Patents by Inventor Hemant Desai

Hemant Desai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220196507
    Abstract: An apparatus is described. The apparatus includes a cover to enclose a junction between respective ends of first and second fluidic conduits. The first and second fluidic conduits transport a coolant fluid within an electronic system. The apparatus also includes a leak detection device to be located within a region that is enclosed by the cover when the junction is enclosed by the cover. The leak detection device is to detect a leak of the coolant fluid at the junction when the junction is enclosed by the cover. The first and second fluidic conduits extend outside the cover when the junction is enclosed by the cover. Another apparatus is also described. The other apparatus includes a leak detection device to detect a leak of coolant fluid from a specific component or junction in a liquid cooling system of an electronic system.
    Type: Application
    Filed: December 23, 2020
    Publication date: June 23, 2022
    Inventors: Prabhakar SUBRAHMANYAM, Yi XIA, Ying-Feng PANG, Victor POLYANKO, Mark BIANCO, Bijoyraj SAHU, Minh T.D. LE, Carlos ALVIZO FLORES, Javier AVALOS GARCIA, Adriana LOPEZ INIGUEZ, Luz Karine SANDOVAL GRANADOS, Michael BERKTOLD, Damion SEARLS, Jin YANG, David SHIA, Samer MELHEM, Jeffrey Ryan CONNER, Hemant DESAI, John RAATZ, Richard DISCHLER, Bergen ANDERSON, Eric W. BUDDRIUS, Kenan ARIK, Barrett M. FANEUF, Lianchang DU, Yuehong FAN, Shengzhen ZHANG, Yuyang XIA, Jun ZHANG, Yuan Li, Catharina BIBER, Kristin L. WELDON, Brendan T. PAVELEK
  • Patent number: 9726689
    Abstract: The invention relates to sensors, and more particularly, a sensor device having accelerometer and gyroscope integrated into a low cost compact package. The device includes: MEMs wafer; and an ASIC wafer bonded to the MEMs wafer; a wafer-level-package redistribution layer (WLP RDL) formed on a surface of the ASIC wafer; and a ball grid array having a plurality of solder balls that electrically connect the package to a circuit board. The MEMs wafer includes the accelerometer and gyroscope, while the ASIC wafer includes two separate cavities corresponding to the accelerometer and gyroscope, respectively. The ASIC wafer includes electrical circuits/components to process the readout signals received from the accelerometer and gyroscope.
    Type: Grant
    Filed: October 30, 2013
    Date of Patent: August 8, 2017
    Assignee: Hanking Electronics Ltd.
    Inventors: Hemant Desai, Peter Harper, Demetre Kondylis
  • Publication number: 20170053405
    Abstract: Methods and systems for calibrating a medical imaging system based on visual feedback are described. A method includes projecting one or more points of a target area (real world) of the medical imaging system as an overlay on the feedback frame, wherein the feedback frame is an image of the target area captured by an imaging device of a visual feedback system. One or more points of the target area are then located on the feedback frame. Further, the method includes improving calibration accuracy of the medical imaging system by minimizing difference between one or more projected points and one or more point located on the feedback frame below a predefined threshold. The difference is minimized via an iterative error correction mechanism.
    Type: Application
    Filed: August 22, 2016
    Publication date: February 23, 2017
    Inventors: Nikunj Hemant DESAI, Aditya BHARDWAJ, Gaurav SHARMA
  • Patent number: 9409765
    Abstract: The present invention relates to a method and apparatus for an isolating structure. Embodiments of the present invention provide a robust packaging process and a mechanical filter to reduce the mechanical shock from impact. The mechanical filter can be integrated within the package substrate as part of the packaging process, reducing the assembly complexity.
    Type: Grant
    Filed: February 1, 2013
    Date of Patent: August 9, 2016
    Assignee: Maxim Integrated Products, Inc.
    Inventors: Hemant Desai, Viresh P. Patel
  • Patent number: 9250262
    Abstract: This invention relates generally to semiconductor manufacturing and packaging and more specifically to semiconductor manufacturing in MEMS (Microelectromechanical systems) inertial sensing products. Embodiments of the present invention provide a robust packaging process and a mechanical filter to reduce the mechanical shock from impact. The mechanical filter can be integrated within the package substrate as part of the packaging process, reducing the assembly complexity.
    Type: Grant
    Filed: February 1, 2013
    Date of Patent: February 2, 2016
    Assignee: Maxim Integrated Products, Inc.
    Inventors: Hemant Desai, Viresh P. Patel
  • Publication number: 20150338112
    Abstract: A system for providing one of heating and cooling in an indoor area is disclosed. The system includes one or more monolithic radiant panels. The one or more monolithic radiant panels include a tubular portion for circulating fluid. The circulation of fluid enables heating or cooling of the indoor area. The one or more monolithic radiant panels also include two co-planar fin portions that are arranged diametrically opposite to each other about a periphery of the tubular portion. Either one of the two co-planar fin portions are configured to be attached with a surface of the indoor area at an angle.
