Abstract: An apparatus includes an electric motor including a stator and a translator; a three-phase inverter electrically coupled to the electric motor; a power source electrically coupled to the three-phase inverter; and a controller communicatively coupled to the three-phase inverter. The controller is programmed to determine at least three measurements at different times of flux linkage from the electric motor, represent the measurements in Clarke coordinates, determine Clarke coordinates of a center of a circle defined by the Clarke coordinates of the measurements, and determine a position of the translator relative to the stator based on the Clarke coordinates of the center of the circle.

Abstract: An apparatus includes an electric motor including a stator and a translator; a three-phase inverter electrically coupled to the electric motor; a power source electrically coupled to the three-phase inverter; and a controller communicatively coupled to the three-phase inverter. The controller is programmed to determine at least three measurements at different times of flux linkage from the electric motor, represent the measurements in Clarke coordinates, determine Clarke coordinates of a center of a circle defined by the Clarke coordinates of the measurements, and determine a position of the translator relative to the stator based on the Clarke coordinates of the center of the circle.

Abstract: The present invention relates to a device (1) for controlling a power converter (100), the device (1) comprising: a sensor module (10), which is configured to measure an inductor current (i_L) through an inductor of the power converter (100); a compensation module (20), which is configured to generate a compensation waveform (i_c); and an operating module (30), which is configured to provide a continuous conduction mode current signal (i_CCM) based on the compensation waveform (i_c) and of the inductor current (i_L) and which is configured to control the power converter (100) based on the provided continuous conduction mode current signal (i_CCM).

Abstract: The present invention relates to a device (1) for estimating an average value of an inductor current for switched-mode power converters (100), the device (1) comprising: a sensor (10), which is configured to measure an inductor voltage (v_L) and an inductor current (i_L); a ripple-suppressor (20), which is configured to provide an estimated inductor current ripple (EIR) based on the measured inductor voltage (v_L); and a current-corrector (30), which is configured to provide a corrected inductor current (i_Lc) based on the estimated inductor current ripple (EIR) and the measured inductor current (i_L).

Abstract: The invention describes a printed circuit board with a top side and a bottom side, the printed circuit board comprising at least two electrically conductive layers (112, 114, 116, 212, 214, 312, 314, 212i, 214i, 212j, 214j) for transmitting electrical current and at least one electrically insulating layer (102, 104, 106, 108, 202, 204, 302, 304, 202i, 204i, 202j, 204j) comprising electrically insulating material, wherein the electrically conductive layers (112, 114, 116, 212, 214, 312, 314, 212i, 214i, 212j, 214j) and the electrically insulating layer (102, 104, 106, 108, 202, 204, 302, 304, 202i, 204i, 202j, 204j) are arranged in an alternating assembly such that the two electrically conductive layers (112, 114, 116, 212, 214, 312, 314, 212i, 214i, 212j, 214j) are electrically insulated with respect to each other by means of the electrically insulating layer (102, 104, 106, 108, 202, 204, 302, 304, 202i, 204i, 202j, 204j), wherein each of the electrically conductive layers (112, 114, 116, 212, 214, 312, 314,

Abstract: The present invention relates to a device (1) for controlling a power converter (100), the device (1) comprising: a sensor module (10), which is configured to measure an inductor current (i_L) through an inductor of the power converter (100); a compensation module (20), which is configured to generate a compensation waveform (i_c); and an operating module (30), which is configured to provide a continuous conduction mode current signal (i_CCM) based on the compensation waveform (i_c) and of the inductor current (i_L) and which is configured to control the power converter (100) based on the provided continuous conduction mode current signal (i_CCM).

