Patents by Inventor Heng Chieh Chien
Heng Chieh Chien has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11948702Abstract: A radiation source apparatus includes a vessel, a laser source, a collector, a horizontal obscuration bar, and a reflective mirror. The vessel has an exit aperture. The laser source is configured to emit a laser beam to excite a target material to form a plasma. The collector is disposed in the vessel and configured to collect a radiation emitted by the plasma and to reflect the collected radiation to the exit aperture of the vessel. The horizontal obscuration bar extends from a sidewall of the vessel at least to a position between the laser source and the exit aperture of the vessel. The reflective mirror is in the vessel and connected to the horizontal obscuration bar.Type: GrantFiled: May 5, 2023Date of Patent: April 2, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Wei-Chung Tu, Sheng-Kang Yu, Shang-Chieh Chien, Li-Jui Chen, Heng-Hsin Liu
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Publication number: 20240103378Abstract: The present disclosure provides an extreme ultraviolet (EUV) lithography system including a radiation source and an EUV control system integrated with the radiation source. The EUV control system includes a 3-dimensional diagnostic module (3DDM) designed to collect a laser beam profile of a laser beam from the radiation source in a 3-dimensional (3D) mode, an analysis module designed to analyze the laser beam profile, a database designed to store the laser beam profile, and an EUV control module designed to adjust the radiation source. The analysis module is coupled with the database and the EUV control module. The database is coupled with the 3DDM and the analysis module. The EUV control module is coupled with the analysis module and the radiation source.Type: ApplicationFiled: November 30, 2023Publication date: March 28, 2024Inventors: Tai-Yu CHEN, Tzu-Jung PAN, Kuan-Hung CHEN, Sheng-Kang YU, Shang-Chieh CHIEN, Li-Jui CHEN, Heng-Hsin LIU
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Patent number: 11942396Abstract: A heterogeneous integration semiconductor package structure including a heat dissipation assembly, multiple chips, a package assembly, multiple connectors and a circuit substrate is provided. The heat dissipation assembly has a connection surface and includes a two-phase flow heat dissipation device and a first redistribution structure layer embedded in the connection surface. The chips are disposed on the connection surface of the heat dissipation assembly and electrically connected to the first redistribution structure layer. The package assembly surrounds the chips and includes a second redistribution structure layer disposed on a lower surface and multiple conductive vias electrically connected to the first redistribution structure layer and the second redistribution structure layer. The connectors are disposed on the package assembly and electrically connected to the second redistribution structure layer.Type: GrantFiled: December 29, 2021Date of Patent: March 26, 2024Assignee: Industrial Technology Research InstituteInventors: Heng-Chieh Chien, Shu-Jung Yang, Yu-Min Lin, Chih-Yao Wang, Yu-Lin Chao
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Publication number: 20230170279Abstract: A heterogeneous integration semiconductor package structure including a heat dissipation assembly, multiple chips, a package assembly, multiple connectors and a circuit substrate is provided. The heat dissipation assembly has a connection surface and includes a two-phase flow heat dissipation device and a first redistribution structure layer embedded in the connection surface. The chips are disposed on the connection surface of the heat dissipation assembly and electrically connected to the first redistribution structure layer. The package assembly surrounds the chips and includes a second redistribution structure layer disposed on a lower surface and multiple conductive vias electrically connected to the first redistribution structure layer and the second redistribution structure layer. The connectors are disposed on the package assembly and electrically connected to the second redistribution structure layer.Type: ApplicationFiled: December 29, 2021Publication date: June 1, 2023Applicant: Industrial Technology Research InstituteInventors: Heng-Chieh Chien, Shu-Jung Yang, Yu-Min Lin, Chih-Yao Wang, Yu-Lin Chao
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Patent number: 11602128Abstract: An ear tag module includes a rod member, a spike, a circuit component, and a temperature sensor. The spike is disposed on one side of the rod member, and the circuit component is disposed on another side of the rod member. The temperature sensor is electrically connected to the circuit component. When the spike penetrates an ear, the ear is in contact with a sensing area of the rod member, and the temperature sensor is located in the rod member to detect a temperature of the ear and transmit at least one temperature sensing information to the circuit component.Type: GrantFiled: May 27, 2020Date of Patent: March 14, 2023Assignee: Industrial Technology Research InstituteInventors: Shu-Jung Yang, Yu-Lin Chao, Chih-Chung Chiu, Heng-Chieh Chien
