut Zottl
  • Metallization Having High Power Compatibility and High Electrical Conductivity
    Publication number: 20160020378
    Abstract: A metallization, for carrying current in an electrical component, includes a bottom layer overlying a substrate surface and includes titanium (Ti) or a titanium compound as main constituent. An upper layer overlies the bottom layer and includes copper (Cu) as main constituent. The bottom layer and the upper layer form a base layer. A top layer is in direct contact with the upper layer and includes aluminum (Al) as main constituent. The base layer further includes a middle layer, consisting of silver, that is arranged between the bottom layer and the upper layer.
    Type: Application
    Filed: September 28, 2015
    Publication date: January 21, 2016
    Inventors: Charles Binninger, Ulrich Knauer, Helmut Zottl, Werner Ruile, Tomasz Jewula, Rudolf Nuessl
  • Metallization having high power compatibility and high electrical conductivity
    Patent number: 9173305
    Abstract: A metallization can be used for components working with acoustic waves. The metallization includes a base having a bottom layer comprising titanium, and an upper layer comprising copper. A top layer of the metallization disposed on the base comprises aluminum.
    Type: Grant
    Filed: December 1, 2010
    Date of Patent: October 27, 2015
    Assignee: EPCOS AG
    Inventors: Charles Binninger, Ulrich Knauer, Helmut Zottl, Werner Ruile, Tomasz Jewula, Rudolf Nuessl
  • Method for Producing a Dielectric Layer on a Component
    Publication number: 20130126466
    Abstract: A method for producing a dielectric layer on the surface of a component is described. In particular embodiments, a dielectric layer having a planar surface can be generated over a substrate topography having raised structures. In a trimming process, a component property, which depends on the thickness or the third topography of the dielectric layer, is adjusted.
    Type: Application
    Filed: April 13, 2011
    Publication date: May 23, 2013
    Applicant: EPCOS AG
    Inventors: Charles Binninger, Christoph Eggs, Bruno Fuerbacher, Ulrich Knauer, Manfred Maisch, Helmut Zottl
  • Metallization having High Power Compatibility and High Electrical Conductivity
    Publication number: 20120280595
    Abstract: A metallization can be used for components working with acoustic waves. The metallization includes a base having a bottom layer comprising titanium, and an upper layer comprising copper. A top layer of the metallization disposed on the base comprises aluminum.
    Type: Application
    Filed: December 1, 2010
    Publication date: November 8, 2012
    Applicant: EPCOS AG
    Inventors: Charles Binninger, Ulrich Knauer, Helmut Zottl, Werner Ruile, Tomasz Jewula, Rudolf Nuessl