Patents by Inventor Hen Sanchez

Hen Sanchez has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Die stacking system and method
    Patent number: 7872356
    Abstract: Die stacking systems and methods are disclosed. In an embodiment, a die has a surface that includes a passivation area, at least one conductive bond pad area, and a conductive stacked die receiving area sized to receive at least a second die.
    Type: Grant
    Filed: December 26, 2007
    Date of Patent: January 18, 2011
    Assignee: QUALCOMM Incorporated
    Inventors: Hen Sanchez, Laxminarayan Sharma