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Publication number: 20200383298Abstract: An ear tag module includes a rod member, a spike, a circuit component, and a temperature sensor. The spike is disposed on one side of the rod member, and the circuit component is disposed on another side of the rod member. The temperature sensor is electrically connected to the circuit component. When the spike penetrates an ear, the ear is in contact with a sensing area of the rod member, and the temperature sensor is located in the rod member to detect a temperature of the ear and transmit at least one temperature sensing information to the circuit component.Type: ApplicationFiled: May 27, 2020Publication date: December 10, 2020Applicant: Industrial Technology Research InstituteInventors: Shu-Jung Yang, Yu-Lin Chao, Chih-Chung Chiu, Heng-Chieh Chien
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Patent number: 10540474Abstract: A chip temperature computation method and a chip temperature computation device are provided. The chip temperature computation method includes: computing an upper layer thermal resistance and a lower layer thermal resistance of a chip, computing a total thermal resistance of the chip, and computing a temperature of the chip according to the total thermal resistance.Type: GrantFiled: March 15, 2018Date of Patent: January 21, 2020Assignee: Industrial Technology Research InstituteInventors: Heng-Chieh Chien, Sheng-Tsai Wu, Ming-Ji Dai, Chih-Ming Shen
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Publication number: 20190188357Abstract: A chip temperature computation method and a chip temperature computation device are provided. The chip temperature computation method includes: computing an upper layer thermal resistance and a lower layer thermal resistance of a chip, computing a total thermal resistance of the chip, and computing a temperature of the chip according to the total thermal resistance.Type: ApplicationFiled: March 15, 2018Publication date: June 20, 2019Applicant: Industrial Technology Research InstituteInventors: Heng-Chieh Chien, Sheng-Tsai Wu, Ming-Ji Dai, Chih-Ming Shen
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Patent number: 10197255Abstract: A rail-type organic light emitting diode lamp assembly is provided. The lamp assembly includes a lamp module, an annular member, a connector, a conductive member, and a rail module. The annular member includes a protrusion portion having a pair of indentations. The connector is connected to the annular member, and includes a through hole, a first end provided with a pair of ears and a second end provided with a pair of hooks. The conductive member is provided in the through hole and has a first end in contact with the annular conductive coil. The rail module is connected with the connector and includes a conductor in contact with a second end of the conductive member. The connector can be slidably hooked to the rail module through the hooks, and after the ears are inserted into the indentations, the annular member can be rotatable with respect to the connector.Type: GrantFiled: April 5, 2017Date of Patent: February 5, 2019Assignee: Industrial Technology Research InstituteInventors: Heng-Chieh Chien, Yu-Lin Chao, Wen-Fu Hsu, Chih-Ming Shen, Chia-Wei Jui, Yao-Shun Chen
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Patent number: 10051742Abstract: A power module and a manufacturing method thereof are provided, and the power module includes a carrier substrate, an interconnection layer, a first chip, a second chip, a ceramic bonding substrate, a top interconnection layer and a lead frame. The interconnection layer is disposed on the carrier substrate. The first chip and the second chip are disposed on the interconnection layer, and electrically connected to the interconnection layer. The ceramic bonding substrate is disposed on the interconnection layer, and is disposed in between the first chip and the second chip so as to separate the first chip from the second chip. The top interconnection layer is disposed on the ceramic bonding substrate, covers the first chip and the second chip, and is electrically connected to the first chip and the second chip. The lead frame is disposed on the top interconnection layer and electrically connected to the top interconnection layer.Type: GrantFiled: December 10, 2015Date of Patent: August 14, 2018Assignee: Industrial Technology Research InstituteInventors: Shu-Jung Yang, Yu-Lin Chao, Heng-Chieh Chien, Chun-Kai Liu
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Publication number: 20180128468Abstract: A rail-type organic light emitting diode lamp assembly is provided. The lamp assembly includes a lamp module, an annular member, a connector, a conductive member, and a rail module. The annular member includes a protrusion portion having a pair of indentations. The connector is connected to the annular member, and includes a through hole, a first end provided with a pair of ears and a second end provided with a pair of hooks. The conductive member is provided in the through hole and has a first end in contact with the annular conductive coil. The rail module is connected with the connector and includes a conductor in contact with a second end of the conductive member. The connector can be slidably hooked to the rail module through the hooks, and after the ears are inserted into the indentations, the annular member can be rotatable with respect to the connector.Type: ApplicationFiled: April 5, 2017Publication date: May 10, 2018Inventors: Heng-Chieh Chien, Yu-Lin Chao, Wen-Fu Hsu, Chih-Ming Shen, Chia-Wei Jui, Yao-Shun Chen
