Patents by Inventor Heng-Hsi WU

Heng-Hsi WU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Liquid optically clear adhesive lamination process control
    Patent number: 9302457
    Abstract: Methods and devices for using liquid optically clear adhesives (LOCAs) are described. A method for detecting uncured LOCA between a first substrate and a second substrate is described. In addition, an improved method for curing a laminated stack up having LOCA between a first substrate and a second substrate is described. The method includes a pre-curing method involving variable exposure of the LOCA. In addition, an improved light emitting diode (LED) unit assembly for exposing a laminated stack up to ultraviolet (UV) light during a pre-curing process is described. A method for testing the LED unit assembly prior to a pre-curing process is described.
    Type: Grant
    Filed: February 13, 2013
    Date of Patent: April 5, 2016
    Assignee: Apple Inc.
    Inventors: Silvio Grespan, Shih-Min Hsu, Heng-Hsi Wu, Kuo-Hua Sung, Cyrus Y. Liu
  • T-flex bonder
    Patent number: 9101083
    Abstract: A flexible circuit with multiple independent mounting points can be mounted (soldered) to substrates by independently (and concurrently) positioning mounting points in x, y, and theta (angular rotation) with vacuum chucks. In one embodiment the vacuum chucks can be guided by computer aided vision to locate and match fiducials on the flex circuit with fiducials on the substrate. In one embodiment, hot bars can be used in a subsequent bonding operation to secure an adhesive coupling between the flexible circuits and the substrate.
    Type: Grant
    Filed: September 10, 2012
    Date of Patent: August 4, 2015
    Assignee: APPLE INC.
    Inventors: Silvio Grespan, Shih-Min Hsu, Heng-Hsi Wu, Kuo-Hua Sung
  • LIQUID OPTICALLY CLEAR ADHESIVE LAMINATION PROCESS CONTROL
    Publication number: 20140071417
    Abstract: Methods and devices for using liquid optically clear adhesives (LOCAs) are described. A method for detecting uncured LOCA between a first substrate and a second substrate is described. In addition, an improved method for curing a laminated stack up having LOCA between a first substrate and a second substrate is described. The method includes a pre-curing method involving variable exposure of the LOCA. In addition, an improved light emitting diode (LED) unit assembly for exposing a laminated stack up to ultraviolet (UV) light during a pre-curing process is described. A method for testing the LED unit assembly prior to a pre-curing process is described.
    Type: Application
    Filed: February 13, 2013
    Publication date: March 13, 2014
    Applicant: Apple Inc.
    Inventors: Silvio GRESPAN, Shih-Min HSU, Heng-Hsi WU, Kuo-Hua SUNG, Cyrus Y. LIU
  • T-FLEX BONDER
    Publication number: 20140069567
    Abstract: A flexible circuit with multiple independent mounting points can be mounted (soldered) to substrates by independently (and concurrently) positioning mounting points in x, y, and theta (angular rotation) with vacuum chucks. In one embodiment the vacuum chucks can be guided by computer aided vision to locate and match fiducials on the flex circuit with fiducials on the substrate. In one embodiment, hot bars can be used in a subsequent bonding operation to secure an adhesive coupling between the flexible circuits and the substrate.
    Type: Application
    Filed: September 10, 2012
    Publication date: March 13, 2014
    Applicant: Apple Inc.
    Inventors: Silvio GRESPAN, Shih-Min HSU, Heng-Hsi WU, Kuo-Hua SUNG