Abstract: The present invention discloses a conductive line repairing method, which at least includes the following steps: a placing step, in which an object having at least one line breaking site is placed on a platform unit of a jet-coating module; a jetting step, in which the jet-coating module is operated to jet and coat a conductive material on the line breaking site; and a solidifying step, in which a solidifying module is operated to have the conductive material solidified, wherein the conductive material, after the solidification, makes the line breaking site conducting. In present invention, the conductive material is jetted and coated on the line breaking site of the object and then solidified to repair a circuit having the line breaking site and to resume the function of electrical conduction thereof to thereby reduce rejected products and restore production yield, achieving an effect of environmental protection.

Abstract: An embodiment photonic device may include a first terminal including silicon and a second terminal including polysilicon. The first terminal may be configured as a first three-dimensional structure extending along a first direction and having a first U-shaped portion in a first cross-sectional plane perpendicular to the first direction. Similarly, the second terminal may be configured as a second three-dimensional structure extending along the first direction and having a second U-shaped portion in the first cross-sectional plane. The photonic device may further include a capacitor dielectric layer disposed between the first terminal and the second terminal and a cladding dielectric layer surrounding the first terminal and the second terminal. The first U-shaped portion and the second U-shaped portion may be arranged in an interlocking configuration having an overlapping region that is configured as an optical transmission line in which the first direction is an optical propagation direction.

Abstract: A method for performing multi-token prediction by an apparatus includes receiving, from an artificial intelligence (AI) assistance device, a request for an output token sequence that is subsequent to an input token sequence indicated by the request, predicting, by a trained machine learning model, a plurality of candidate output tokens, estimating joint probability distributions of one or more combinations of the plurality of candidate output tokens, calculating joint probabilities of the one or more combinations by masking the joint probability distributions with a co-occurrence weighted mask, determining, based on the joint probabilities, whether to reduce the number of candidate output tokens included in each combination of the one or more combinations, identifying, based on the joint probabilities, a combination of the one or more combinations as the output token sequence, and outputting, to the AI assistance device, a response to the request, the response comprising the output token sequence.

Abstract: An optical beam splitter includes a multi-stage nested network of waveguide bifurcation branches, which includes: first-stage waveguide bifurcation branches each including a pair of first-stage waveguide segments, and second-stage waveguide bifurcation branches each including a pair of second-stage waveguide segments. Each pair of first-stage waveguide segments includes a first common end and a pair of first split ends and a pair of first interconnection portions. Each first common end points toward a first widthwise direction. Each pair of second-stage waveguide segments includes a second common end and a pair of second split ends and a pair of second interconnection portions. Each second common end and each second split end of the optical beam splitter point toward a second widthwise direction which is an opposite direction of the first widthwise direction.

Abstract: A light emitting panel includes a circuit substrate, a plurality of first light emitting components, a plurality of second light emitting components, and a plurality of third light emitting components. The circuit substrate has a plurality of main pixel areas. Each main pixel area is divided into a first subpixel area, a second subpixel area, and a third subpixel area. The first light emitting components, the second light emitting components and the third light emitting components are located in the first subpixel areas, the second subpixel areas and the third subpixel areas respectively. The first light emitting components in two adjacent first subpixel areas are electrically connected in series. The size of each of the first light emitting components is larger than the size of each of the second light emitting components and the third light emitting components.

Abstract: A USB IC, an operation method thereof, and a USB device are provided. The USB IC is disposed in the USB device and includes a sideband use interface circuit coupled to a sideband use pin of a USB connector of the USB device, and a control circuit. The control circuit is coupled to the sideband use interface circuit and reports a first adapter configuration to a USB host via the sideband use interface circuit so that the USB host enumerates the USB device. The control circuit observes a behavior of the USB host to the USB device after the USB device is enumerated. The control circuit determines whether the first adapter configuration is suitable for a connection manager of the USB host according to the behavior. If not, the control circuit reports a second adapter configuration to the USB host so that the USB host re-enumerates the USB device.

Abstract: An optical device and method of manufacture is presented. In embodiments a method includes forming a first layer of optical material, patterning the first layer into a stair-step pattern, depositing a dielectric material onto the stair-step pattern, and forming a second layer of optical material over the dielectric material and at least partially within the stair-step pattern.

Abstract: An optical device and methods of manufacturing such optical devices are presented. In embodiments the optical device is a tunable beam splitter which is made by forming a first dopant region over a substrate, the first dopant region comprising a first waveguide and a second waveguide, depositing a cladding material over the first waveguide and the second waveguide, and forming a second dopant region overlying the first waveguide and the second waveguide, wherein the forming the second dopant region comprises forming a first region extending over both the first waveguide and the second waveguide, the first region having a constant concentration of a first dopant.

Abstract: A light emitting device including an active layer, a first semiconductor layer, a first contact layer, and a first current limiting layer is provided. The first semiconductor layer is disposed at a first side of the active layer. The first contact layer is disposed at a side of the first semiconductor layer away from the active layer. The first current limiting layer is disposed between the first contact layer and the active layer, and is provided with a first non-oxidizing region and a first oxidizing region located around the first non-oxidizing region. The first current limiting layer has a first surface facing the active layer and a second surface away from the first surface. The first oxidizing region is extended from the first surface to the second surface, and an oxygen content of the first oxidizing region is greater than an oxygen content of the first non-oxidizing region.

Abstract: A time-to-digital converter apparatus and a converting method thereof are provided. An output signal of a first ring oscillator circuit is counted to generate a first digital code. An output signal of a second ring oscillator circuit is counted to generate a second digital code. A corresponding third digital code is generated according to a time point of phase coincidence between one of outputs of a plurality of first delay stages of the first ring oscillator circuit and one of outputs of a plurality of second delay stages of the second ring oscillator circuit.

