Abstract: A fiber optic sensor device comprising an optical fiber with a multilayer coating on the optical fiber at least in a fiber section of the optical fiber. The multilayer coating comprises a chrome layer on the optical fiber, a metal layer such as a copper layer on the chrome layer and an indium or lead layer on the metal layer. The indium or lead layer having a thickness larger than thicknesses of the chrome and metal layers, preferably with a thickness about equal to the radius of the optical fiber.

Abstract: A fiber optic sensor device comprising an optical fiber with a multilayer coating on the optical fiber at least in a fiber section of the optical fiber. The multilayer coating comprises a chrome layer on the optical fiber, a metal layer such as a copper layer on the chrome layer and an indium or lead layer on the metal layer. The indium or lead layer having a thickness larger than thicknesses of the chrome and metal layers, preferably with a thickness about equal to the radius of the optical fiber.

Abstract: A method for partially metallizing a product comprising a first surface, a first polymer material, and a second surface, a second polymer material, wherein the method comprises the sequential steps of exposing the first and second surfaces to conditions which render the first surface hydrophilic, and the second surface hydrophobic; contacting the first and second surfaces with water or aqueous solution; contacting the first and second surfaces with a solution of a film former in a water-immiscible solvent; evaporating the solvent to allow formation of a film by the film former on the second surface; adherence of a film by the film former on the first surface is prevented by the presence of the water or aqueous solution thereupon; performing a conventional metallization process to deposit a metal layer on the first and second surface; and removing the metallized film from the second surface to render the first surface metallized.

Abstract: The invention is directed to a method for preparing a substrate with an electrically conductive pattern for an electric circuit, to the substrate with the electrically conductive pattern, and to a device comprising the substrate with the electrically conductive pattern.

Abstract: Method for metallizing a product (11) comprising a first component (12) and a second component (13). The product is exposed to a first environment (14) causing the surface of the first component to be hydrophilic and the surface of the second component to be hydrophobic. The product is exposed to a watery solution (15a). Next, the product is exposed to a solution (17a) of a film former and subsequently to a second environment (17b), wherein the solvent evaporates and a film (18) is formed covering the whole product, while maintaining the water film under the film. The product then is rinsed out (17c), causing that the film is removed at the locations of the hydrophilic surface of the first component. Next, the product is nucleated, thus forming a nuclei layer (20) and subsequently the film is removed (19b) only leaving the nuclei layer at the hydrophilic surface of the first component.

Abstract: The invention provides a method for preparing a conductive strain sensor on the surface of a device to measure strain at the surface of the device, which method comprises the steps of (a) providing a device; (b) optionally applying an isolating layer on a surface of the device; (c) establishing a distribution of particles of a first metal on the isolating layer obtained in step (b); and (d) depositing a layer of a second metal on at least part of the distribution of the particles of the first metal as obtained in step (c) by means of an electroless plating process or electro-deposition process.