Patents by Inventor Heng-Cheng Chen

Heng-Cheng Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220351921
    Abstract: An illuminated keyswitch structure with an illuminating module includes a base plate, a drive circuit board under the base plate, a spacer between the drive circuit board and the base plate, and a light-emitting part on the circuit board. The spacer has a through hole communicating with an opening of the base plate in a vertical direction. The light-emitting part is located in the through hole, and falls within a projection of the opening in the vertical direction. The light-emitting part has a top surface that is lower than or equal to a bottom surface of the base plate in the vertical direction. The structure of the illuminated keyswitch structure around the light-emitting part can keep flat by the spacer. The spacer can prevent the light-emitting part from structurally entering the opening, avoiding structural interference between the light-emitting part and other components above the base plate.
    Type: Application
    Filed: July 6, 2022
    Publication date: November 3, 2022
    Inventors: Heng-Yi HUANG, Hsin-Cheng HO, Yuan-Bao CHEN
  • Publication number: 20220216018
    Abstract: An illuminated keyswitch structure includes a base plate, a drive circuit board under the base plate, a spacer between the drive circuit board and the base plate, and a light-emitting part on the circuit board. The spacer has a through hole communicating with an opening of the base plate in a vertical direction. The sidewall of the through hole is opaque. The light-emitting part is located in the through hole, and falls within a projection of the opening in the vertical direction. The light-emitting part has a top surface that is lower than or equal to a bottom surface of the base plate in the vertical direction. The structure of the illuminated keyswitch structure around the light-emitting part can keep flat by the spacer. The spacer can prevent the light-emitting part from structurally entering the opening, avoiding structural interference between the light-emitting part and other components above the base plate.
    Type: Application
    Filed: April 20, 2021
    Publication date: July 7, 2022
    Inventors: Heng-Yi Huang, Hsin-Cheng Ho, Yuan-Bao Chen
  • Patent number: 10469816
    Abstract: A projection system, a display system and monitoring methods thereof are provided. The projection system includes at least one projection device, at least one sensing device and a remote device. The at least one projection device is coupled to the at least one sensing device. The at least one sensing device senses a plurality of environmental parameters and a plurality of device output values on the at least one projection device. The remote device receives the environmental parameters and the device output values to execute state analysis for the at least one projection device, so as to generate at least one analysis result. The remote device further generates a command signal according to the at least one analysis result, and transmits the command signal to the at least one projection device. The at least one projection device executes a self-protection procedure according to the command signal.
    Type: Grant
    Filed: October 22, 2018
    Date of Patent: November 5, 2019
    Assignee: Coretronic Corporation
    Inventors: Hsin-Ya Lai, Jui-Chi Chen, Fu-Shan Wang, Heng-CHeng Chen, Chueh-Ching Chen, Ching-Ho Chang
  • Publication number: 20190124310
    Abstract: A projection system, a display system and monitoring methods thereof are provided. The projection system includes at least one projection device, at least one sensing device and a remote device. The at least one projection device is coupled to the at least one sensing device. The at least one sensing device senses a plurality of environmental parameters and a plurality of device output values on the at least one projection device. The remote device receives the environmental parameters and the device output values to execute state analysis for the at least one projection device, so as to generate at least one analysis result. The remote device further generates a command signal according to the at least one analysis result, and transmits the command signal to the at least one projection device. The at least one projection device executes a self-protection procedure according to the command signal.
    Type: Application
    Filed: October 22, 2018
    Publication date: April 25, 2019
    Applicant: Coretronic Corporation
    Inventors: Hsin-Ya Lai, Jui-Chi Chen, Fu-Shan Wang, Heng-Cheng Chen, Chueh-Ching Chen, Ching-Ho Chang
  • Publication number: 20190102134
    Abstract: Disclosed are a display system, a display device and a display method of a display system. A main display device corrects display properties of a displayed image of a secondary display device according to display properties of a displayed image of the main display device, so as to adjust the displayed image of the secondary display device to have the same display properties as the displayed image of the main display device, thereby effectively improving the convenience of use of the display system and the display device.
    Type: Application
    Filed: September 27, 2018
    Publication date: April 4, 2019
    Applicant: Coretronic Corporation
    Inventors: Chueh-Ching Chen, Jui-Chi Chen, Fu-Shan Wang, Hsin-Ya Lai, Ching-Ho Chang, Heng-Cheng Chen
  • Publication number: 20070013066
    Abstract: A semiconductor package and a fabrication method thereof are provided. The fabrication method includes the steps of preparing a chip having a plurality of conductive bumps formed on an active surface thereof; preparing a tape having a first surface and an opposed second surface, wherein the tape has a plurality of through holes at positions corresponding to the conductive bumps; forming an adhesive layer on the first surface of the tape, and disposing a plurality of leads on the second surface of the tape, so as to make an end of each of the leads covers a corresponding through hole; mounting the active surface of the chip to the adhesive layer on the first surface of the tape and allowing each of the conductive bumps to be received in a corresponding through hole; and performing a heat pressing process to bond the ends of the leads to the conductive bumps in the corresponding through holes.
    Type: Application
    Filed: July 14, 2006
    Publication date: January 18, 2007
    Inventors: Shih-Ming Lin, Heng-Cheng Chen