Abstract: A semiconductor memory storage device is disclosed. The memory comprises a plurality of storage cells for storing data each storage cell comprising an access control device for providing the storage cell with access to or isolation from a data access port in response to an access control signal, access control circuitry for transmitting the access control signal along an access control line to control a plurality of the access control devices connected to the access control line.

Abstract: A semiconductor memory storage device with a plurality of storage cells, each cell includes two access control devices, each providing the cell with access to or isolation from a respective one of two data lines in response to an access control signal provided by access control circuitry. The control devices are controlled to provide the storage cell with access to or isolation from either of the first and second of the two data lines. The access control circuitry is responsive to a data access request, the data access request being a write request, to apply a data value to be written to both of the first and second data lines and to apply the access control signal to both of the first and second access control lines.

Abstract: When switching a power supply rail for a processing circuit from a first voltage level to a second voltage level, power level detection circuitry detects when the supply voltage level reaches a predetermined voltage level. The power level detection circuitry comprises a first transistor and a second transistor which compete with one another such that the first transistor pulls a signal node voltage level at a signal node towards the supply voltage level while the second transistor pulls the signal node voltage level towards an external power supply voltage level. When the supply voltage level on the power supply rail reaches the predetermined voltage level, the first transistor overcomes the second transistor to trigger a ready signal indicating that the supply voltage level has reached the predetermined voltage level.

Abstract: An integrated circuit, method of controlling power supplied to semiconductor devices, a method of designing an integrated circuit and a computer program product are disclosed. The integrated circuit comprises: a semiconductor device for handling data; a power source for powering said semiconductor device, said power source comprising a high voltage source for supplying a high voltage level and a low voltage source for supplying a low voltage level; a plurality of switching devices arranged between at least one of the high or low voltage sources and the semiconductor device. There is also a control device for controlling a first set of the plurality of switching devices to connect one of the high or low voltage sources to the semiconductor device and for controlling a second set of the plurality of switching devices to connect the one of the high or low voltage sources to the semiconductor device.

Abstract: A semiconductor memory storage device is disclosed.

Abstract: A semiconductor memory storage device is disclosed, the memory having a plurality of storage cells.

Abstract: A semiconductor memory storage device is disclosed. The memory comprises a plurality of storage cells for storing data each storage cell comprising an access control device for providing the storage cell with access to or isolation from a data access port in response to an access control signal, access control circuitry for transmitting the access control signal along an access control line to control a plurality of the access control devices connected to the access control line.

Abstract: When switching a power supply rail for a processing circuit from a first voltage level to a second voltage level, power level detection circuitry detects when the supply voltage level reaches a predetermined voltage level. The power level detection circuitry comprises a first transistor and a second transistor which compete with one another such that the first transistor pulls a signal node voltage level at a signal node towards the supply voltage level while the second transistor pulls the signal node voltage level towards an external power supply voltage level. When the supply voltage level on the power supply rail reaches the predetermined voltage level, the first transistor overcomes the second transistor to trigger a ready signal indicating that the supply voltage level has reached the predetermined voltage level.

Abstract: An integrated circuit memory includes multiple memory banks grouped into repair groups Group0, Group1. One memory has redundant rows which can be used to substitute for a defective row found within any of the memory banks within the common repair group concerned. Redundant columns of memory cells may be substituted for defective columns by multiplexing circuitry. This multiplexing circuitry shifts the bit lines selected to form part of a bit group to access a given data bit by an amount less than the multiplexing width being supported by that multiplexing circuitry thereby reducing the number of redundant columns which need be provided.

Abstract: An integrated circuit, method of controlling power supplied to semiconductor devices, a method of designing an integrated circuit and a computer program product are disclosed. The integrated circuit comprises: a semiconductor device for handling data; a power source for powering said semiconductor device, said power source comprising a high voltage source for supplying a high voltage level and a low voltage source for supplying a low voltage level; a plurality of switching devices arranged between at least one of the high or low voltage sources and the semiconductor device. There is also a control device for controlling a first set of the plurality of switching devices to connect one of the high or low voltage sources to the semiconductor device and for controlling a second set of the plurality of switching devices to connect the one of the high or low voltage sources to the semiconductor device.

