Patents by Inventor HEMANT MARTAND DIXIT

HEMANT MARTAND DIXIT has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Photonic devices integrated with thermally conductive layers
    Patent number: 11934021
    Abstract: The disclosed subject matter relates to semiconductor devices for use in optoelectronic/photonic applications and integrated circuit (IC) chips. More particularly, the present disclosure relates to photonic devices having thermally conductive layers for the removal of heat from optoelectronic components in the photonic devices.
    Type: Grant
    Filed: January 27, 2022
    Date of Patent: March 19, 2024
    Assignee: GlobalFoundries U.S. Inc.
    Inventors: Hemant Martand Dixit, William J. Taylor, Jr., Yusheng Bian, Theodore Letavic, Oscar D. Restrepo
  • PHOTONIC DEVICES INTEGRATED WITH THERMALLY CONDUCTIVE LAYERS
    Publication number: 20230236361
    Abstract: The disclosed subject matter relates to semiconductor devices for use in optoelectronic/photonic applications and integrated circuit (IC) chips. More particularly, the present disclosure relates to photonic devices having thermally conductive layers for the removal of heat from optoelectronic components in the photonic devices.
    Type: Application
    Filed: January 27, 2022
    Publication date: July 27, 2023
    Inventors: HEMANT MARTAND DIXIT, WILLIAM J. TAYLOR, JR., YUSHENG BIAN, THEODORE LETAVIC, OSCAR D. RESTREPO