Patents by Inventor Hemraj Hingarh

Hemraj Hingarh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thick bus metallization interconnect structure to reduce bus area
    Patent number: 5111276
    Abstract: There is disclosed a structure for self aligned and non-self aligned power and ground buses and interconnects for integrated circuits which are thicker than normal conductors. This enables them to withstand higher current densities without adverse electromigration effects. There is also disclosed a method for making such structures.
    Type: Grant
    Filed: November 19, 1990
    Date of Patent: May 5, 1992
    Assignee: National Semiconductor Corp.
    Inventors: Hemraj Hingarh, Andres D. Asuncion, Michael Thomas, Robert Brown