Patents by Inventor Heng Cheng

Heng Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140347411
    Abstract: There is provided a driving method for a display, which includes a display unit and a phase modulation unit. The display unit includes a plurality of pixel rows and generates image signals having a polarization direction. The phase modulation unit includes two oppositely disposed electrodes and an LC layer sandwiched between the two electrodes. The driving method changes a potential difference provided on the two electrodes of the phase modulation unit to control the twist of the LC layer thereby changing the polarization direction of the image signals generated by the display unit and passing through the phase modulation unit.
    Type: Application
    Filed: August 8, 2014
    Publication date: November 27, 2014
    Inventors: Heng-Cheng TSENG, Ra-Bin LI, Mu-Kai KANG
  • Publication number: 20140333860
    Abstract: A three-dimensional (3D) display installation is disclosed. The installation comprises a display, a phase-modulation device and at least a pair of polarized glasses. The phase-modulation device is set in one side of the display panel. The driving frequency of the display panel and the phase-modulation are above 120 Hz and synchronous with each other. The modulated polarized light contains left eye and right eye signals in sequence, which can be filtered by polarized glasses alternatively, and then the 3D visual effect is achieved. The 3D installation is suitable for multiple viewers at the same time, and the resolution of the screen is also unchanged under the 3D display mode.
    Type: Application
    Filed: July 25, 2014
    Publication date: November 13, 2014
    Inventors: Ra-Bin Li, Heng-Cheng Tseng
  • Publication number: 20140323690
    Abstract: Antiproliferative compounds having a structure represented by formula (II), where n, R1, R2, R3, R4, and R5 are as defined herein, can be used to treat tumors, optionally when conjugated to a ligand such as an antibody:
    Type: Application
    Filed: July 7, 2014
    Publication date: October 30, 2014
    Inventors: Heng Cheng, Sanjeev Gangwar, Qiang Cong
  • Patent number: 8823695
    Abstract: The present invention provides a barrier device including an upper substrate, a lower substrate and a liquid crystal layer sandwiched between the upper substrate and the lower substrate. The upper substrate includes a first substrate and a first electrode, a first insulation layer and a plurality of first stripe electrodes sequentially formed on the first substrate. The lower substrate includes a second substrate and a second electrode, a second insulation layer and a plurality of second stripe electrodes sequentially formed on the second substrate. The present invention further provides a 3D display and a driving method for a barrier device.
    Type: Grant
    Filed: December 7, 2011
    Date of Patent: September 2, 2014
    Assignee: Hannstar Display Corp.
    Inventors: Ra Bin Li, Heng Cheng Tseng, Mu Kai Kang, Feng Weei Kuo
  • Publication number: 20140227295
    Abstract: Tubulysin compounds of the formula (I) where R1, R2, R3a, R3b, R4, R5, W, and n are as defined herein, are anti-mitotic agents that can be used in the treatment of cancer, especially when conjugated to a targeting moiety.
    Type: Application
    Filed: February 11, 2014
    Publication date: August 14, 2014
    Inventors: Qiang CONG, Heng Cheng, Sanjeev Gangwar
  • Publication number: 20140227298
    Abstract: Tubulysin compounds of the formula (I) where R1, R2R3a, R3b, R4, R5, W, and n are as defined herein, are anti-mitotic agents that can be used in the treatment of cancer, especially when conjugated to a targeting moiety.
    Type: Application
    Filed: February 11, 2014
    Publication date: August 14, 2014
    Inventors: Qiang CONG, Heng CHENG, Sanjeev GANGWAR
  • Patent number: 8802632
    Abstract: Antiproliferative compounds having a structure represented by formula (II), where n, R1, R2, R3, R4, and R5 are as defined herein, can be used to treat tumors, optionally when conjugated to a ligand such as an antibody:
    Type: Grant
    Filed: January 29, 2013
    Date of Patent: August 12, 2014
    Assignee: Medarex, L.L.C.
    Inventors: Heng Cheng, Sanjeev Gangwar, Qiang Cong
  • Publication number: 20140221422
    Abstract: The present invention relates to novel compounds capable of modulating the stability and/or activity of hypoxia inducible factor (HIF).
    Type: Application
    Filed: April 9, 2014
    Publication date: August 7, 2014
    Applicant: FIBROGEN, INC.
