Abstract: Embodiments of the present disclosure relate to a fixing device for a double-sided heat sink and an associated heat dissipating system. There is exemplarily provided a fixing device for mounting the double-sided heat sink on a carrier.

Abstract: Various embodiments of the present disclosure disclose a storage system. The storage system comprises: at least one storage device array enclosure, each of the storage device array enclosure accommodating storage devices, which are arranged in columns and have gaps existing between adjacent storage devices; each storage device array enclosure includes a cap for covering accommodated storage devices; the cap includes vents and windshield bars, such that when the cap is in a closed state, the vents abut against an upper surface of the corresponding storage devices and the windshield bars cover the gaps between adjacent storage devices.

Abstract: Embodiments of the present disclosure provide a system and method for heat dissipation of a storage device. The system comprises a guiding rail mounted in an enclosure of the storage device; a set of fans arranged on the guiding rail and being movable on the guiding rail, the set of fans being configured to dissipate heat of a disk assembly of the storage device; and a controller configured to: obtain a temperature of the disk assembly at a first time point; and in response to the temperature of at least one disk in the disk assembly exceeding a threshold temperature, perform at least one of the following: adjusting a position of at least one of the set of fans; and increasing a rotational speed of at least one of the set of fans.

Abstract: Embodiments of the present disclosure relate to an enclosure for a disk array. The enclosure comprises a chassis for receiving the disk array. Each disk in the disk array is enclosed by a frame. The enclosure also comprises a heat sink including a plurality of metal bars arranged on a bottom face of the chassis. Each of the plurality of metal bars is adapted to contact a respective disk through a notch in the frame of the respective disk, to position the respective disk and to transfer heat generated by the respective disk to the chassis. In the embodiments of the present disclosure, the metal bars may be used not only for reliable positioning of the disks, but also for improving thermal dissipation performance.

Abstract: Embodiments of the present disclosure provide a method and device for determining a physical position of an electronic device. The method comprises obtaining, at a power distribution unit (PDU) that provides power supply for the electronic device, a position identifier of a physical position of the PDU from a radio frequency (RF) tag reader. The method further comprises providing to a computing device the position identifier, a network address of the PDU and a network address of the electronic device associated with the network address of the PDU so that the computing device determines the physical position of the electronic device.

Abstract: Embodiments of the present disclosure relate to a fixing device for a double-sided heat sink and an associated heat dissipating system. There is exemplarily provided a fixing device for mounting the double-sided heat sink on a carrier.

Abstract: The present disclosure relates to an integrator for a storage device, a corresponding storage device and a method of manufacturing the same. The integrator comprises a base board comprising a first interface and a second interface; a connector coupled to the first interface of the base board, the connector being connectable with at least one server in the storage device; an input/output (I/O) part coupled to the second interface of the base board and connectable with an I/O device; and a switcher arranged on the base board and adapted to exchange data between the first interface and the second interface to support data transmission of the I/O device or other servers with the server via the integrator.

Abstract: Embodiments of the present disclosure relate to a fixing device for a double-sided heat sink and an associated heat dissipating system. There is exemplarily provided a fixing device for mounting the double-sided heat sink on a carrier.

Abstract: Embodiments of the present disclosure relate to an enclosure for a disk array. The enclosure comprises a chassis for receiving the disk array. Each disk in the disk array is enclosed by a frame. The enclosure also comprises a heat sink including a plurality of metal bars arranged on a bottom face of the chassis. Each of the plurality of metal bars is adapted to contact a respective disk through a notch in the frame of the respective disk, to position the respective disk and to transfer heat generated by the respective disk to the chassis. In the embodiments of the present disclosure, the metal bars may be used not only for reliable positioning of the disks, but also for improving thermal dissipation performance.

Abstract: Various embodiments of the present disclosure disclose a storage system. The storage system comprises: at least one storage device array enclosure, each of the storage device array enclosure accommodating storage devices, which are arranged in columns and have gaps existing between adjacent storage devices; each storage device array enclosure includes a cap for covering accommodated storage devices; the cap includes vents and windshield bars, such that when the cap is in a closed state, the vents abut against an upper surface of the corresponding storage devices and the windshield bars cover the gaps between adjacent storage devices.

Abstract: Embodiments of the present disclosure relate to a fixing device for a double-sided heat sink and an associated heat dissipating system.

Abstract: The present disclosure relates to an integrator for a storage device, a corresponding storage device and a method of manufacturing the same. The integrator comprises a base board comprising a first interface and a second interface; a connector coupled to the first interface of the base board, the connector being connectable with at least one server in the storage device; an input/output (I/O) part coupled to the second interface of the base board and connectable with an I/O device; and a switcher arranged on the base board and adapted to exchange data between the first interface and the second interface to support data transmission of the I/O device or other servers with the server via the integrator.

Abstract: Embodiments of the present disclosure provide a system and method for heat dissipation of a storage device. The system comprises: a guiding rail mounted in an enclosure of the storage device; a set of fans arranged on the guiding rail and being movable on the guiding rail, the set of fans being configured to dissipate heat of a disk assembly of the storage device; and a controller configured to: obtain a temperature of the disk assembly at a first time point; and in response to the temperature of at least one disk in the disk assembly exceeding a threshold temperature, perform at least one of the following: adjusting a position of at least one of the set of fans; and increasing a rotational speed of at least one of the set of fans.

Abstract: An electronic module carrier in one embodiment comprises a carrier housing having a front portion and a rear portion, and a plurality of sub-carriers configured for separate insertion into and removal from respective sub-carrier slots in the front portion of the carrier housing. Each of the sub-carriers is configured to support at least one non-volatile memory module. The electronic module carrier is configured with a designated standard form factor for insertion into and removal from a carrier slot in a front portion of an electronic equipment chassis. For example, the standard form factor may be a 2.5? storage drive form factor. The non-volatile memory modules may comprise respective flash drives or other types of non-volatile memory modules implemented using an M.2 form factor.

Abstract: Embodiments of the present disclosure provide a method and device for determining a physical position of an electronic device. The method comprises obtaining, at a power distribution unit (PDU) that provides power supply for the electronic device, a position identifier of a physical position of the PDU from a radio frequency (RF) tag reader. The method further comprises providing to a computing device the position identifier, a network address of the PDU and a network address of the electronic device associated with the network address of the PDU so that the computing device determines the physical position of the electronic device.