Abstract: The invention describes a printed circuit board with a top side and a bottom side, the printed circuit board comprising at least two electrically conductive layers (112, 114, 116, 212, 214, 312, 314, 212i, 214i, 212j, 214j) for transmitting electrical current and at least one electrically insulating layer (102, 104, 106, 108, 202, 204, 302, 304, 202i, 204i, 202j, 204j) comprising electrically insulating material, wherein the electrically conductive layers (112, 114, 116, 212, 214, 312, 314, 212i, 214i, 212j, 214j) and the electrically insulating layer (102, 104, 106, 108, 202, 204, 302, 304, 202i, 204i, 202j, 204j) are arranged in an alternating assembly such that the two electrically conductive layers (112, 114, 116, 212, 214, 312, 314, 212i, 214i, 212j, 214j) are electrically insulated with respect to each other by means of the electrically insulating layer (102, 104, 106, 108, 202, 204, 302, 304, 202i, 204i, 202j, 204j), wherein each of the electrically conductive layers (112, 114, 116, 212, 214, 312, 314,

Abstract: A substrate holder for a lithographic apparatus has a planarization layer provided on a surface thereof. The planarization layer provides a smooth surface for the formation of a thin film stack forming an electronic component. The thin film stack comprises an (optional) isolation layer, a metal layer forming an electrode, a sensor, a heater, a transistor or a logic device, and a top isolation layer.

Abstract: The present invention relates to a control device (1) for a multiple-input multiple-output converter (100) comprising: a first transformation block controller (21), which is configured to split outputs of the multiple-input multiple-output converter (100) into independent sets of outputs representing at least two independent virtual converters (100-1, 100-2, . . . , 100-n); a first converter controller (10), which is configured to control a first virtual converter (100-1) of the at least two independent virtual converters (100-1, 100-2, . . . , 100-n) by providing a first controlling signal based on the independent sets of outputs; a second converter controller (30), which is configured to control a second virtual converter (100-2) of the at least two independent virtual converters (100-1, 100-2, . . .

Abstract: The present invention relates to a device (1) for estimating an average value of an inductor current for switched-mode power converters (100), the device (1) comprising: a sensor (10), which is configured to measure an inductor voltage (v_L) and an inductor current (i_L); a ripple-suppressor (20), which is configured to provide an estimated inductor current ripple (EIR) based on the measured inductor voltage (v_L); and a current-corrector (30), which is configured to provide a corrected inductor current (i_Lc) based on the estimated inductor current ripple (EIR) and the measured inductor current (i_L).

Abstract: A substrate holder for a lithographic apparatus has a planarization layer provided on a surface thereof. The planarization layer provides a smooth surface for the formation of a thin film stack forming an electronic component. The thin film stack comprises an (optional) isolation layer, a metal layer forming an electrode, a sensor, a heater, a transistor or a logic device, and a top isolation layer.

Abstract: A substrate holder for a lithographic apparatus has a planarization layer provided on a surface thereof. The planarization layer provides a smooth surface for the formation of a thin film stack forming an electronic component. The thin film stack comprises an (optional) isolation layer, a metal layer forming an electrode, a sensor, a heater, a transistor or a logic device, and a top isolation layer.

Abstract: A power converter for powering a gradient coil (22) of a magnetic resonance examination system, comprising: a plurality of essentially identical switching cells (14, 16, 18), each switching cell (14, 16, 18) having a plurality of switching members (52) that are provided to switch between a conducting state configuration and an essentially non-conducting state configuration, and the switching cells (14, 16, 18) being provided to switch at at least a fundamental switching frequency fSW and in a pre-determined temporal relationship to each other, a pulse control unit (20) provided to control the pre-determined temporal relationship of switching of the switching cells (14, 16, 18) by providing switching pulses to the switching members (52) of the switching cells (14, 16, 18), wherein the pulse control unit (20) is provided to determine a correction for the pre-determined temporal relationship of the switching of the switching cells (14, 16, 18) from at least one electrical quantity each of each one of the plurali

Abstract: The present invention relates to a switched-mode power supply apparatus and a corresponding method. For an effective compensation of non-linearities caused by dead-time and voltage drops in the switching power amplifier of the apparatus, an apparatus is proposed comprising a switching power amplifier (14) for amplifying a signal supplied by an external signal source (11) and for supplying a load voltage and/or load current to a load (15), and a control unit (12; 12b) for controlling the switching of said switching power amplifier based on a timing setting, said control unit being adapted for simulating the behavior of the switching power amplifier by predicting the average load voltage and/or load current for at least two, in particular a plurality of, timing settings for a desired load voltage and/or load current based on state information about the present state of the switching power amplifier.