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Publication number: 20170171978Abstract: A power module and a manufacturing method thereof are provided, and the power module includes a carrier substrate, an interconnection layer, a first chip, a second chip, a ceramic bonding substrate, a top interconnection layer and a lead frame. The interconnection layer is disposed on the carrier substrate. The first chip and the second chip are disposed on the interconnection layer, and electrically connected to the interconnection layer. The ceramic bonding substrate is disposed on the interconnection layer, and is disposed in between the first chip and the second chip so as to separate the first chip from the second chip. The top interconnection layer is disposed on the ceramic bonding substrate, covers the first chip and the second chip, and is electrically connected to the first chip and the second chip. The lead frame is disposed on the top interconnection layer and electrically connected to the top interconnection layer.Type: ApplicationFiled: December 10, 2015Publication date: June 15, 2017Inventors: Shu-Jung Yang, Yu-Lin Chao, Heng-Chieh Chien, Chun-Kai Liu
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Patent number: 9448121Abstract: A measurement method, a measurement apparatus, and a computer program product for measuring a thermoelectric module are provided. A temperature is provided to the thermoelectric module. A current is applied to the thermoelectric module to turn both sides of the thermoelectric module into a hot side and a cold side. The temperature of the hot side is higher than that of the cold side. A terminal voltage of the thermoelectric module, a hot side temperature of the hot side, and a cold side temperature of the cold side are measured at different time points. A thermoelectric relationship between the terminal voltages and differences between the hot side temperatures and the corresponding cold side temperatures is obtained according to the terminal voltages, the hot side temperatures, and the cold side temperatures. At least one first parameter of the thermoelectric module is estimated according to the thermoelectric relationship.Type: GrantFiled: April 1, 2013Date of Patent: September 20, 2016Assignee: Industrial Technology Research InstituteInventors: Heng-Chieh Chien, Ming-Ji Dai, Sheng-Tsai Wu, Huey-Lin Hsieh, Jing-Yi Huang
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Patent number: 9418921Abstract: A power module includes a first substrate, at least two power elements, at least one first conductive structure and at least one leadframe. The first substrate includes a dielectric frame, two first fan-out circuit structure layers and two dielectric plates. The two first fan-out circuit structure layers are respectively disposed on two opposite surfaces of the dielectric frame, the two dielectric plates are respectively disposed on the two first fan-out circuit structure layers, each of the dielectric plates has at least one opening, and the opening and the corresponding first fan-out circuit structure layer form a concavity. The two power elements are respectively embedded in the two concavities. The two power elements are electrically connected to each other through the first conductive structure. The leadframe disposed at the first substrate is electrically connected to the two power elements, and is partially extended outside the first substrate.Type: GrantFiled: December 11, 2015Date of Patent: August 16, 2016Assignee: Industrial Technology Research InstituteInventors: Shu-Jung Yang, Yu-Lin Chao, Heng-Chieh Chien, Chun-Kai Liu
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Publication number: 20160172285Abstract: A power module includes a first substrate, at least two power elements, at least one first conductive structure and at least one leadframe. The first substrate includes a dielectric frame, two first fan-out circuit structure layers and two dielectric plates. The two first fan-out circuit structure layers are respectively disposed on two opposite surfaces of the dielectric frame, the two dielectric plates are respectively disposed on the two first fan-out circuit structure layers, each of the dielectric plates has at least one opening, and the opening and the corresponding first fan-out circuit structure layer form a concavity. The two power elements are respectively embedded in the two concavities. The two power elements are electrically connected to each other through the first conductive structure. The leadframe disposed at the first substrate is electrically connected to the two power elements, and is partially extended outside the first substrate.Type: ApplicationFiled: December 11, 2015Publication date: June 16, 2016Inventors: Shu-Jung Yang, Yu-Lin Chao, Heng-Chieh Chien, Chun-Kai Liu
