Abstract: An information handling system may include a processor, a memory communicatively coupled to the processor, first and second information handling resources, an air mover configured to provide airflow to the first and second information handling resources, a baffle configured to apportion the airflow between the first and second information handling resources, and a first structural element coupled to the baffle. The first structural element may be proximate to the first information handling resource and may include a shape-memory alloy (SMA). In response to an increase in temperature associated with the first information handling resource, the SMA may be operable to change a physical dimension of the first structural element such that the baffle is moved from a first orientation to a second orientation, the second orientation corresponding to a higher airflow to the first information handling resource.

Abstract: The present invention relates to a heat sink. The heat sink includes a casting, a block, heat pipes, and fins. The block is placed in a cavity of the casting. The heat pipes are composed of a straight heat pipe and two second degree curve heat pipes. The heat pipes are coupled to the casting. The fins are also coupled to the casting. The block absorbs heat from a heat source and transfer to the fins via heat pipes for heat dissipation.

Abstract: A heat dissipation device with heat pipes is described. The heat dissipation device includes at least one U-shaped heat pipe, a plurality of heat fins, and a heat sink base. A middle portion of the U-shaped heat pipe is coupled to the heat sink base to receive thermal energy and transmit the same to two arm portions of the U-shaped heat pipe so as to improve the heat dissipation efficiency. A fixing plate is further utilized to fix the U-shaped heat pipe onto the heat sink base. The fixing plate further absorbs the thermal energy and the thermal energy is transmitted from the middle portion of the U-shaped heat pipe to the two arm portions of the U-shaped heat pipe and then to the heat fins. Therefore, the heat dissipation device can increase the heat dissipation efficiency while reducing the space it occupies in an electrical device.