Abstract: A leadframe for a leadless package comprises a plurality of package areas, a plurality of slots, an insulating layer, and a tape (film). Each package area comprises a plurality of package units, each of which comprises a die pad and a plurality of leads surrounding the die pad. The plurality of slots are disposed around each of the package units. The insulating layer is filled in a plurality of slots between the package areas. The tape (film) fixes the plurality of package areas, the plurality of connection portions, the plurality of die pads, and the plurality of leads in place.

Abstract: A leadframe for a leadless package comprises a plurality of package areas, a plurality of slots, a plurality of connection portions, a plurality of openings, and a tape (film). Each package area comprises a plurality of package units, each of which comprises a die pad and a plurality of leads surrounding the die pad. The plurality of slots are disposed around each of the package units. The plurality of connection portions connect the plurality of package areas. The plurality of openings are disposed on the plurality of connection portions, and are aligned with some of the plurality of slots. The tape (film) fixes the plurality of package areas, the plurality of connection portions, the plurality of die pads, and the plurality of leads in place.

Abstract: A leadframe for a leadless package comprises a plurality of package areas, a plurality of first slots, a plurality of first side rails, a plurality of second side rails, and tape. Each of the package areas comprises a plurality of package units, each of which comprises a die pad and a plurality of leads surrounding the die pad. The plurality of first side rails and the plurality of second side rails are connected and surround the plurality of the package areas. The tape fixes the plurality of package areas, the plurality of first side rails, the plurality of second side rails, the die pads, and the plurality of leads in place.