Patents by Inventor Heng-i Lee
Heng-i Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11948999Abstract: A device includes a first semiconductor fin, a second semiconductor fin, a source/drain epitaxial structure, a semiconductive cap, and a contact. The first semiconductor fin and the second semiconductor fin are over a substrate. The source/drain epitaxial structure is connected to the first semiconductor fin and the second semiconductor fin. The source/drain epitaxial structure includes a first protruding portion and a second protruding portion aligned with the first semiconductor fin and the second semiconductor fin, respectively. The semiconductive cap is on and in contact with the first protruding portion and the second protruding portion. A top surface of the semiconductive cap is lower than a top surface of the first protruding portion of the source/drain epitaxial structure. The contact is electrically connected to the source/drain epitaxial structure and covers the semiconductive cap.Type: GrantFiled: July 26, 2022Date of Patent: April 2, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Yen-Ru Lee, Chii-Horng Li, Chien-I Kuo, Heng-Wen Ting, Jung-Chi Tai, Lilly Su, Yang-Tai Hsiao
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Patent number: 10720548Abstract: A manufacturing method of an LED package structure includes the steps as follows: providing an LED package structure assembly, which has a substrate layer, an LED chip set located on the substrate layer, and an encapsulating gel layer covering the LED chip set; taking a first blade to saw the LED package structure assembly from the encapsulating gel layer to the substrate layer until a plurality of sawing grooves are formed on the substrate layer; and taking a second blade to saw the LED package structure assembly along each sawing groove until the second blade passes through the substrate layer, thereby forming a plurality of LED package structures separated from each other. Wherein a hardness of the first blade is greater than that of the second blade, and a thickness of the second blade is less than that of the first blade.Type: GrantFiled: October 7, 2019Date of Patent: July 21, 2020Assignees: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATIONInventors: Han-Hsing Peng, Heng-I Lee, Kuo-Ming Chiu, Meng-Sung Chou
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Publication number: 20200035856Abstract: A manufacturing method of an LED package structure includes the steps as follows: providing an LED package structure assembly, which has a substrate layer, an LED chip set located on the substrate layer, and an encapsulating gel layer covering the LED chip set; taking a first blade to saw the LED package structure assembly from the encapsulating gel layer to the substrate layer until a plurality of sawing grooves are formed on the substrate layer; and taking a second blade to saw the LED package structure assembly along each sawing groove until the second blade passes through the substrate layer, thereby forming a plurality of LED package structures separated from each other. Wherein a hardness of the first blade is greater than that of the second blade, and a thickness of the second blade is less than that of the first blade.Type: ApplicationFiled: October 7, 2019Publication date: January 30, 2020Inventors: HAN-HSING PENG, HENG-I LEE, KUO-MING CHIU, MENG-SUNG CHOU
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Patent number: 10490693Abstract: A manufacturing method of an LED package structure includes the steps as follows: providing an LED package structure assembly, which has a substrate layer, an LED chip set located on the substrate layer, and an encapsulating gel layer covering the LED chip set; taking a first blade to saw the LED package structure assembly from the encapsulating gel layer to the substrate layer until a plurality of sawing grooves are formed on the substrate layer; and taking a second blade to saw the LED package structure assembly along each sawing groove until the second blade passes through the substrate layer, thereby forming a plurality of LED package structures separated from each other. Wherein a hardness of the first blade is greater than that of the second blade, and a thickness of the second blade is less than that of the first blade.Type: GrantFiled: May 31, 2016Date of Patent: November 26, 2019Assignees: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATIONInventors: Han-Hsing Peng, Heng-I Lee, Kuo-Ming Chiu, Meng-Sung Chou
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Patent number: 9865782Abstract: A lens of an LED package structure includes a square-shaped base layer, a first light-guiding portion integrally connected to the base layer, a second light-guiding portion taperedly extended from the first light-guiding portion. The second light-guiding portion has an apex located away from the first light-guiding portion. The lens includes four side curved surfaces and four boundary curved surfaces connected to the apex. Four first projecting regions are defined by orthogonally projecting the four boundary curved surfaces onto the base layer, and the four first projecting regions are arranged on two diagonals of the base layer. Any two adjacent boundary curved surfaces are provided with one of the side curved surfaces there-between. Each boundary curved surface has a first radius of curvature (R1), a portion of each side curved surface arranged on the second light-guiding portion has a second radius of curvature (R2), wherein R1/R2=M?{square root over (2)} and M=0.8˜1.2.Type: GrantFiled: September 16, 2016Date of Patent: January 9, 2018Assignees: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATIONInventors: Kuo-Ming Chiu, Yu-Yu Chang, Han-Hsing Peng, Heng-I Lee, Shih-Chiang Yen