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Patent number: 9252054Abstract: A thinned integrated circuit device and manufacturing process for the same are disclosed. The manufacturing process includes forming a through-silicon via (TSV) on a substrate, a first terminal of the TSV is exposed on a first surface of the substrate, disposing a bump on the first surface of the substrate to make the bump electrically connected with the TSV, disposing an integrated circuit chip (IC) on the bump so that a first side of the IC is connected to the bump, disposing a thermal interface material (TIM) layer on a second side of the IC opposite to the first side of the IC, attaching a heat-spreader cap on the IC by the TIM layer, and backgrinding a second surface of the substrate to expose the TSV to the second surface of the substrate while carrying the heat-spreader cap.Type: GrantFiled: September 12, 2014Date of Patent: February 2, 2016Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Sheng-Tsai Wu, Heng-Chieh Chien, John H. Lau, Yu-Lin Chao, Wei-Chung Lo
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Publication number: 20150076682Abstract: A thinned integrated circuit device and manufacturing process for the same are disclosed. The manufacturing process includes forming a through-silicon via (TSV) on a substrate, a first terminal of the TSV is exposed on a first surface of the substrate, disposing a bump on the first surface of the substrate to make the bump electrically connected with the TSV, disposing an integrated circuit chip (IC) on the bump so that a first side of the IC is connected to the bump, disposing a thermal interface material (TIM) layer on a second side of the IC opposite to the first side of the IC, attaching a heat-spreader cap on the IC by the TIM layer, and backgrinding a second surface of the substrate to expose the TSV to the second surface of the substrate while carrying the heat-spreader cap.Type: ApplicationFiled: September 12, 2014Publication date: March 19, 2015Inventors: Sheng-Tsai WU, Heng-Chieh CHIEN, John H. LAU, Yu-Lin CHAO, Wei-Chung LO
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Patent number: 8609454Abstract: A self-assembly apparatus for assembling a plurality of devices with a predetermined aspect ratio is provided. The self-assembly apparatus includes a guiding element, a vibration device, and a magnetic field inducing device. The guiding element has a mesh structure. The vibration device is coupled to the guiding element and configured to vibrate the guiding element. The magnetic field inducing device is disposed below the guiding element and configured to generate a time-varying magnetic field to rotate each of the devices. Through a collective effect of the vibration of the guiding element, the time-varying magnetic field, and the self-gravity of each of the devices, the devices are positioned on a plate between the guiding element and the magnetic field inducing device through the mesh structure.Type: GrantFiled: July 17, 2012Date of Patent: December 17, 2013Assignee: Industrial Technology Research InstituteInventors: Ming-Ji Dai, Chun-Kai Liu, Heng-Chieh Chien, Li-Ling Liao, Ker-Win Wang, Yen-Lin Tzeng, Yan-Bo Lin
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Publication number: 20130302935Abstract: A self-assembly apparatus for assembling a plurality of devices with a predetermined aspect ratio is provided. The self-assembly apparatus includes a guiding element, a vibration device, and a magnetic field inducing device. The guiding element has a mesh structure. The vibration device is coupled to the guiding element and configured to vibrate the guiding element. The magnetic field inducing device is disposed below the guiding element and configured to generate a time-varying magnetic field to rotate each of the devices. Through a collective effect of the vibration of the guiding element, the time-varying magnetic field, and the self-gravity of each of the devices, the devices are positioned on a plate between the guiding element and the magnetic field inducing device through the mesh structure.Type: ApplicationFiled: July 17, 2012Publication date: November 14, 2013Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Ming-Ji Dai, Chun-Kai Liu, Heng-Chieh Chien, Li-Ling Liao, Ker-Win Wang, Yen-Lin Tzeng, Yan-Bo Lin
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Publication number: 20130276464Abstract: A measurement method, a measurement apparatus, and a computer program product for measuring a thermoelectric module are provided. A temperature is provided to the thermoelectric module. A current is applied to the thermoelectric module to turn both sides of the thermoelectric module into a hot side and a cold side. The temperature of the hot side is higher than that of the cold side. A terminal voltage of the thermoelectric module, a hot side temperature of the hot side, and a cold side temperature of the cold side are measured at different time points. A thermoelectric relationship between the terminal voltages and differences between the hot side temperatures and the corresponding cold side temperatures is obtained according to the terminal voltages, the hot side temperatures, and the cold side temperatures. At least one first parameter of the thermoelectric module is estimated according to the thermoelectric relationship.Type: ApplicationFiled: April 1, 2013Publication date: October 24, 2013Inventors: Heng-Chieh Chien, Ming-Ji Dai, Sheng-Tsai Wu, Huey-Lin Hsieh, Jing-Yi Huang