Patents by Inventor Heng Kiat

Heng Kiat has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9494562
    Abstract: Methods and apparatus for non-destructive testing of a composite structure utilizing sonic or ultrasonic waves. In response to a wideband chirp wave sonic excitation signal transmitted from a probe to the composite structure, a probe signal received is correlated with a library of predetermined probe signals and a graphical representation of defects detected is generated. The graphical representation provides detailed information on defect type, defect location and defect shape.
    Type: Grant
    Filed: May 27, 2011
    Date of Patent: November 15, 2016
    Assignee: Agency for Science, Technology and Research
    Inventors: Wei Lin, Lay Siong Goh, Lye Seng Wong, Heng Kiat Jonathan Hey, Ricky Riyadi Chan, Roman Britner
  • Patent number: 9335040
    Abstract: A modular light source comprising a base unit, LED Printed Circuit Assembly comprising a plurality of LEDs, temperature sensor, Power Supply Printed Circuit Assembly, and optics portion wherein the light emitted has a normal distribution and the flux at 55° off normal exceeds 50% of the flux at 0°.
    Type: Grant
    Filed: December 18, 2015
    Date of Patent: May 10, 2016
    Assignee: OptoElectronix, Inc.
    Inventors: Yap Peng Hooi, Kow Chuong Chuan, Kok Chin Vooi, Jebby Foo Heng Kiat
  • Patent number: 9249966
    Abstract: A solid state lighting apparatus comprising a base unit, LED Printed Circuit Assembly comprising a plurality of LEDs, conductive enhancing structure, temperature sensor, Power Supply Printed Circuit Assembly, and optics portion comprising at least one of a lens, holding device, mirror, reflector and/or other optical components. A solid state lighting apparatus is adapted for existing luminaire shapes and is applicable for retrofitting installed luminaires.
    Type: Grant
    Filed: November 11, 2013
    Date of Patent: February 2, 2016
    Assignee: OptoElectronix, Inc.
    Inventors: Yap Peng Hooi, Kow Chuong Chuan, Kok Chin Vooi, Jebby Foo Heng Kiat
  • Patent number: 8814390
    Abstract: A LED based lighting apparatus comprising a low cost stamped frame comprising structural elements, LED attach region at a predetermined tilt angle and heat sink region enabling a lamp with uniform lighting distribution is disclosed.
    Type: Grant
    Filed: May 2, 2013
    Date of Patent: August 26, 2014
    Assignee: OptoElectronix, Inc.
    Inventors: Kow Chuong Chuan, Yap Peng Hooi, Kok Chin Vooi, Jebby Foo Heng Kiat
  • Publication number: 20130338941
    Abstract: Methods and apparatus for non-destructive testing of a composite structure utilizing sonic or ultrasonic waves. In response to a wideband chirp wave sonic excitation signal transmitted from a probe to the composite structure, a probe signal received is correlated with a library of predetermined probe signals and a graphical representation of defects detected is generated. The graphical representation provides detailed information on defect type, defect location and defect shape.
    Type: Application
    Filed: May 27, 2011
    Publication date: December 19, 2013
    Applicant: AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH
    Inventors: Wei Lin, Lay Siong Goh, Lye Seng Wong, Heng Kiat Jonathan Hey, Ricky Riyadi Chan, Roman Britner
  • Publication number: 20050142565
    Abstract: The present invention provides for a novel system of extracting and purifying nucleic acids (DNA, RNA, etc.) from cellular material like blood. Such a system of extraction and purification relies on novel monolithic microfluidic devices and methods of using these devices. Such devices comprise numerous components, monolithically-incorporated on an single chip, and further comprising novel nucleic acid binding materials. The present invention is also directed to method of preparing such novel nucleic binding materials.
    Type: Application
    Filed: April 5, 2004
    Publication date: June 30, 2005
    Applicants: Agency for Science, Technology and Research, National University of Singapore
    Inventors: Victor Samper, Ji Hongmiao, Chen Yu, Heng Kiat, Lim Meng