Patents by Inventor Hendrick Pieter De Bock

Hendrick Pieter De Bock has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat transfer system for a light emitting diode (LED) lamp
    Patent number: 8651708
    Abstract: A heat transfer system is provided for a LED lamp. The LED lamp includes a board surface to supply heat energy during an operation of the LED lamp. The LED lamp is mounted within a recessed housing that separates a first area having a first temperature from a second area having a second temperature, where the second temperature is lower than the first temperature. The system includes a thermal dissipator positioned within the second area. The system further includes a heat transfer device with a first end mounted to the board surface, and a second end mounted to the thermal dissipator, to transfer the heat energy from the board surface in the first area to the thermal dissipator in the second area, and dissipate the heat energy within the second area.
    Type: Grant
    Filed: June 25, 2010
    Date of Patent: February 18, 2014
    Assignee: General Electric Company
    Inventors: Yogen Vishwas Utturkar, Todd Wetzel, Mehmet Arik, Hendrick Pieter De Bock
  • Heat Transfer System For A Light Emitting Diode (LED) Lamp
    Publication number: 20110242826
    Abstract: A heat transfer system is provided for a LED lamp. The LED lamp includes a board surface to supply heat energy during an operation of the LED lamp. The LED lamp is mounted within a recessed housing that separates a first area having a first temperature from a second area having a second temperature, where the second temperature is lower than the first temperature. The system includes a thermal dissipator positioned within the second area. The system further includes a heat transfer device with a first end mounted to the board surface, and a second end mounted to the thermal dissipator, to transfer the heat energy from the board surface in the first area to the thermal dissipator in the second area, and dissipate the heat energy within the second area.
    Type: Application
    Filed: June 25, 2010
    Publication date: October 6, 2011
    Inventors: Yogen Vishwas Utturkar, Todd Wetzel, Mehmet Arik, Hendrick Pieter De Bock