    Inventors: Eric D. Turtle, Lee A. Flippin, Michael P. Arend, Heng Cheng
  • Publication number: 20140210672
    Abstract: An electronic package structure is provided, including a substrate, a package encapsulant disposed on the substrate, and an antenna structure corresponding to a disposing area of the package encapsulant and having a first extension layer, a second extension layer disposed on the substrate, and a connection portion disposed between and electrically connected to the first extension layer and the second extension layer. Through the formation of the antenna structure on the disposing area of the package encapsulant, the substrate is not required to be widen, and, as such, the electronic package structure meets the miniaturization requirement.
    Type: Application
    Filed: December 16, 2013
    Publication date: July 31, 2014
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD
    Inventors: Chih-Hsien Chiu, Heng-Cheng Chu, Chien-Cheng Lin, Tsung-Hsien Tsai, Chao-Ya Yang, Yude Chu
  • Publication number: 20140210687
    Abstract: An electronic package is provided, which includes: a substrate; at least an electronic element disposed on the substrate; an antenna structure disposed on the substrate; and an encapsulant formed on the substrate for encapsulating the electronic element and the antenna structure. Therein, the antenna structure has an extension portion and a plurality of support portions connected to the extension portion for supporting the extension portion over the substrate so as to save the surface area of the substrate, thereby meeting the miniaturization requirement of the electronic package.
    Type: Application
    Filed: December 5, 2013
    Publication date: July 31, 2014
    Applicant: Silconware Precision Industries Co., Ltd.
    Inventors: CHIH-HSIEN CHIU, Heng-Cheng CHU, Chien-Cheng LIN, Tsung-Hsien TSAI, Chao-Ya YANG
  • Publication number: 20140203395
    Abstract: A semiconductor package and a method of manufacturing the same are provided. The semiconductor package includes: a substrate having a plurality of conductive lands and a plurality of bonding pads surrounding the conductive lands formed on a surface thereof; a plurality of passive devices mounted on the conductive lands; an insulation layer formed on the surface and having a portion of the passive devices embedded therein; a semiconductor chip mounted on a top surface of the insulation layer; a plurality of bonding wires electrically connecting the semiconductor chip and the bonding pads; an encapsulant formed on the surface of the substrate to encapsulate the insulation layer, the bonding wires and the semiconductor chip, wherein a region of the semiconductor chip projected onto the substrate covers a portion of an outermost one of the passive devices. Therefore, the mounting density of the passive devices is improved.
    Type: Application
    Filed: November 22, 2013
    Publication date: July 24, 2014
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD
    Inventors: Tsung-Hsien Tsai, Heng-Cheng Chu, Chien-Cheng Lin, Chih-Hsien Chiu, Hsin-Lung Chung, Yude Chu
  • Publication number: 20140198099
    Abstract: A display-mode switching device includes a substrate, a plurality of first electrode stripes, a plurality of second electrode stripes, a plurality of third electrode stripes, a fourth electrode stripes, and a common electrode covering a surface of the substrate. The first electrode stripes, the second electrode stripes, the third electrode stripes and the fourth electrode stripes are disposed on the insulating layer, and each first electrode stripe, each third electrode stripe, each second electrode stripe and each fourth electrode stripe are sequentially arranged along a direction.
    Type: Application
    Filed: April 10, 2013
    Publication date: July 17, 2014
    Applicant: HannStar Display Corp.
    Inventors: Heng-Cheng Tseng, Chih-Hsuan Lee
  • Patent number: 8772542
    Abstract: Antiproliferative compounds having a structure represented by formula (II), where n, R1, R2, R3, R4, and R5 are as defined herein, can be used to treat tumors, optionally when conjugated to a ligand such as an antibody:
    Type: Grant
    Filed: January 29, 2013
    Date of Patent: July 8, 2014
    Assignee: Medarex, L.L.C.
    Inventors: Heng Cheng, Sanjeev Gangwar, Qiang Cong
  • Patent number: 8772543
    Abstract: Antiproliferative compounds having a structure represented by formula (II), where n, R1, R2, R3, R4, and R5 are as defined herein, can be used to treat tumors, optionally when conjugated to a ligand such as an antibody:
    Type: Grant
    Filed: January 29, 2013
    Date of Patent: July 8, 2014
    Assignee: Medarex, L.L.C.
    Inventors: Heng Cheng, Sanjeev Gangwar, Qiang Cong, Qian Zhang
  • Publication number: 20140188264
    Abstract: Methods of semiconductor processing are described. An experiment is designed for each process of a semiconductor substrate, which are implemented on respective multiple regions of the semiconductor substrate. A unique identifier is assigned to the semiconductor substrate. The respective design of experiment is implemented for each of the processes of the semiconductor substrate. Process criteria for each process is recorded, where the recording is associated with the assigned unique identifier. Process information is retrieved for each process, via its respective assigned unique identifier.
