Patents by Inventor Hena Pyada

Hena Pyada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Low temperature fireable thick film silver paste
    Patent number: 8790550
    Abstract: The present invention is directed to an electroconductive thick film paste composition comprising Ag and a Pb-free bismuth-tellurium oxide both dispersed in an organic medium, wherein the paste is fireable at temperatures below 420° C. The paste is especially useful for forming electrodes on substrates such as glass or films, particularly electrochromic glass or films, that would be damaged by higher firing temperatures. The present invention is further directed to a device comprising an electrode formed from the paste composition and, in particular, to an electrochromic device comprising such an electrode.
    Type: Grant
    Filed: May 15, 2012
    Date of Patent: July 29, 2014
    Assignee: E I du Pont de Nemours and Company
    Inventors: Kenneth Warren Hang, Hena Pyada, Howard T Sawhill, Michael A. Skurski, Robert Paul Waldrop
  • LOW TEMPERATURE FIREABLE THICK FILM SILVER PASTE
    Publication number: 20120305859
    Abstract: The present invention is directed to an electroconductive thick film paste composition comprising Ag and a Ph-free Bi-based glass frit both dispersed in an organic medium, wherein the paste is fireable at temperatures below 420° C. The paste is especially useful for forming electrodes on substrates such as glass or films, particularly electrochromic glass or films, that would be damaged by higher firing temperatures. The present invention is further directed to a device comprising an electrode formed from the paste composition and, in particular, to an electrochromic device comprising such an electrode.
    Type: Application
    Filed: May 15, 2012
    Publication date: December 6, 2012
    Applicant: E I DU PONT DE NEMOURS AND COMPANY
    Inventors: Kenneth Warren Hang, Hena Pyada, Howard T. Sawhill, Michael A. Skurski, Robert Paul Waldrop
  • LOW TEMPERATURE FIREABLE THICK FILM SILVER PASTE
    Publication number: 20120305858
    Abstract: The present invention is directed to an electroconductive thick film paste composition comprising Ag and a Pb-free bismuth-tellurium oxide both dispersed in an organic medium, wherein the paste is fireable at temperatures below 420° C. The paste is especially useful for forming electrodes on substrates such as glass or films, particularly electrochromic glass or films, that would be damaged by higher firing temperatures. The present invention is further directed to a device comprising an electrode formed from the paste composition and, in particular, to an electrochromic device comprising such an electrode.
    Type: Application
    Filed: May 15, 2012
    Publication date: December 6, 2012
    Applicant: E I DU PONT DE NEMOURS AND COMPANY
    Inventors: KENNETH WARREN HANG, HENA PYADA, HOWARD T. SAWHILL, MICHAEL A. SKURSKI, ROBERT PAUL WALDROP
  • Printed circuit boards having embedded thick film capacitors
    Publication number: 20060254812
    Abstract: A method of forming printed wiring boards having embedded thick-film capacitors includes covering capacitor layers with a protective coating prior to etching to prevent etching solutions from contacting with and damaging the capacitor layers and forming vias directly between the capacitor electrodes and the board circuitry.
    Type: Application
    Filed: July 14, 2006
    Publication date: November 16, 2006
    Inventors: William Borland, Saul Ferguson, Hena Pyada
  • Methods of forming printed circuit boards having embedded thick film capacitors
    Patent number: 7100277
    Abstract: A method of forming printed wiring boards having embedded thick-film capacitors includes covering capacitor layers with a protective coating prior to etching to prevent etching solutions from contacting with and damaging the capacitor layers and forming vias directly between the capacitor electrodes and the board circuitry.
    Type: Grant
    Filed: July 1, 2004
    Date of Patent: September 5, 2006
    Assignee: E. I. du Pont de Nemours and Company
    Inventors: William J. Borland, Saul Ferguson, Hena Pyada
  • Thick film capacitors, embedding thick-film capacitors inside printed circuit boards, and methods of forming such capacitors and printed circuit boards
    Publication number: 20060002097
    Abstract: A method of embedding thick-film capacitors includes covering capacitor layers with a protective coating prior to etching to prevent etching solutions from coming in contact with and damaging the capacitor layers.
    Type: Application
    Filed: July 1, 2004
    Publication date: January 5, 2006
    Inventors: William Borland, Saul Ferguson, Hena Pyada