Patents by Inventor Hemant Mahesh SHAH

Hemant Mahesh SHAH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Pressure features to alter the shape of a socket
    Patent number: 11569596
    Abstract: Systems, apparatus, and/or processes directed to applying pressure to a socket to alter a shape of the socket to improve a connection between the socket and a substrate, printed circuit board, or other component. The socket may receive one or more chips, may be an interconnect, or may be some other structure that is part of a package. The shape of the socket may be flattened so that a side of the socket may form a high-quality physical and electrical coupling with the substrate.
    Type: Grant
    Filed: March 27, 2020
    Date of Patent: January 31, 2023
    Assignee: Intel Corporation
    Inventors: Steven A. Klein, Kuang Liu, Srikant Nekkanty, Feroz Mohammad, Donald Tiendung Tran, Srinivasa Aravamudhan, Hemant Mahesh Shah, Alexander W. Huettis
  • MULTIPLE METAL LAYERS WITHIN A PHOTONICS INTEGRATED CIRCUIT FOR THERMAL TRANSFER
    Publication number: 20220416503
    Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to thermal routing techniques within a hybrid silicon laser or photonics integrated circuit to facilitate heat extraction during laser operation. In particular dual metal layers, with a top metal layer thermally coupled with P node above a quantum well and extending substantially under a heat sink, and a bottom metal layer thermally coupled with an N node, where the top metal layer and the bottom metal layer are not electrically coupled. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: June 24, 2021
    Publication date: December 29, 2022
    Inventors: Priyanka DOBRIYAL, Aditi MALLIK, Saeed FATHOLOLOUMI, Ankur AGRAWAL, Anna PRAKASH, Hemant Mahesh SHAH, Raiyomand ASPANDIAR, Neil Raymund CARANTO
  • PRESSURE FEATURES TO ALTER THE SHAPE OF A SOCKET
    Publication number: 20210305731
    Abstract: Systems, apparatus, and/or processes directed to applying pressure to a socket to alter a shape of the socket to improve a connection between the socket and a substrate, printed circuit board, or other component. The socket may receive one or more chips, may be an interconnect, or may be some other structure that is part of a package. The shape of the socket may be flattened so that a side of the socket may form a high-quality physical and electrical coupling with the substrate.
    Type: Application
    Filed: March 27, 2020
    Publication date: September 30, 2021
    Inventors: Steven A. KLEIN, Kuang LIU, Srikant NEKKANTY, Feroz MOHAMMAD, Donald Tiendung TRAN, Srinivasa ARAVAMUDHAN, Hemant Mahesh SHAH, Alexander W. HUETTIS