Abstract: An implantable micro-biosensor a substrate, a first electrode, a second electrode, a third electrode, and a chemical reagent layer. The first electrode is disposed on the substrate and used as a counter electrode. The second electrode is disposed on the substrate and spaced apart from the first electrode. The third electrode is disposed on the substrate and used as a working electrode. The chemical reagent layer at least covers a sensing section of the third electrode so as to permit the third electrode to selectively cooperate with the first electrode or the first and second electrodes to measure a physiological signal in response to the physiological parameter of the analyte.

Abstract: A MEMS device is provided. The MEMS device includes a substrate having at least one contact, a first dielectric layer disposed on the substrate, at least one metal layer disposed on the first dielectric layer, a second dielectric layer disposed on the first dielectric layer and the metal layer and having a recess structure, and a structure layer disposed on the second dielectric layer and having an opening. The opening is disposed on and corresponds to the recess structure, and the cross-sectional area at the bottom of the opening is smaller than the cross-sectional area at the top of the recess structure. The MEMS device also includes a sealing layer, and at least a portion of the sealing layer is disposed in the opening and the recess structure. The second dielectric layer, the structure layer, and the sealing layer define a chamber.

Abstract: An infrared device is provided. The infrared device includes a substrate, a metal layer, a first semiconductor layer, an absorber layer, and a second semiconductor layer. The metal layer is disposed on the substrate. The first semiconductor layer is disposed on the substrate and electrically connected to the metal layer. A cavity is formed between the first semiconductor layer and the metal layer. The absorber layer is disposed on the first semiconductor layer. The second semiconductor layer is disposed on the absorber layer and electrically connected to the first semiconductor layer. The TCR of the first semiconductor layer is different from that of the second semiconductor layer.

Abstract: A MEMS device is provided. The MEMS device includes a substrate having at least one contact, a first dielectric layer disposed on the substrate, at least one metal layer disposed on the first dielectric layer, a second dielectric layer disposed on the first dielectric layer and the metal layer and having a recess structure, and a structure layer disposed on the second dielectric layer and having an opening. The opening is disposed to correspond to the recess structure, and the cross-sectional area at the bottom of the opening is smaller than the cross-sectional area at the top of the recess structure. The MEMS device also includes a packaging layer, and at least a portion of the packaging layer is disposed in the opening and the recess structure. The second dielectric layer, the structure layer, and the packaging layer define a chamber.

Abstract: A MEMS device is provided. The MEMS device includes a substrate having at least one contact, a first dielectric layer disposed on the substrate, at least one metal layer disposed on the first dielectric layer, a second dielectric layer disposed on the first dielectric layer and the metal layer and having a recess structure, and a structure layer disposed on the second dielectric layer and having an opening. The opening is disposed on and corresponds to the recess structure, and the cross-sectional area at the bottom of the opening is smaller than the cross-sectional area at the top of the recess structure. The MEMS device also includes a sealing layer, and at least a portion of the sealing layer is disposed in the opening and the recess structure. The second dielectric layer, the structure layer, and the sealing layer define a chamber.

Abstract: A MEMS device is provided. The MEMS device includes a substrate having at least one contact, a first dielectric layer disposed on the substrate, at least one metal layer disposed on the first dielectric layer, a second dielectric layer disposed on the first dielectric layer and the metal layer and having a recess structure, and a structure layer disposed on the second dielectric layer and having an opening. The opening is disposed to correspond to the recess structure, and the cross-sectional area at the bottom of the opening is smaller than the cross-sectional area at the top of the recess structure. The MEMS device also includes a packaging layer, and at least a portion of the packaging layer is disposed in the opening and the recess structure. The second dielectric layer, the structure layer, and the packaging layer define a chamber.

Abstract: A miniature scent generating device includes a scented component, a plurality of granular first materials, and a driving unit. The scented component includes a housing, a chamber located in the housing, a ventilation opening penetrating through the housing to communicate with the chamber, and a vibration unit disposed in the chamber. The first materials are provided in the chamber, and have a first scent. The driving unit is connected to the vibration unit. The vibration unit is controlled by the driving unit to vibrate and produce an airflow of perturbation in the chamber, so as to prompt the first materials to pass through the ventilation opening and discharge out of the chamber to disperse the first scent. The miniature scent generating device has the advantage of unlikely spoiled and readily controlling a release concentration of the scent.

Abstract: A sensor chip has a supporting structure layer and a micro-inductor layer formed on the supporting structure layer and having an inductance. The micro-inductor layer comprises an insulating layer, at least one magnetic layer, and a micro-coil layer. When an external physical quantity is applied on sensor chip, the micro-inductor layer can deform correspondingly to generate a variation of the inductance. The variation of the inductance can be measured by an inductance measurement circuit. The inductance measurement circuit can be an external circuit or be integrated into the sensor chip.

Abstract: A sensor chip has a supporting structure layer and a micro-inductor layer formed on the supporting structure layer and having an inductance. The micro-inductor layer comprises an insulating layer, at least one magnetic layer, and a micro-coil layer. When an external physical quantity is applied on sensor chip, the micro-inductor layer can deform correspondingly to generate a variation of the inductance. The variation of the inductance can be measured by an inductance measurement circuit. The inductance measurement circuit can be an external circuit or be integrated into the sensor chip.