Abstract: A semiconductor memory storage device is disclosed.

Abstract: An integrated circuit memory is described having multiple memory banks which are grouped into repair groups Group0, Group1. One of the memory banks is provided with redundant rows which can be used to substitute for a defective row found within any of the memory banks within the common repair group concerned. Redundant columns of memory cells are also provided and these may be substituted for defective columns by multiplexing circuitry. This multiplexing circuitry shifts the bit lines which are selected to form part of a bit group to access a given data bit by an amount less than the multiplexing width being supported by that multiplexing circuitry thereby reducing the number of redundant columns which need be provided.

Abstract: An integrated circuit memory is described having multiple memory banks which are grouped into repair groups Group0, Group1. One of the memory banks is provided with redundant rows which can be used to substitute for a defective row found within any of the memory banks within the common repair group concerned. Redundant columns of memory cells are also provided and these may be substituted for defective columns by multiplexing circuitry. This multiplexing circuitry shifts the bit lines which are selected to form part of a bit group to access a given data bit by an amount less than the multiplexing width being supported by that multiplexing circuitry thereby reducing the number of redundant columns which need be provided.

Abstract: A memory cell includes polysilicon gates 2 running in a first direction. A sequence of layers metal lines includes a layer of bit lines 4 running in a second direction substantially orthogonal to the first direction followed by data lines 6 running in that second direction and then word lines 8 running in the first direction. The data lines 6 are precharged to a value which is held whilst the bit lines 4 are being used to sense data values stored within a memory cell.

Abstract: A system, method and computer program product are provided for producing an instance of a memory device from a banked memory architecture. The banked memory architecture specifies a maximum number of memory banks and a maximum number of rows per memory bank. The method comprises the step of receiving input parameters indicating a number of properties of the memory device, the properties comprising at least a number of rows R for the memory device. Thereafter, a degeneration process is performed on the banked memory architecture in order to produce the instance of a memory device having those properties.

Abstract: An integrated circuit memory 2 is described having multiple memory banks 4, 6, 8, 10, 12, 14, 16, 18 which are grouped into repair groups Group0, Group1. One of the memory banks 4, 18 is provided with redundant rows 20, 22 which can be used to substitute for a defective row 30, 32, 34 found within any of the memory banks within the common repair group concerned. Redundant columns of memory cells 60, 62 are also provided and these may be substituted for defective columns 66, 68 by multiplexing circuitry 56, 58. This multiplexing circuitry shifts the bit lines which are selected to form part of a bit group to access a given data bit by an amount less than the multiplexing width being supported by that multiplexing circuitry 56, 58 thereby reducing the number of redundant columns which need be provided.

Abstract: A system, method and computer program product are provided for producing an instance of a memory device from a banked memory architecture. The banked memory architecture specifies a maximum number of memory banks and a maximum number of rows per memory bank. The method comprises the step of receiving input parameters indicating a number of properties of the memory device, the properties comprising at least a number of rows R for the memory device. Thereafter, a degeneration process is performed on the banked memory architecture in order to produce the instance of a memory device having those properties.

Abstract: An integrated circuit memory includes memory cells 2 is connected to a power supply Vdd via a power supply control circuit 4. The power supply control circuit includes a first gate 26 and a second gate 28. The first gate 26 is switched by a write assist circuit so as to be non-conductive when writing to the memory cell 2. The second gate 28 is conductive both when writing to the memory cell 2 and when not writing to the memory cell 2. Accordingly, when a write operation is made a relatively high resistance path is formed through the power supply control circuit 4 compared to when writing is not being performed. This increase in the resistance through the power supply control circuit 4 during write operations induces a dip in the virtual supply voltage provided at the supply output of the power supply control circuit 4 in a manner which assist writes to be made.

Abstract: A memory cell is provided having polysilicon gates 2 running in a first direction. A sequence of layers metal lines are provided including layer of bit lines 4 running in a second direction substantially orthogonal to the first direction followed data lines 6 running in that second direction and then word lines 8 running in the first direction. The data lines 6 are precharged to a value which is held whilst the bit lines 4 are being used to sense data values stored within a memory cell.