Abstract: A power supply adapted for supplying electrical power to a load (108), the power supply comprising: at least one powered full bridge circuit (100), wherein the powered full bridge circuit is adapted for being powered by a direct current voltage supply (106), wherein the full bridge circuit (100) comprises a first output connection (104a), and a first switching means (102a-102d) for controlling the application of electrical power to the output connection, at least one floating full bridge circuit (110), wherein each floating full bridge circuit comprises a capacitor (116) adapted for powering the floating full bridge circuit (110), wherein each floating full bridge circuit comprises a second output connection (114b), a second switching means (112a-112d) for controlling the application of electrical power to the output connection, a stack of bridge circuits (100, 110) comprising the at least one powered full bridge circuit and the at least one floating full bridge circuit, wherein the second output convection (

Abstract: A semiconductor cooling device for transferring heat from a semiconductor die (111). The semiconductor cooling device includes a heat dissipator (112) that may be thermally coupled to a semiconductor module (111) to be cooled for dissipating heat from the semiconductor die (111); a housing (150) in or on which the semiconductor die (111) is mounted; a fluid flow passage (153) for providing a forced fluid flow within the housing (150); and a fluid path (155) arranged to guide the forced fluid flow in a first direction between the fluid flow passage (153) and the heat dissipator (112) and further arranged to guide the fluid flow along the heat dissipator (112) in a second direction different to the first direction. In a particular embodiment, the semiconductor cooling device is used to dissipate heat from an array of LEDs.

Abstract: The invention relates to a power semiconductor device (100) cooling assembly for cooling a power semiconductor device (100), wherein the assembly comprises an actively cooled heat sink (102) and a controller (208; 300), wherein the controller (208; 300) is adapted for adjusting the cooling efficiency of the heat sink (102) depending on the temperature of the high current carrying semiconductor junction comprised in the power semiconductor device (100).

Abstract: The present invention relates to a switched-mode power supply apparatus and a corresponding method. For an effective compensation of non-linearities caused by dead-time and voltage drops in the switching power amplifier of the apparatus, an apparatus is proposed comprising a switching power amplifier (14) for amplifying a signal supplied by an external signal source (11) and for supplying a load voltage and/or load current to a load (15), and a control unit (12; 12b) for controlling the switching of said switching power amplifier based on a timing setting, said control unit being adapted for simulating the behavior of the switching power amplifier by predicting the average load voltage and/or load current for at least two, in particular a plurality of, timing settings for a desired load voltage and/or load current based on state information about the present state of the switching power amplifier.

Abstract: A light-emitting device comprises a light source adapted to emit light of a first wavelength range; a reflective body comprising a reflective layer; a wavelength converting layer comprising a wavelength converting material adapted to absorb light of said first wavelength range and to emit light of a second wavelength range, said wavelength converting layer and said light source being arranged mutually spaced apart; and light-scattering elements adapted to scatter light of at least said first wavelength range; wherein at least part of said light-scattering elements are arranged in the path of light from said light source to said wavelength converting layer. The light-emitting device according to the invention provides improved uniformity in color and also improved brightness uniformity.

Abstract: A substrate holder for a lithographic apparatus has a planarization layer provided on a surface thereof. The planarization layer provides a smooth surface for the formation of a thin film stack forming an electronic component. The thin film stack comprises an (optional) isolation layer, a metal layer forming an electrode, a sensor, a heater, a transistor or a logic device, and a top isolation layer.