Abstract: A passive alternating current sensor for sensing a current-carrying conductor is disclosed. The passive alternating current sensor includes a substrate, a magnetic body, at least one coil and a first measuring circuit. The substrate has a flexible structure layer. The magnetic body is disposed correspondingly to the current-carrying conductor and located at one side of the substrate. The coil is disposed on the substrate and correspondingly winds around the magnetic body. The first measuring circuit is connected with the coil. When the magnetic body is subjected to the magnetic field generated by the current-carrying conductor and enabled a relative motion with the coil, the coil produces an induced electromotive force. The first measuring circuit measures the induced electromotive force and accordingly outputs a first induction signal.

Abstract: A miniature scent generating device includes a scented component, a plurality of granular first materials, and a driving unit. The scented component includes a housing, a chamber located in the housing, a ventilation opening penetrating through the housing to communicate with the chamber, and a vibration unit disposed in the chamber. The first materials are provided in the chamber, and have a first scent. The driving unit is connected to the vibration unit. The vibration unit is controlled by the driving unit to vibrate and produce an airflow of perturbation in the chamber, so as to prompt the first materials to pass through the ventilation opening and discharge out of the chamber to disperse the first scent. The miniature scent generating device has the advantage of unlikely spoiled and readily controlling a release concentration of the scent.

Abstract: A passive alternating current sensor for sensing a current-carrying conductor is disclosed. The passive alternating current sensor includes a substrate, a magnetic body, at least one coil and a first measuring circuit. The substrate has a flexible structure layer. The magnetic body is disposed correspondingly to the current-carrying conductor and located at one side of the substrate. The coil is disposed on the substrate and correspondingly winds around the magnetic body. The first measuring circuit is connected with the coil. When the magnetic body is subjected to the magnetic field generated by the current-carrying conductor and enabled a relative motion with the coil, the coil produces an induced electromotive force. The first measuring circuit measures the induced electromotive force and accordingly outputs a first induction signal.

Abstract: A magnetic component includes at least one coil and a permeable structure. The coil is formed by a radially wound wire, and the thickness of the wire is various according to the distance from a portion of the wire to the center axis of the coil. The coil is covered by the permeable structure.

Abstract: A method for treating a surface of an element includes the steps of providing a photo-sensitive and flexible thin film, providing a planar photomask having a micro-structural pattern, transferring the micro-structural pattern to the thin film, attaching the thin film to the surface of the element and partially exposing a portion of the element, processing the exposed portion of the element, and removing the thin film to form a micro-structure on the surface of the element.

Abstract: An inductor includes a coil and a core. The core covers the coil and includes a plurality of magnetic particles. Each of the magnetic particles includes a nucleus and a first shell enveloping the nucleus. The nucleus and the first shell are formed by different materials with different specific gravities. When the nucleus includes a polymer material, the first shell includes the first magnetic material. When the nucleus includes the first magnetic material, the first shell includes the polymer material.

Abstract: A manufacturing method of a magnetic device includes the steps of forming a magnetic substrate having a plurality of recesses, and forming at least one coil in the recess. In addition, a magnetic device is also disclosed. The magnetic device includes a magnetic substrate and at least one coil. The magnetic substrate has a plurality of recesses and the coil is disposed in the recess.

Abstract: A semiconductor piezoresistive sensor, which is electrically connected with a circuit, includes a semiconductor base, at least one piezoresistive element and a conductive layer. The semiconductor base includes a diaphragm and a base. The base is disposed adjacent to and around the diaphragm. The piezoresistive element is formed in the diaphragm and is electrically connected with the circuit. The conductive layer is electrically connected with the diaphragm.

Abstract: An accelerometer includes a fixing unit and a movable unit. The fixing unit has a plurality of first electrode parts and a plurality of second electrode parts. The movable unit is connected with the fixing unit and includes a body having an opening, a plurality of third electrode parts and a plurality of fourth electrode parts. The third electrode parts are disposed at an outer side of the body with respect to the first electrode parts, respectively. The fourth electrode parts are disposed at the inner side of the body in the opening, and are disposed respectively with respect to the second electrode parts, respectively.

Abstract: The invention provides a method for manufacturing bearing assembly. The method comprises: coating a photoresist on an inner wall of a through hole of a bearing; inserting an ultraviolet lamp having a transparent groove pattern thereon into through hole and performing exposure process so as to photosensitize the photoresist corresponding to the groove pattern; removing the ultraviolet lamp and cleaning the photosensitized portion of the photoresist by developer; etching the inner wall not covered with the photoresist by an etchant or forming a deposited layer on the inner wall not covered with the photoresist; removing the photoresist reminding on the inner wall by a stripping agent so as to complete the method for manufacturing a dynamic bearing. The method is also proved to a surface of a shaft to manufacture the dynamic bearing.

Abstract: A semiconductor piezoresistive sensor, which is electrically connected with a circuit, includes a semiconductor base, at least one piezoresistive element and a conductive layer. The semiconductor base includes a diaphragm and a base. The base is disposed adjacent to and around the diaphragm. The piezoresistive element is formed in the diaphragm and is electrically connected with the circuit. The conductive layer is electrically connected with the diaphragm.