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Publication number: 20170352790Abstract: A lens of an LED package structure includes a square-shaped base layer, a first light-guiding portion integrally connected to the base layer, a second light-guiding portion taperedly extended from the first light-guiding portion. The second light-guiding portion has an apex located away from the first light-guiding portion. The lens includes four side curved surfaces and four boundary curved surfaces connected to the apex. Four first projecting regions are defined by orthogonally projecting the four boundary curved surfaces onto the base layer, and the four first projecting regions are arranged on two diagonals of the base layer. Any two adjacent boundary curved surfaces are provided with one of the side curved surfaces there-between. Each boundary curved surface has a first radius of curvature (R1), a portion of each side curved surface arranged on the second light-guiding portion has a second radius of curvature (R2), wherein R1/R2=M?{square root over ( )}2 and M=0.8˜1.2.Type: ApplicationFiled: September 16, 2016Publication date: December 7, 2017Inventors: KUO-MING CHIU, YU-YU CHANG, HAN-HSING PENG, HENG-I LEE, SHIH-CHIANG YEN
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Publication number: 20170336548Abstract: A method for fabricating a light emitting module that generates ultrabroadband near-infrared light and increasing the output power. The light emitting module includes a linearly polarized laser pump for generating a visible laser, a half-wave plate for adjusting the polarization orientation of the visible laser, and a crystal optical fiber disposed on the output light path of the half-wave plate. The core of the crystal optical fiber is made of forsterite (Mg2SiO4) doped with Cr3+ and Cr4+ ions. The doping process includes: depositing a chromium oxide layer on the lateral surface of the core and driving the chromium atoms into the core by high temperature diffusion; coupling the visible laser into the core to produce a spontaneous emission with wavelengths from 750 to 1350 nm continuously. Particularly, the continuous spectrum is adjustable by changing the polarization orientation of the visible laser via the half-wave plate.Type: ApplicationFiled: August 7, 2017Publication date: November 23, 2017Applicant: National Taiwan University of Science and TechnologyInventors: Ping-hui YEH, Heng-i LEE
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Publication number: 20170092804Abstract: A manufacturing method of an LED package structure includes the steps as follows: providing an LED package structure assembly, which has a substrate layer, an LED chip set located on the substrate layer, and an encapsulating gel layer covering the LED chip set; taking a first blade to saw the LED package structure assembly from the encapsulating gel layer to the substrate layer until a plurality of sawing grooves are formed on the substrate layer; and taking a second blade to saw the LED package structure assembly along each sawing groove until the second blade passes through the substrate layer, thereby forming a plurality of LED package structures separated from each other. Wherein a hardness of the first blade is greater than that of the second blade, and a thickness of the second blade is less than that of the first blade.Type: ApplicationFiled: May 31, 2016Publication date: March 30, 2017Inventors: HAN-HSING PENG, HENG-I LEE, KUO-MING CHIU, MENG-SUNG CHOU
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Publication number: 20160170117Abstract: The present invention discloses a light emitting module and a method for generating ultrabroadband near-infrared light and increasing the bandwidth and output power. The light emitting module includes a linearly polarized laser pump for generating a visible laser, a half-wave plate for adjusting the to polarization orientation of the visible laser, and a crystal optical fiber disposed on the output light path of the half-wave plate. The core of the crystal optical fiber is made of forsterite (Mg2SiO4) doped with Cr3+ and Cr4+ ions. The doping process comprises: depositing a chromium oxide layer on the lateral surface of the core and driving the chromium atoms into the core by high temperature diffusion; coupling the visible laser into the core to produce a spontaneous emission with wavelengths from 750 to 1350 nm continuously. Particularly, the continuous spectrum is adjustable by changing the polarization orientation of the visible laser via the half-wave plate.Type: ApplicationFiled: July 14, 2015Publication date: June 16, 2016Applicant: National Taiwan University of Science and TechnologyInventors: Ping-hui Yeh, Heng-i Lee