Patents by Inventor Henan Liu

Henan Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240078750
    Abstract: A parameterization method for point cloud data, and a device includes performing semantic segmentation on a plurality of three-dimensional data points of point cloud data in a spatial coordinate system to obtain at least one semantic object, the at least one semantic object corresponds to a plurality of three-dimensional semantic data points. The parameterization method for point cloud data further includes performing parametric fitting on the plurality of three-dimensional semantic data points to obtain spatial geometric parameters of the at least one semantic object corresponding to the plurality of three-dimensional semantic data points in the spatial coordinate system. In addition, a map construction method is further provided. By adopting the above technical solution, the automation of constructing a semantic map based on the point cloud data can be achieved.
    Type: Application
    Filed: September 5, 2023
    Publication date: March 7, 2024
    Inventors: Guangwei LIU, Henan ZHOU, Naiyan WANG
  • Publication number: 20220152873
    Abstract: A variable-step-distance micro-milling repair cutter path generating method for damage points on a surface of an optical crystal related to a field of optical material and optical element surface repair and includes steps of establishing a mathematical model of a repair profile; determining discrete contact points between a cutter and the repair profile to obtain a cutter contact control point set by a GPR path generating method to control a movement trend of a pseudo-random path; interpolating the cutter position control point set into a spatial curve by a NURBS modeling method; creating a UG curve in a UG software according to the mathematical model, and using the UG curve as the repair path to perform a machining process simulation. The method has good elimination effects on cutter marks with constant period and improves the ability of the KDP crystal to resist strong laser damage.
    Type: Application
    Filed: November 12, 2021
    Publication date: May 19, 2022
    Inventors: Jian Cheng, Mingjun Chen, Wenqiang Wu, Qi Liu, Hao Yang, Linjie Zhao, Chao Tan, Xumeng Cheng, Henan Liu, Tingzhang Wang