Abstract: An apparatus for picking and placing or for picking and transferring or for picking, placing and pressing semiconductor components (10) is disclosed. The apparatus (10) comprises a motor for generating power to rotate a turret (6) which holds a plurality of pick up heads (7), a plurality of pressers (8), wherein each of said pressers (8) is a voice coil assembly (3) which consist of voice coil actuator assemblies (31), at least one stationary frame (1, 2) to secure said voice coil assemblies (3) and a controller means to control the direction and magnitude of displacement of said voice coil actuator assemblies (31). When current flows into voice coil in said voice coil actuator assembly (31), electromagnetic force is generated in vertical direction, forcing said actuators to press said pick up heads (7) located directly below said actuators at a particular moment, which in turn reaches to and press on wafers or semiconductor components located below said pick up heads.

Abstract: The present invention relates to a device (1) and method for conveying and flipping a component (10) for use in conjunction with a rotary turret module (30). The device (1) includes at least a pair of spaced apart flipping arms, a first and second flipping arms (100 and 300) mounted on a platform (500). Each of the flipping arms (100, 300) is provided with one nozzle (110, 310) having one end (111) configured to pick the component (10) and another end (311) fixedly mounted on a shaft (130, 330) supported on the flipping arm (100, 300) and is operatively connected to a rotary actuating means (150, 350). The rotary actuating means (150, 350) is adapted to be capable of affecting a rotational motion of the shaft (130, 330), thereby rotating the nozzles (110, 310) in a counter direction by substantially 90 degrees. The device is also provided with a linear actuating means (400) suitably mounted on the platform (500).

Abstract: The invention discloses a semiconductor components delivery system associated with a turret type testing apparatus for testing integrity and functionality of semiconductor components wherein at least two input feeders loadable with semiconductor components to be vision checked, tested and/or packed are provided. The delivery system is also provided with multiple output means such as a tube, a tape or a bin or a combination thereof for semiconductor components determined to be non defective.

Abstract: An apparatus for picking and placing or for picking and transferring or for picking, placing and pressing semiconductor components (10) is disclosed. The apparatus (10) comprises a motor for generating power to rotate a turret (6) which holds a plurality of pick up heads (7), a plurality of pressers (8), wherein each of said pressers (8) is a voice coil assembly (3) which consist of voice coil actuator assemblies (31), at least one stationary frame (1, 2) to secure said voice coil assemblies (3) and a controller means to control the direction and magnitude of displacement of said voice coil actuator assemblies (31). When current flows into voice coil in said voice coil actuator assembly (31), electromagnetic force is generated in vertical direction, forcing said actuators to press said pick up heads (7) located directly below said actuators at a particular moment, which in turn reaches to and press on wafers or semiconductor components located below said pick up heads.

Abstract: The invention discloses a semiconductor components delivery system associated with a turret type testing apparatus for testing integrity and functionality of semiconductor components wherein at least two input feeders loadable with semiconductor components to be vision checked, tested and/or packed are provided. The delivery system is also provided with multiple output means such as a tube, a tape or a bin or a combination thereof for semiconductor components determined to be non defective.