Patents by Inventor Heng-Kit Too

Heng-Kit Too has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200253041
    Abstract: An example system for maintaining the shape of a circuit board includes metal balls that are configured not to collapse in whole or part in response to a force below a predefined force and a temperature below a predefined temperature. The metal balls are configured to support a substrate and are part of electrical connections between the substrate and a circuit board. The system includes a fixture configured to apply force to the substrate while the substrate is subjected to the temperature. The fixture is configured to distribute the force across a surface of the substrate that is not in contact with the metal balls such that the force applied by the fixture and the support of the substrate by the metal balls maintains a shape of the substrate at the temperature.
    Type: Application
    Filed: February 26, 2019
    Publication date: August 6, 2020
    Inventors: Heng-Kit Too, Xue-Bin Tan, Max Zhang, Rocky Tao, Brian Brecht, Iris Weng, Hale Deng
  • Publication number: 20080084675
    Abstract: An apparatus is for holding a circuit board having components attached to a top surface and to a bottom surface of the circuit board. The apparatus includes a structure having at least two sides, each of which has a ledge that protrudes from a side of the structure for supporting the circuit board. The ledge has a height that exceeds a distance between the circuit board and a bottom of a first component mounted on the bottom surface of the circuit board such that structure suspends the first component above a surface holding the structure.
    Type: Application
    Filed: October 5, 2006
    Publication date: April 10, 2008
    Inventors: Muhammad H. Amirali, Lee C. Gumprecht, The Pham, Frits E. Kitzmann, Robert K. Coleman, Heng-Kit Too
  • Patent number: 6550662
    Abstract: A tool for applying solder paste to leadless chips has recesses adapted to receive the leadless chips. Apertures in each recess are arranged according to pads on the leadless chip. With the chips held in the recesses, solder paste is applied in the apertures.
    Type: Grant
    Filed: April 3, 2001
    Date of Patent: April 22, 2003
    Assignee: Kyocera Wireless Corporation
    Inventor: Heng-Kit Too
  • Publication number: 20020139832
    Abstract: A tool for applying solder paste to leadless chips has recesses adapted to receive the leadless chips. Apertures in each recess are arranged according to pads on the leadless chip. With the chips held in the recesses, solder paste is applied in the apertures.
    Type: Application
    Filed: April 3, 2001
    Publication date: October 3, 2002
    Inventor: Heng-Kit Too