    Type: Application
    Filed: August 19, 2014
    Publication date: November 26, 2015
    Inventors: Rohan M. Parikh, Sagar Narayana Murthy, Vegesana Venkata Satya Suryanarayana Raju, Manoj Bhaskar Hegde, Punit Hemant Desai
  • Patent number: 8692337
    Abstract: A device being a micro-system and/or a nano-system which includes a first substrate, having at least one lower electrode and at least one dielectric layer, and includes an intermediate substrate extending across a main plane of the device and including a moving portion. The intermediate substrate is attached, outside the moving portion, by molecular bonding to the first substrate. The moving portion faces at least a portion of the lower electrode. The device also includes an upper substrate, attached to the intermediate substrate. The moving portion is movable between the lower electrode and the upper substrate. The first, intermediate, and upper substrates extend in a plane parallel to the main plane of the device. The lower electrode detects a component of the movement of the moving portion perpendicular to the plane of the device.
    Type: Grant
    Filed: July 11, 2012
    Date of Patent: April 8, 2014
    Assignees: Commissariat a l'energie atomique et aux energies alternatives, FREESCALE Semiconductor Inc
    Inventors: Audrey Berthelot, Vincent Larrey, Jean-Philippe Polizzi, Marie-Hélène Vaudaine, Hemant Desai, Woo Tae Park
  • Publication number: 20130175643
    Abstract: A device is described of the micro-system and/or nano-system type including: a first substrate, including at least one electrode, called the lower electrode, and at least one dielectric layer, an intermediate substrate, extending across a plane, called the main plane of the device, including a moving portion, an upper substrate, attached to the intermediate substrate, where the said moving portion can be made to move between the lower electrode and the upper substrate.
    Type: Application
    Filed: July 11, 2012
    Publication date: July 11, 2013
    Applicants: FREESCALE SEMICONDUCTOR, Inc., COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE ALT
    Inventors: Audrey Berthelot, Vincent Larrey, Jean-Philippe Polizzi, Marie-Helene Vaudaine, Hemant Desai, Woo Tae Park
  • Publication number: 20070090474
    Abstract: A MEMS device and method of fabrication including a plurality of structural tie bars for added structural integrity. The MEMS device includes an active layer and a substrate having an insulating material formed therebetween, first and second pluralities of stationary electrodes and a plurality of moveable electrodes in the active layer. A plurality of interconnects are electrically coupled to a second surface of each of the first and second pluralities of stationary electrodes. A plurality of anchors fixedly attach a first surface of each of the first and second pluralities of stationary electrodes to the substrate. A first structural tie bar couples a second surface of each of the first plurality of stationary electrodes and a second structural tie bar couples a second surface of each of the second plurality of stationary electrodes.
    Type: Application
    Filed: September 8, 2005
    Publication date: April 26, 2007
    Inventors: Gary Li, Bishnu Gogoi, Hemant Desai, Jonathan Hammond, Bernard Diem
  • Publication number: 20060286707
    Abstract: A MEMS device (100) is provided that includes a handle layer (108) having a sidewall (138), a cap (132) overlying said handle layer (108), said cap (132) having a sidewall (138), and a conductive material (136) disposed on at least a portion of said sidewall of said cap (138) and said sidewall of said handle layer (138) to thereby electrically couple said handle layer (108) to said cap (132). A wafer-level method for manufacturing the MEMS device from a substrate (300) comprising a handle layer (108) and a cap (132) overlying the handle layer (108) is also provided. The method includes making a first cut through the cap (132) and at least a portion of the substrate (300) to form a first sidewall (138), and depositing a conductive material (136) onto the first sidewall (138) to electrically couple the cap (132) to the substrate (300).
    Type: Application
    Filed: June 21, 2005
    Publication date: December 21, 2006
    Inventors: Stephen Hooper, Hemant Desai, William McDonald, Arvind Salian
  • Publication number: 20060286706
    Abstract: Methods have been provided for forming a micro-electromechanical systems (“MEMS”) device (100) from a substrate (500) comprising a handle layer (108) and a cap (132) overlying the handle layer (108). In one exemplary embodiment, the method includes cutting through the substrate (500) to separate the substrate (500) into a first die (148) and a second die (150), the first die (148) having a first sidewall (138), and depositing a conductive material (182) onto the first sidewall (138) to electrically couple the cap (132) to the handle layer (108).
    Type: Application
    Filed: June 21, 2005
    Publication date: December 21, 2006
    Inventors: Arvind Salian, Hemant Desai, Stephen Hooper, William McDonald