Abstract: An integrated capillary electrophoresis system comprising a universal interface is disclosed. The universal interface includes one or more of the following structural elements: a chip assembly that receives a capillary electrophoresis CE chip; a fluidic interface for coupling fluids between the chip assembly and external sources or destinations; a first electrical interface for coupling power from an external source to the chip assembly; a second electrical interface for coupling electrical signals from the chip assembly to external analysis electronics; an optical interface for coupling optical signals between the chip assembly and external sources or destinations; and a docking station for uniting and spatially locating the various other structural elements.

Abstract: An integrated capillary electrophoresis system comprising a universal interface is disclosed. The universal interface includes one or more of the following structural elements: a chip assembly that receives a capillary electrophoresis CE chip; a fluidic interface for coupling fluids between the chip assembly and external sources or destinations; a first electrical interface for coupling power from an external source to the chip assembly; a second electrical interface for coupling electrical signals from the chip assembly to external analysis electronics; an optical interface for coupling optical signals between the chip assembly and external sources or destinations; and a docking station for uniting and spatially locating the various other structural elements.

Abstract: An integrated capillary electrophoresis system comprising a universal interface is disclosed. The universal interface includes one or more of the following structural elements: a chip assembly that receives a capillary electrophoresis CE chip; a fluidic interface for coupling fluids between the chip assembly and external sources or destinations; a first electrical interface for coupling power from an external source to the chip assembly; a second electrical interface for coupling electrical signals from the chip assembly to external analysis electronics; an optical interface for coupling optical signals between the chip assembly and external sources or destinations; and a docking station for uniting and spatially locating the various other structural elements.

Abstract: An integrated capillary electrophoresis system comprising a universal interface is disclosed. The universal interface includes one or more of the following structural elements: a chip assembly that receives a capillary electrophoresis CE chip; a fluidic interface for coupling fluids between the chip assembly and external sources or destinations; a first electrical interface for coupling power from an external source to the chip assembly; a second electrical interface for coupling electrical signals from the chip assembly to external analysis electronics; an optical interface for coupling optical signals between the chip assembly and external sources or destinations; and a docking station for uniting and spatially locating the various other structural elements.

Abstract: An optical switch and method of making in which a large number of optical elements, which may be diffractive or refractive, are formed within the plane of a wafer to transmit light approximately perpendicularly to the wafer plane. The optical elements are formed on separate deformable mechanical elements, such as a plate rotatable about two axes lying approximately parallel to the wafer plane. Electrical elements, such as capacitor plates with a free-space gap therebetween selectively deform the mechanical elements in a micro electromechanical system (MEMS) arrangement with the optical elements disposed upon the mechanical elements to separately control the directions in which the light beams are transmitted. The optical switches may be formed in an array, and two levels of such arrays formed in separate wafers which are bonded together allow two-stage switching of light through the assembled structure.

Abstract: An optical switch and method of making in which a large number of optical elements, which may be diffractive or refractive, are formed within the plane of a wafer to transmit light approximately perpendicularly to the wafer plane. The optical elements are formed on separate deformable mechanical elements, such as a plate rotatable about two axes lying approximately parallel to the wafer plane. Electrical elements, such as capacitor plates with a free-space gap therebetween selectively deform the mechanical elements in a micro electromechanical system (MEMS) arrangement with the optical elements disposed upon the mechanical elements to separately control the directions in which the light beams are transmitted. The optical switches may be formed in an array, and two levels of such arrays formed in separate wafers which are bonded together allow two-stage switching of light through the assembled structure.