Patents by Inventor HENG DUAN

HENG DUAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Workpiece cleaning mechanism
    Patent number: 9718102
    Abstract: An air-sourced cleaning and deburring workpiece mechanism includes a fixed frame, a transfer assembly coupled to the fixed frame, and a cleaning assembly. The cleaning assembly includes a drive member, a slide member, and a first cleaning member. The drive member can drive the first cleaning member to move back and forth along a transfer direction of the transfer assembly, so that the first cleaning member can be applied to a workpiece.
    Type: Grant
    Filed: August 5, 2014
    Date of Patent: August 1, 2017
    Assignees: FU DING ELECTRONICAL TECHNOLOGY (JIASHAN) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: Heng Duan
  • Bonding device
    Patent number: 9397067
    Abstract: A bonding device includes a first feeding mechanism, a second feeding mechanism, a glue spraying mechanism positioned between the first feeding mechanism and the second feeding mechanism, and a bonding mechanism. The first feeding mechanism comprises a mounting frame and a transmission belt mounted on the mounting frame. The second feeding mechanism includes a support frame, a feeding member positioned on the support frame, a positioning plate mounted on the support frame and located below the feeding member, and a first driver connected to the positioning plate. The feeding member vertically defines at least one feeding groove. The positioning plate defines a matching groove matching with the first workpiece The bonding mechanism includes a second driver and a suction member connected to the second driver.
    Type: Grant
    Filed: December 16, 2013
    Date of Patent: July 19, 2016
    Assignees: FU DING ELECTRONICAL TECHNOLOGY (JIASHAN) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Ding-Xiang Wang, Heng Duan
  • WORKPIECE CLEANING MECHANISM
    Publication number: 20150040339
    Abstract: An air-sourced cleaning and deburring workpiece mechanism includes a fixed frame, a transfer assembly coupled to the fixed frame, and a cleaning assembly. The cleaning assembly includes a drive member, a slide member, and a first cleaning member. The drive member can drive the first cleaning member to move back and forth along a transfer direction of the transfer assembly, so that the first cleaning member can be applied to a workpiece.
    Type: Application
    Filed: August 5, 2014
    Publication date: February 12, 2015
    Inventor: HENG DUAN
  • BONDING DEVICE
    Publication number: 20140182789
    Abstract: A bonding device includes a first feeding mechanism, a second feeding mechanism, a glue spraying mechanism positioned between the first feeding mechanism and the second feeding mechanism, and a bonding mechanism. The first feeding mechanism comprises a mounting frame and a transmission belt mounted on the mounting frame. The second feeding mechanism includes a support frame, a feeding member positioned on the support frame, a positioning plate mounted on the support frame and located below the feeding member, and a first driver connected to the positioning plate. The feeding member vertically defines at least one feeding groove. The positioning plate defines a matching groove matching with the first workpiece The bonding mechanism includes a second driver and a suction member connected to the second driver.
    Type: Application
    Filed: December 16, 2013
    Publication date: July 3, 2014
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., FU DING ELECTRONICAL TECHNOLOGY (JIASHAN) CO.,LTD.
    Inventors: DING-XIANG WANG, HENG DUAN