    Type: Application
    Filed: December 27, 2012
    Publication date: July 3, 2014
    Applicant: INTERMOLECULAR, INC.
    Inventors: Harikrishanan Rajagopal, Yoshiki E. Ashizawa, Joseph M. Jackson, Sandeep Mariserla, Heng Cheng Pai, Radha Subrahmanyan, Karen Yang
  • Patent number: 8769068
    Abstract: A system and method for policy based management for a high security MANET comprises policy managers, each performing policy decision-making and policy enforcement using multiple policies, containers, each related to an application and each container having one policy manager, nodes, each having an infrastructure and at least one container, and dynamic community building blocks associating the containers having a same application, the containers being in different nodes, the associated containers maintained by the dynamic community building blocks on a secure network. Each container can define a security boundary around the node. Each container can be a lightweight virtual machine. The system can also have a special container having a policy manager only evaluating policies for conflicts. In one embodiment, a node can consist of multiple network devices and each network device is a container of its own.
    Type: Grant
    Filed: February 24, 2010
    Date of Patent: July 1, 2014
    Assignee: Telcordia Technologies, Inc.
    Inventors: D. Scott Alexander, Yuu-Heng Cheng, Alexander Poylisher
  • Publication number: 20140129206
    Abstract: A simulating method for a flash memory and a simulator using the simulating method are provided. The simulator is configured to couple to a memory controller. The simulating method includes: setting a predetermined response condition; providing multiple command sets, wherein each of the command sets corresponds to a memory type; receiving a first command from the memory controller; identifying a second command in the command sets according to the first command; determining if the second command matches the predetermined response condition; obtaining a first signal corresponding to the second command according to the predetermined response condition; and, transmitting the first signal to the memory controller. Accordingly, the usage of the simulator is flexible.
    Type: Application
    Filed: December 20, 2012
    Publication date: May 8, 2014
    Applicant: PHISON ELECTRONICS CORP.
    Inventors: Kuo-Yi Cheng, Yi-Hong Huang, Huang-Heng Cheng
  • Publication number: 20140111470
    Abstract: The present invention provides a three-dimensional touch display panel including a display panel and an integrated panel. The integrated panel is disposed on the display panel, and the integrated panel includes a first transparent substrate, a first patterned transparent conductive layer disposed on the first transparent substrate, a second transparent substrate disposed opposite to the first transparent substrate, a second patterned transparent conductive layer disposed between the first transparent substrate and the second transparent substrate, a first plate-shaped transparent conductive layer disposed on the second transparent substrate, and a liquid crystal layer disposed between the first patterned transparent conductive layer and the first transparent conductive layer. The first patterned transparent conductive layer includes a plurality of first electrode stripes sequentially arranged along a first direction.
    Type: Application
    Filed: July 26, 2013
    Publication date: April 24, 2014
    Applicant: HannStar Display Corp.
    Inventors: Hsu-Ho Wu, Chia-Hua Yu, I-Fang Wang, Kun-Cheng Lee, Feng-Wei Kuo, Heng-Cheng Tseng, Mu-Kai Kang, Guang-Shiung Chao
  • Patent number: 8703795
    Abstract: The present invention relates to novel compounds capable of modulating the stability and/or activity of hypoxia inducible factor (HIF).
    Type: Grant
    Filed: March 2, 2006
    Date of Patent: April 22, 2014
    Assignee: Fibrogen, Inc.
    Inventors: Eric D. Turtle, Lee A. Flippin, Michael P. Arend, Heng Cheng
  • Publication number: 20140080265
    Abstract: A carrier-free semiconductor package includes a circuit structure having an insulating layer and a circuit layer embedded in the insulating layer and having a plurality of conductive traces and RF (radio frequency) traces, a chip disposed on a first surface of the insulating layer and electrically connected to the conductive traces, an encapsulant covering the chip and the circuit layer, a ground layer formed on a second surface of the insulating layer opposite to the first surface, and a plurality of solder balls disposed on the conductive traces or terminals on the conductive traces, wherein portions of the solder balls electrically connect the ground layer so as to allow the RF traces and the ground layer to form a microstrip line having an RF function, thus obtaining a single-layer carrier-free semiconductor package having low cost and simplified RF design.
    Type: Application
    Filed: November 21, 2013
    Publication date: March 20, 2014
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD
    Inventors: Ching-Hua Chen, Heng-Cheng Chu, Hsin-Lung Chung, Chih-Hsien Chiu, Chia-Yang Chen