Abstract: An antenna device includes a radio frequency die, a molding compound, a feeding line, and a radiating element. The molding compound laterally surrounds the radio frequency die. The feeding line is over the radio frequency die. The radiating element is over the feeding line and electrically coupled to the RF die.

Abstract: A surge protection module comprises an upper cover, a lower cover, a printed circuit board assembly (PCBA) and a flame-retardant filler. The lower cover is configured for connecting with the upper cover, and for forming an accommodation space together with the upper cover. At least one through hole is formed at the junction of the lower cover and the upper cover. The PCBA has a plurality of copper traces, and is equipped with at least one surge protection device (SPD). The PCBA further has a plurality of welding structures, and the welding structures are electrically coupled to the SPDs through the copper traces. The PCBA is disposed in the accommodation space, and a part of the PCBA passes through the at least one through hole for exposing the welding structures. The flame-retardant filler is filled in the gap of the accommodation space.

Abstract: A catheter and a method of making a transition structure of a catheter. The catheter includes at least one polymeric layer including at least one transition structure. Each transition structure is a tubular structure including a homogeneous material zone and a heterogeneous material zone. Any continuous closed region of the homogeneous material zone is referred to as a first sub-region and any continuous closed region of the heterogeneous material zone as a second sub-region, and any axial section of the transition structure includes at least one second sub-region. A leading section and/or a trailing section of the transition structure include(s) at least one first sub-region and at least one second sub-region. The catheter has smooth transitioning of flexibility/stiffness and mechanical properties, which can enhance the catheter's delivery performance.

Abstract: An antenna module includes a metal cover, a substrate, a first radiating element and a second radiating element. The metal cover has a slot. The substrate is disposed corresponding to the slot. The first radiating element is disposed on the substrate, the first radiating element includes an excited section and a first radiating section connected in sequence, and the excited section has a feeding point. The second radiating element is disposed on the substrate, the second radiating element includes the excited section and a second radiating section connected in sequence, and the excited section is located between the first radiating section and the second radiating section. A length of the first radiating section is greater than a length of the second radiating section, the first radiating element is used to excite a first resonant frequency, and the second radiating element is used to excite a second resonant frequency.

Abstract: A ground point fixing device for a power supply module includes an engaging part and a fastening part. The engaging part includes an engaging body, a joining portion and an engaging portion. The engagement body has a body outer diameter and a body surface larger than a grounding hole on a power supply module circuit board. The joining portion is disposed on the body surface and has a joining portion outer diameter smaller than the grounding hole. The engagement portion is disposed on the body surface and around an outer circumference of the joining portion. The joining portion is passed through the grounding hole to be connected to the fastening part, so that the engagement portion of the engaging part is engaged in the grounding hole, and the fastening part and the engagement body of the engaging part are respectively fixed on an upper surface and a lower surface of the circuit board.

Abstract: An antenna device includes a radio frequency (RF) die, a first dielectric layer, a feeding line, a ground line, a second dielectric layer, and a radiating element. The first dielectric layer is over the RF die. The feeding line is in the first dielectric layer and is connected to the RF die. The ground line is in the first dielectric layer and is spaced apart from the feeding line. The second dielectric layer covers the first dielectric layer. The radiating element is over the second dielectric layer and is not in physically contact with the feeding line.

Abstract: A time-to-digital converter apparatus and a converting method thereof are provided. An output signal of a first ring oscillator circuit is counted to generate a first digital code. An output signal of a second ring oscillator circuit is counted to generate a second digital code. A corresponding third digital code is generated according to a time point of phase coincidence between one of outputs of a plurality of first delay stages of the first ring oscillator circuit and one of outputs of a plurality of second delay stages of the second ring oscillator circuit.

Abstract: A pixel structure, including a first semiconductor layer, a first active layer, a second semiconductor layer, a second active layer, a third semiconductor layer, and an electrode layer that are sequentially stacked, is provided. A first portion of the electrode layer is electrically connected to a first portion of the first semiconductor layer through a first opening of a first portion of the third semiconductor layer, a first opening of a first portion of the second active layer, a first opening of a first portion of the second semiconductor layer, and a first opening of a first portion of the first active layer. A second portion of the electrode layer is electrically connected to a second portion of the second semiconductor layer through a second opening of a second portion of the third semiconductor layer and a second opening of a second portion of the second active layer.

Abstract: An electronic device including a first body, a second body, and at least one cavity antenna module is provided. The second body has a pivot side and a plurality of non-pivot sides, and the pivot side is connected pivotally to the first body. The cavity antenna module includes a metal cavity body and a first antenna structure. The metal cavity body is disposed in the second body and has an opening. A distance between one of the non-pivot sides and the metal cavity body is smaller than a distance between the pivot side and the metal cavity body, and the opening faces the one of the non-pivot sides. The first antenna structure is disposed in the opening of the metal cavity body, and the first antenna structure includes a feeding portion, a radiating portion, and a ground portion connected with one another.

Abstract: A light-emitting device includes a carrier, a reflection layer, a common electrode and a first semiconductor stack. The carrier has a light-emitting region, an electrical connection region and a trench, which separates the light-emitting region from the electrical connection region. The reflection layer is disposed on a sidewall of the trench. The common electrode is disposed in the electrical connection region. The first semiconductor stack is disposed in the light-emitting region, wherein a first type semiconductor layer of the first semiconductor stack is electrically connected to the common electrode. A light-emitting apparatus including the light-emitting device is also provided.